lin cheng kuan (32 risultati)

Hardcover. Condizione: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.

Condizione: As New. Unread book in perfect condition.

Condizione: New.

Condizione: New.

Condizione: New.

Condizione: As New. Unread book in perfect condition.

Condizione: New. In.

Condizione: New. pp. xiii + 262 1st Edition.

Condizione: New. pp. xiii + 262 Illus.

Paperback. Condizione: Brand New. 720 pages. 9.21x6.14x1.54 inches. In Stock.

Condizione: New.

Condizione: As New. Unread book in perfect condition.

Condizione: New. In.

Condizione: New.

Condizione: As New. Unread book in perfect condition.

Hardback. Condizione: New. State-of-the-art methods and current perspectives on interconnect The irrepressible march toward smaller and faster integrated circuits has made interconnect a hot topic for semiconductor research. The effects of wire size, topology construction, and network design on system performance and reliability have all been thoroughly investigated in recent years. Interconnect Analysis and Synthesis provides CAD researchers and engineers with powerful, state-of-the-art tools for the analysis, design, and optimization of interconnect. It brings together a wealth of information previously scattered throughout the literature, explaining in depth available analysis techniques and presenting a range of CAD algorithms for synthesizing and optimizing interconnect. Along with examples and results from the semiconductor industry and 150 illustrations, this practical work features: Models for interconnect as well as devices and the impact of scaling trendsModern analysis techniques, from matrix reduction and moment matching to transmission-line analysisAn overview of the effects of inductance on on-chip interconnectFlexible CAD algorithms that can be generalized for different needs, from buffer insertion to wire sizing to routing topologyEmphasis on realistic problem formulations, addressing key design tradeoffs such as those between area and performance.

Gebunden. Condizione: New. State-of-the-art methods and current perspectives on interconnect The irrepressible march toward smaller and faster integrated circuits has made interconnect a hot topic for semiconductor research. The effects of wire size, topology construction, and networ.

Hardcover. Condizione: Brand New. 1st edition. 262 pages. 9.50x6.25x0.75 inches. In Stock.

Hardback. Condizione: New. State-of-the-art methods and current perspectives on interconnect The irrepressible march toward smaller and faster integrated circuits has made interconnect a hot topic for semiconductor research. The effects of wire size, topology construction, and network design on system performance and reliability have all been thoroughly investigated in recent years. Interconnect Analysis and Synthesis provides CAD researchers and engineers with powerful, state-of-the-art tools for the analysis, design, and optimization of interconnect. It brings together a wealth of information previously scattered throughout the literature, explaining in depth available analysis techniques and presenting a range of CAD algorithms for synthesizing and optimizing interconnect. Along with examples and results from the semiconductor industry and 150 illustrations, this practical work features: Models for interconnect as well as devices and the impact of scaling trendsModern analysis techniques, from matrix reduction and moment matching to transmission-line analysisAn overview of the effects of inductance on on-chip interconnectFlexible CAD algorithms that can be generalized for different needs, from buffer insertion to wire sizing to routing topologyEmphasis on realistic problem formulations, addressing key design tradeoffs such as those between area and performance.

Condizione: New. In.

Taschenbuch. Condizione: Neu. Neuware -The conference proceeding of ICMMCS 2021 presents most recent scientific and technological advances in the fields of engineering mathematics and computational science to strengthen the links in the scientific community. It is a collection of high-quality, peer-reviewed research papers presented at the Second International Conference on Mathematical Modeling and Computational Science (ICMMCS 2021), held online during October 29¿30, 2021. The topics covered in the book are mathematical logic and foundations, numerical analysis, neural networks, fuzzy set theory, coding theory, higher algebra, number theory, graph theory and combinatory, computation in complex networks, calculus, differential educations and integration, application of soft computing, knowledge engineering, machine learning, artificial intelligence, big data and data analytics, high-performance computing, network and device security, Internet of Things (IoT).Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 596 pp. Englisch.

Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - The conference proceeding of ICMMCS 2021 presents most recent scientific and technological advances in the fields of engineering mathematics and computational science to strengthen the links in the scientific community. It is a collection of high-quality, peer-reviewed research papers presented at the Second International Conference on Mathematical Modeling and Computational Science (ICMMCS 2021), held online during October 29-30, 2021. The topics covered in the book are mathematical logic and foundations, numerical analysis, neural networks, fuzzy set theory, coding theory, higher algebra, number theory, graph theory and combinatory, computation in complex networks, calculus, differential educations and integration, application of soft computing, knowledge engineering, machine learning, artificial intelligence, big data and data analytics, high-performance computing, network and device security, Internet of Things (IoT).

