Lim sung kyu (51 risultati)

Paperback. Condizione: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.

Condizione: Acceptable. Readable, but has significant damage / tears. Has a remainder mark. paperback Used - Acceptable 2010.

Condizione: As New. Unread book in perfect condition.

Condizione: good. May show signs of wear, highlighting, writing, and previous use. This item may be a former library book with typical markings. No guarantee on products that contain supplements Your satisfaction is 100% guaranteed. Twenty-five year bookseller with shipments to over fifty million happy customers.…

Condizione: New.

hardcover. Condizione: New. 2008th Edition. Ships in a BOX from Central Missouri! UPS shipping for most packages, (Priority Mail for AK/HI/APO/PO Boxes).

hardcover. Condizione: Good. 2008th Edition. Ships in a BOX from Central Missouri! May not include working access code. Will not include dust jacket. Has used sticker(s) and some writing or highlighting. UPS shipping for most packages, (Priority Mail for AK/HI/APO/PO Boxes).

Condizione: New.

Condizione: New. In English.

Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous 'manufacturing-ready' GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process.…

Taschenbuch. Condizione: Neu. Design for High Performance, Low Power, and Reliable 3D Integrated Circuits | Sung Kyu Lim | Taschenbuch | xxviii | Englisch | 2014 | Springer | EAN 9781489986962 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. …

Condizione: New. In English.

Condizione: New. In English.

Condizione: New.

Condizione: As New. Unread book in perfect condition.

Condizione: New.

Condizione: New.

Paperback. Condizione: Brand New. 560 pages. 8.75x6.00x1.25 inches. In Stock.

Condizione: New. In English.

Buch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - Practical Problems in VLSI Physical Design Automationcontains problems and solutions related to various well-known algorithms used in VLSI physical design automation. Dr. Lim believes that the best way to learn new algorithms is to walk through a small example by hand. This knowledge will greatly help understand, analyze, and improve some of the well-known algorithms. The author has designed and taught a graduate-level course on physical CAD for VLSI at Georgia Tech. Over the years he has written his homework with such a focus and has maintained typeset version of the solutions.…

Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - Practical Problems in VLSI Physical Design Automationcontains problems and solutions related to various well-known algorithms used in VLSI physical design automation. Dr. Lim believes that the best way to learn new algorithms is to walk through a small example by hand. This knowledge will greatly help understand, analyze, and improve some of the well-known algorithms. The author has designed and taught a graduate-level course on physical CAD for VLSI at Georgia Tech. Over the years he has written his homework with such a focus and has maintained typeset version of the solutions.…

Buch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous 'manufacturing-ready' GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process.…

Taschenbuch. Condizione: Neu. Practical Problems in VLSI Physical Design Automation | Sung Kyu Lim | Taschenbuch | xxxvi | Englisch | 2010 | Springer | EAN 9789048176823 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. …

Condizione: good. May show signs of wear, highlighting, writing, and previous use. This item may be a former library book with typical markings. No guarantee on products that contain supplements Your satisfaction is 100% guaranteed. Twenty-five year bookseller with shipments to over fifty million happy customers.…

Paperback. Condizione: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Condizione: New. pp. 300.

Condizione: New.

Condizione: New. pp. 590.

Condizione: New.

Hardcover. Condizione: Brand New. 1st edition. 264 pages. 9.50x6.50x1.00 inches. In Stock.