Plumbridge w j (27 risultati)
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EUR 136,48
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EUR 166,20
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EUR 166,20
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EUR 178,30
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EUR 189,63
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Da: Majestic Books, Hounslow, Regno UnitoMajestic Books
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EUR 185,00
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Condizione: Used. pp. 360 Illus.
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Da: Biblios, frankfurt am main, HESSE, GermaniaBiblios
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EUR 187,45
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Altre immagini- Brossura
Da: preigu, Osnabrück, Germaniapreigu
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Taschenbuch. Condizione: Neu. Structural Integrity and Reliability in Electronics | Enhancing Performance in a Lead-Free Environment | W. J. Plumbridge (u. a.) | Taschenbuch | xix | Englisch | 2010 | Springer | EAN 9789048164950 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juerg…en[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Structural Integrity and Reliability in Electronics
Plumbridge, W.J. (The Open University, Milton Keynes, UK); Matela, Raymond J.; Westwater, A. (Rohm Electronics (UK) Ltd., Milton Keynes, UK)
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Da: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrlandaKennys Bookshop and Art Galleries Ltd.
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EUR 198,21
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Condizione: New. The World's largest industrial sector, Electronics, is facing twin challenges arising from the transition to environmentally-benign solder alloys and the necessity to maintain structural integrity and reliability in the face of continuing miniaturisation. This book addresses the situation from a multidisciplinar…y teaching perspective. Num Pages: 355 pages, 248 black & white illustrations, biography. BIC Classification: TJF. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 20. Weight in Grams: 774. . 2003. Hardback. . . . .
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Da: Books Puddle, New York, NY, U.S.A.Books Puddle
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EUR 217,41
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Condizione: New. pp. 358.
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Da: moluna, Greven, Germaniamoluna
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EUR 178,14
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Gebunden. Condizione: New. Knowledge itself is soon obsolete It is a blunt instrument. Only by understanding can problems be solved and progress achieved. Reliability in performance of electronic equipment, in the face of demands for continuing miniaturisation and the anticipated ab.
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Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH
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EUR 168,73
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Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - Knowledge itself is soon obsolete; It is a blunt instrument. Only by understanding can problems be solved and progress achieved. Reliability in performance of electronic equipment, in the face of demands for continuing miniaturisation and the anti…cipated abolition of lead containing solders, represents a major engineering challenge. The involvement of numerous disciplines; such as electrical, electronic, mechanical, manufacturing, and materials engineering together with physicists and computer specialists, adds to the complexity of the situation. Nevertheless, with electronics being the World's largest industrial sector, the potential rewards to the winners are substantial. This book aims to provide the ingredients for understanding, together with knowledge of reliability in interconnection technology and of the implementation of lead free solders. It is strongly contended that such a combination forms the necessary basis for greater structural integrity and enhanced performance The text is essentially in three parts: The intentions of the Part I component {The Materials Perspective, Chapters 1 6) are to present a snapshot of the current, but rapidly changing, global scene and to establish a firm understanding of the fundamentals surrounding interconnection performance. With potential readers possessing a broad spectrum of knowledge and expertise, this is essential. It could be argued that the reason for the limited progress made in this field to date has been due to the difficulties encountered in communicating effectively across the discipline boundaries.
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Da: Revaluation Books, Exeter, Regno UnitoRevaluation Books
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EUR 237,56
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Paperback. Condizione: Brand New. 2003 edition. 350 pages. 9.25x6.25x0.82 inches. In Stock.
Structural Integrity and Reliability in Electronics
Plumbridge, W.J. (The Open University, Milton Keynes, UK); Matela, Raymond J.; Westwater, A. (Rohm Electronics (UK) Ltd., Milton Keynes, UK)
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Da: Kennys Bookstore, Olney, MD, U.S.A.Kennys Bookstore
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EUR 251,98
EUR 9,21 spedizioneSpedito in U.S.A.Quantità: 15 disponibili
Condizione: New. The World's largest industrial sector, Electronics, is facing twin challenges arising from the transition to environmentally-benign solder alloys and the necessity to maintain structural integrity and reliability in the face of continuing miniaturisation. This book addresses the situation from a multidisciplinar…y teaching perspective. Num Pages: 355 pages, 248 black & white illustrations, biography. BIC Classification: TJF. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 20. Weight in Grams: 774. . 2003. Hardback. . . . . Books ship from the US and Ireland.
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Da: GreatBookPricesUK, Woodford Green, Regno UnitoGreatBookPricesUK
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EUR 272,48
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Condizione: As New. Unread book in perfect condition.
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Da: Mispah books, Redhill, SURRE, Regno UnitoMispah books
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EUR 262,85
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Paperback. Condizione: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
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Da: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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EUR 298,49
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Condizione: As New. Unread book in perfect condition.
