gao hong wei zhang xing (4 risultati)

paperback. Condizione: New. Paperback. Pub Date :2011-12-01 Pages: 174 Language: Japanese Publisher: Dalian University Press. Japanese Listening Course (Advanced ) applied the new century Japanese class higher education planning materials by the perennial Japanese Listening engaged in teaching and research Japanese teachers to study in Japan and China have for years engaged in Japanese professional experience and teaching faculty co-authored. The editors of Japanese professional syllabus and Japanese Language Proficienc.

paperback. Condizione: New. Paperback. Pub Date: 2015-09-01 Pages: 268 Language: Chinese Publisher: Xi'an University of Electronic Science and Technology Press electronics manufacturing including wafer fabrication. chip package substrate and the film circuit manufacturing. electronics assembly and other major processes. Electronics manufacturing equipment and technology. a book about the major electronics manufacturing process. the type of equipment used in the process and its technical principles. First select the elec.

paperback. Condizione: New. Paperback.Pub Date:2018-04-01 Pages:42 Language:Chinese Publisher:Chemical Industry Press The New Experience Science Book SeriesThe Mystery of the Natural Museum: Magical Africa ??starts from the children's interest. through 80 children's feelings Interest issues. illustrated and illustrated scientific knowledge about dinosaurs. covering all kinds of interesting knowledge about dinosaurs. including the evolution. classification. attributes. characteristics. reproduction. physiological structu.

paperback. Condizione: New. Paperback. Pub Date: 2017-06-01 Language: Chinese Publisher: University Publishing house The basic course of electronic encapsulation technology and equipment technology core curriculum planning textbook for electronic packaging technology. first of all. it outlines the front and rear end manufacturing of semiconductor chips. Chip packaging and electronic product surface assembly process. and then the main process for electronic packaging .