Hardcover. Condizione: Fine. 151 pp. ; color illustrations ; 28 cm. ; ISBN: 0968262309; 9780968262306 ; LC: ND1045 ; OCLC: 57339669 ; Text in English, Chinese, and French ; full-color illiustrated, stiff paper wrappers ; guidebook to the exhibition laid-in ; Catalogue of exhibitions held in Royal Ontario Museum, Toronto, August 21 to October 13, 1997; Vancouver Art Gallery, November 21 to December 8, 1997; and Canadian Museum of Civilization, Hull, Québec, December 18, 1997 to March 1, 1998. ; jointly organized by the Canadian Foundation for the Preservation of Chinese Cultural and Historical Treasures and China International Exhibition Agency ; includes the work of artists: Chen Banding (1877-1970), Chen Dayu (1912-), Chen Kuan (1959-), Chen Aiucao (1906-1988), C hen Ziyi (1919-), Cheng Shifa (1921-), Du Ziling (1914-), Feng Jizhong (1923-1967), Fu Baoshi (1904-1965), Fu Ershi (1936-), Guan Shanyue (1912-), Guo Weiqu (1908-1971), He Tianjian (1891-1977), Huang Zhou (1925-1997), Kang Shiyao (1921-1985), Li Ke ran (1907-1989), Li Kuchan (1898-1983), Li Xiongcai (1910-), Lin Fengmian (1900-), Liu Haisu (1896-), Liu Jiyou (1918-1983), Liu Wenfu (1934-), Pan Tianshou (1897-1971), Qi Baishi (1864-1957), Qian Songyan (1899-1985), Shi Lu (1919-1982), Shu Chungu ang (1941-), Tian Shiguang (1916-), Wang Geyi (1897-1988), Wang Weibao (1942-), Wang Xuetao (1903-1982), Wei Jianqiong (1941-), Wu Changshuo (1844-1927), Wu Fuzhi (1900-1977), Wu Guangzhong (1919-2010), Wu Jingting (1904-1972), Wu Zuoren (1908-1997), Xiao Shufang (1911-), Xie Ruijie (1902-), Xu Beihong (1895-1953), Xu Yuanshao (1944-), Ya Ming (1924-), Yang Jingsheng (1958-), Yu Jigao (1932-), Zhang Dazhuang (1903-1980), Zhang Dequan (1941-), Zhang Qiyi (1914-1968), Zhang Zingjun (1958-), Zhong We isheng (1964-), Zhou Sicong (1939-1996), Zhu Qizhan (1981-1996); from Hong Kong: Chao Shao'ang (1950-), Lu Zhoukun (1919-1975), Yang Shanshen (1913-); from Canada: Ho Paklee (1945-), Koo Mei (1934-); SIGNED by artists Wu Guangzhong (1919-2010) and Ho Paklee (1945-); Wu Guangzhong, born in Yixing, studied painting in France in his early years and afterwards taught at Qinghua University and Central Art College; his landscape paintings integrate Chinese and Western techniques, creating Jackson Pollock-like landscapes; in a dramatic calligraphic hand beneath his representative work, "Spring Snow" (1997); Ho Paklee (He Baili), born in Guangzhou but raised in Hong Kong, began by illustrating flowers and birds, then shifted into a Lingnan Style landscape painting style, and finally moving to watercolor landscapes, where he developed a highly original, eponymous Ho School of Landscape Painting; signed in a striking calligraphic hand beneath his painting, "Jade Reflection" (1996) ; FINE. Signed by Author(s). Book.

paperback. Condizione: Good. I the philosopher small language (German Culture Series).

Hardcover. Condizione: New. Language:Chinese.HardCover.Pub Date:2020-07-01 Pages:72 Publisher: Huashan Literature and Art Publishing House Grandma Xiong is old and alone. so she moved to the little bear's house and lived with little bear. little bear father. and little bear mother.?Little Bear is very happy to live with Grandma Xiong. but one day he found out what he did with Grandma Xiong yesterday. and Grandma Xiong can't remember today.?Little Bear was very angry. so he went to the forest to pick acorns by himself.?I.

Soft cover. Condizione: New. Language:Chinese.Author:[ DE ] KA LIN WA ER TE BIAN YI ZHE CHEN SHI CHENG ZHANG ZAI YANG SONG ZHONG HUANG ZHONG CHANG SHENG WANG RU KUAN.Binding:SoftCover.Publisher: Reading Joint Publishing.

Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Hsu, Lih-Hsing Lin, Cheng-KuanThe advancement of large scale integrated circuit technology has enabled the construction of complex interconnection networks. Graph theory provides a fundamental tool for designing and analyzing such networks. Graph T.

Condizione: new. Questo è un articolo print on demand.

Hardcover. Condizione: Brand New. 1st edition. 262 pages. 9.50x6.25x0.75 inches. In Stock. This item is printed on demand.

Kartoniert / Broschiert. Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. The conference proceeding of ICMMCS 2021 presents most recent scientific and technological advances in the fields of engineering mathematics and computational science to strengthen the links in the scientific community. It is a collection of high-quality, p.