Lingua: Inglese
Editore: World Scientific Publishing Comp, 2003
ISBN 10: 9812386076 ISBN 13: 9789812386076
Da: suffolkbooks, Center moriches, NY, U.S.A.
hardcover. Condizione: Very Good. Fast Shipping - Safe and Secure 7 days a week!
Condizione: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
Da: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.
Condizione: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
Editore: Springer
ISBN 10: 8120090004 ISBN 13: 9788120090002
Da: Books in my Basket, New Delhi, India
EUR 15,81
Quantità: 1 disponibili
Aggiungi al carrelloHardcover. Condizione: New. ISBN: 9783211728604.
EUR 46,36
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
Paperback or Softback. Condizione: New. Miniaturized Transistors. Book.
Condizione: New. Brand New Original US Edition. Customer service! Satisfaction Guaranteed.
EUR 48,88
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: As New. Unread book in perfect condition.
Da: Basi6 International, Irving, TX, U.S.A.
Condizione: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
Da: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.
Condizione: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
Condizione: New. Brand New Original US Edition. Customer service! Satisfaction Guaranteed.
EUR 49,28
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. In.
EUR 48,17
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
EUR 55,35
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: As New. Unread book in perfect condition.
Da: Basi6 International, Irving, TX, U.S.A.
Condizione: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
Da: UK BOOKS STORE, London, LONDO, Regno Unito
EUR 81,71
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. Brand New! Fast Delivery This is an International Edition and ship within 24-48 hours. Deliver by FedEx and Dhl, & Aramex, UPS, & USPS and we do accept APO and PO BOX Addresses. Order can be delivered worldwide within 7-12 days and we do have flat rate for up to 2LB. Extra shipping charges will be requested if the Book weight is more than 5 LB. This Item May be shipped from India, United states & United Kingdom. Depending on your location and availability.
EUR 94,51
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. In.
EUR 94,43
Quantità: 10 disponibili
Aggiungi al carrelloPF. Condizione: New.
EUR 89,03
Quantità: 1 disponibili
Aggiungi al carrellopaperback. Condizione: New. New. book.
Condizione: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
Da: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.
Condizione: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
Condizione: New. Brand New Original US Edition. Customer service! Satisfaction Guaranteed.
Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 111,94
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. In.
Da: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Irlanda
EUR 121,63
Quantità: 15 disponibili
Aggiungi al carrelloCondizione: New.
Da: Buchpark, Trebbin, Germania
EUR 32,95
Quantità: 1 disponibili
Aggiungi al carrelloCondizione: Sehr gut. Zustand: Sehr gut | Seiten: 480 | Sprache: Englisch | Produktart: Bücher | The "Twelfth International Conference on Simulation of Semiconductor Processes and Devices" (SISPAD 2007) continues a long series of conferences and is held in September 2007 at the TU Wien, Vienna, Austria. The conference is the leading forum for Technology Computer-Aided Design (TCAD) held alternatingly in the United States, Japan, and Europe. The first SISPAD conference took place in Tokyo in 1996 as the successor to three preceding conferences NUPAD, VPAD, and SISDEP. With its longstanding history SISPAD provides a world-wide forum for the presenta tion and discussion of outstanding recent advances and developments in the field of numerical process and device simulation. Driven by the ongoing miniaturization in semiconductor fabrication technology, the variety of topics discussed at this meeting reflects the ever-growing complexity of the subject. Apart from the classic topics like process, device, and interconnect simulation, mesh generation, a broad spec trum of numerical issues, and compact modeling, new simulation approaches like atomistic and first-principles methods have emerged as important fields of research and are currently making their way into standard TCAD suites.
Da: Buchpark, Trebbin, Germania
EUR 32,95
Quantità: 1 disponibili
Aggiungi al carrelloCondizione: Sehr gut. Zustand: Sehr gut | Seiten: 480 | Sprache: Englisch | Produktart: Bücher | The "Twelfth International Conference on Simulation of Semiconductor Processes and Devices" (SISPAD 2007) continues a long series of conferences and is held in September 2007 at the TU Wien, Vienna, Austria. The conference is the leading forum for Technology Computer-Aided Design (TCAD) held alternatingly in the United States, Japan, and Europe. The first SISPAD conference took place in Tokyo in 1996 as the successor to three preceding conferences NUPAD, VPAD, and SISDEP. With its longstanding history SISPAD provides a world-wide forum for the presenta tion and discussion of outstanding recent advances and developments in the field of numerical process and device simulation. Driven by the ongoing miniaturization in semiconductor fabrication technology, the variety of topics discussed at this meeting reflects the ever-growing complexity of the subject. Apart from the classic topics like process, device, and interconnect simulation, mesh generation, a broad spec trum of numerical issues, and compact modeling, new simulation approaches like atomistic and first-principles methods have emerged as important fields of research and are currently making their way into standard TCAD suites.
EUR 76,30
Quantità: 5 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. Hot Carrier Degradation in Semiconductor Devices | Tibor Grasser | Taschenbuch | x | Englisch | 2016 | Springer | EAN 9783319359120 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
EUR 135,68
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. In.
EUR 42,57
Quantità: 3 disponibili
Aggiungi al carrelloCondizione: Hervorragend. Zustand: Hervorragend | Sprache: Englisch | Produktart: Bücher | Keine Beschreibung verfügbar.
Lingua: Inglese
Editore: Springer International Publishing, Springer Nature Switzerland, 2016
ISBN 10: 3319359126 ISBN 13: 9783319359120
Da: AHA-BUCH GmbH, Einbeck, Germania
EUR 85,59
Quantità: 1 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book provides readers with a variety of tools to address the challenges posed by hot carrier degradation, one of today's most complicated reliability issues in semiconductor devices. Coverage includes an explanation of carrier transport within devices and book-keeping of how they acquire energy ('become hot'), interaction of an ensemble of colder and hotter carriers with defect precursors, which eventually leads to the creation of a defect, and a description of how these defects interact with the device, degrading its performance.