Fundamentals of Electromagnetics with Engineering Applications

Wentworth, Stuart M.

ISBN 10: 0470105755 / ISBN 13: 9780470105757

Editore: Wiley, 2006

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Titolo: Fundamentals of Electromagnetics with ...

Casa editrice: Wiley

Data di pubblicazione: 2006

Legatura: hardcover

Condizione: Good

Edizione: 1st Edition.

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Riassunto:

The revolution in wireless communications calls for a new focus in the electrical engineering curriculum. Stuart M. Wentworth fills that need with his new Fundamentals of Electromagnetics with Engineering Applications. Incorporating the popular MATLAB program throughout, it features practical applications for wireless systems, transmission lines, waveguides (including optical fiber), antennas, and microwave systems. Designed for use in a one- or two-semester sequence at the junior and senior level, it offers students both detailed theoretical grounding and hands-on experience in harmony with today’s professional practice.

Part 1 of the text features a classical organization of electromagnetic fundamentals, beginning with electrostatics and basic vectors. Once the students understand simple vectors, coordinate systems and electrostatic fields, they are ready to use more complicated vector algebra as they learn about magnetostatics. Then, time variation is introduced as students learn about dynamic fields and plane waves. Electromagnetic applications are covered in the second part of the text, with emphasis on those applications related to wireless communications. Part 2 covers transmission lines, waveguide (including optical fiber), antennas, electromagnetic interference, and a brief treatment of microwave engineering.

Informazioni sull?autore:

Stuart M. Wentworth received his B.S degree in Chemical Engineering from Auburn University, Alabama, in 1982 and his M.S. in 1987 and Ph.D in 1990 degrees in Electrical Engineering from the University of Texas at Austin. He has been a member of the Electrical & Computer Engineering faculty at Auburn University, Alabama since 1990. Dr. Wentworth's research has focused on the high frequency characterization of materials used for electronics packaging.