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Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH
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EUR 247,94
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Buch. Condizione: Neu. Neuware - Knowledge itself is soon obsolete; It is a blunt instrument. Only by understanding can problems be solved and progress achieved. Reliability in performance of electronic equipment, in the face of demands for continuing miniaturisation and the anticipated abolition of lead containing solders, repr…esents a major engineering challenge. The involvement of numerous disciplines; such as electrical, electronic, mechanical, manufacturing, and materials engineering together with physicists and computer specialists, adds to the complexity of the situation. Nevertheless, with electronics being the World's largest industrial sector, the potential rewards to the winners are substantial. This book aims to provide the ingredients for understanding, together with knowledge of reliability in interconnection technology and of the implementation of lead free solders. It is strongly contended that such a combination forms the necessary basis for greater structural integrity and enhanced performance The text is essentially in three parts: The intentions of the Part I component {The Materials Perspective, Chapters 1 6) are to present a snapshot of the current, but rapidly changing, global scene and to establish a firm understanding of the fundamentals surrounding interconnection performance. With potential readers possessing a broad spectrum of knowledge and expertise, this is essential. It could be argued that the reason for the limited progress made in this field to date has been due to the difficulties encountered in communicating effectively across the discipline boundaries.
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- Print on Demand
Da: Brook Bookstore On Demand, Napoli, NA, ItaliaBrook Bookstore On Demand
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EUR 126,26
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Condizione: new. Questo è un articolo print on demand.
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- Print on Demand
Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermaniaBuchWeltWeit Ludwig Meier e.K.
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EUR 160,49
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Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Knowledge itself is soon obsolete; It is a blunt instrument. Only by understanding can problems be solved and progress achieved. Reliability in performance of electronic equipment, in the face of demands for continuing miniaturisat…ion and the anticipated abolition of lead containing solders, represents a major engineering challenge. The involvement of numerous disciplines; such as electrical, electronic, mechanical, manufacturing, and materials engineering together with physicists and computer specialists, adds to the complexity of the situation. Nevertheless, with electronics being the World's largest industrial sector, the potential rewards to the winners are substantial. This book aims to provide the ingredients for understanding, together with knowledge of reliability in interconnection technology and of the implementation of lead free solders. It is strongly contended that such a combination forms the necessary basis for greater structural integrity and enhanced performance The text is essentially in three parts: The intentions of the Part I component {The Materials Perspective, Chapters 1 6) are to present a snapshot of the current, but rapidly changing, global scene and to establish a firm understanding of the fundamentals surrounding interconnection performance. With potential readers possessing a broad spectrum of knowledge and expertise, this is essential. It could be argued that the reason for the limited progress made in this field to date has been due to the difficulties encountered in communicating effectively across the discipline boundaries. 360 pp. Englisch.
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- Print on Demand
Da: moluna, Greven, Germaniamoluna
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EUR 136,16
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Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Knowledge itself is soon obsolete It is a blunt instrument. Only by understanding can problems be solved and progress achieved. Reliability in performance of electronic equipment, in the face of demands for continuin…g miniaturisation and the anticipated ab.
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Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germaniabuchversandmimpf2000
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EUR 160,49
EUR 60,00 spedizioneSpedito da Germania a U.S.A.Quantità: 1 disponibili
Taschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Knowledge itself is soon obsolete; It is a blunt instrument. Only by understanding can problems be solved and progress achieved. Reliability in performance of electronic equipment, in the face of demands for continuing miniaturisation…and the anticipated abolition of lead containing solders, represents a major engineering challenge. The involvement of numerous disciplines; such as electrical, electronic, mechanical, manufacturing, and materials engineering together with physicists and computer specialists, adds to the complexity of the situation. Nevertheless, with electronics being the World's largest industrial sector, the potential rewards to the winners are substantial. This book aims to provide the ingredients for understanding, together with knowledge of reliability in interconnection technology and of the implementation of lead free solders. It is strongly contended that such a combination forms the necessary basis for greater structural integrity and enhanced performance The text is essentially in three parts: The intentions of the Part I component {The Materials Perspective, Chapters 1 6) are to present a snapshot of the current, but rapidly changing, global scene and to establish a firm understanding of the fundamentals surrounding interconnection performance. With potential readers possessing a broad spectrum of knowledge and expertise, this is essential. It could be argued that the reason for the limited progress made in this field to date has been due to the difficulties encountered in communicating effectively across the discipline boundaries.Springer-Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 360 pp. Englisch.
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Da: Majestic Books, Hounslow, Regno UnitoMajestic Books
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EUR 230,40
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Condizione: New. Print on Demand pp. 358 49:B&W 6.14 x 9.21 in or 234 x 156 mm (Royal 8vo) Perfect Bound on White w/Gloss Lam.
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Da: Biblios, frankfurt am main, HESSE, GermaniaBiblios
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EUR 230,03
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Condizione: New. PRINT ON DEMAND pp. 358.
