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  • Lingua: Inglese

    Editore: World Scientific Publishing Co P, 2019

    9813237821 / 9789813237827

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    Da: suffolkbooks, center moriches, NY, U.S.A.suffolkbooks

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    EUR 36,73

    EUR 3,56 spedizione 
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    Quantità: 1 disponibile

    hardcover. Condizione: Very Good. Fast Shipping - Safe and Secure 7 days a week.

  • Lingua: Inglese

    Editore: Springer, 2026

    3031802543 / 9783031802546

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    Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH

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    EUR 121,81

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    Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book provides students and professionals, including pulsed power designers, with a complete overview of advanced semiconductor devices that can improve the performance of pulsed power systems. The development and advancement of pulsed power technology was driven by research into nuclear fusion and military applications. As technology advances, pulsed power systems are finding their way into industrial and commercial applications. The book begins with a detailed discussion of various applications of pulsed power technology with a primary focus on nuclear fusion. Historically, traditional pulsed-power switches (spark gaps, thyratrons, ignitrons, etc.) have been used in such pulsed power systems. A comparative analysis of the cost and performance specifications of wide bandgap solid-state devices and traditional switches and a review of various pulsed-power architectures is provided. The superior properties of advanced wide bandgap material have enabled the development of high-power, high-temperature, and fast-switching semiconductor devices. Based on the successful integration of wide bandgap technology in high-power traction and renewable energy applications, wide bandgap solid-state switches have the potential to have a profound impact on pulsed-power systems; however, this modern technology introduces added complexity with respect to design, fabrication, and packaging of the semiconductor. The concluding chapters of this book will provide readers with an in-depth look into the key aspects and challenges associated with wide bandgap device fabrication and packaging.…

  • Lingua: Inglese

    Editore: Springer, 2025

    3031802519 / 9783031802515

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    Da: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices

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    EUR 159,60

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  • Lingua: Inglese

    Editore: Springer, 2025

    3031802519 / 9783031802515

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  • Lingua: Inglese

    Editore: Springer, 2025

    3031802519 / 9783031802515

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    Da: California Books, Miami, FL, U.S.A.California Books

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  • Lingua: Inglese

    Editore: Springer, 2026

    3031802543 / 9783031802546

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    Taschenbuch. Condizione: Neu. Power Semiconductor Technology in Pulsed Power Applications | Stephen B. Bayne (u. a.) | Taschenbuch | xxvii | Englisch | 2026 | Springer | EAN 9783031802546 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. …

  • Lingua: Inglese

    Editore: Springer, 2025

    3031802519 / 9783031802515

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    Da: Ria Christie Collections, Uxbridge, Regno UnitoRia Christie Collections

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    Condizione: New. In English.

  • Lingua: Inglese

    Editore: Springer, 2025

    3031802519 / 9783031802515

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    Da: GreatBookPricesUK, Woodford Green, Regno UnitoGreatBookPricesUK

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  • Lingua: Inglese

    Editore: Springer, 2025

    3031802519 / 9783031802515

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  • Lingua: Inglese

    Editore: World Scientific Publishing Co Pte Ltd, 2019

    9813237821 / 9789813237827

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    Da: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices

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  • Lingua: Inglese

    Editore: World Scientific Publishing Co Pte Ltd, 2019

    9813237821 / 9789813237827

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    Da: PBShop.store US, Wood Dale, IL, U.S.A.PBShop.store US

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  • Lingua: Inglese

    Editore: World Scientific Publishing Co Pte Ltd, 2019

    9813237821 / 9789813237827

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    Da: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices

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  • Lingua: Inglese

    Editore: World Scientific Publishing Co Pte Ltd, 2019

    9813237821 / 9789813237827

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    Da: California Books, Miami, FL, U.S.A.California Books

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  • Lingua: Inglese

    Editore: World Scientific Publishing Co Pte Ltd, 2019

    9813237821 / 9789813237827

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  • Lingua: Inglese

    Editore: World Scientific Publishing Co Pte Ltd, 2019

    9813237821 / 9789813237827

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    Da: GreatBookPricesUK, Woodford Green, Regno UnitoGreatBookPricesUK

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    EUR 193,40

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  • Lingua: Inglese

    Editore: Springer Nature, 2025

    3031802519 / 9783031802515

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    Da: Revaluation Books, Exeter, Regno UnitoRevaluation Books

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    Hardcover. Condizione: Brand New. 201 pages. 9.25x6.10x9.21 inches. In Stock.

  • Lingua: Inglese

    Editore: World Scientific Publishing Co Pte Ltd, 2019

    9813237821 / 9789813237827

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    Da: GreatBookPricesUK, Woodford Green, Regno UnitoGreatBookPricesUK

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  • Lingua: Inglese

    Editore: World Scientific Publishing Co Pte Ltd, 2019

    9813237821 / 9789813237827

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    Da: Ria Christie Collections, Uxbridge, Regno UnitoRia Christie Collections

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    Condizione: New. In English.

  • Lingua: Inglese

    Editore: World Scientific Publishing Co Pte Ltd, SG, 2019

    9813237821 / 9789813237827

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    Da: Rarewaves.com USA, London, LONDO, Regno UnitoRarewaves.com USA

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    Hardback. Condizione: New. The primary goal of this book is to provide a sound understanding of wide bandgap Silicon Carbide (SiC) power semiconductor device simulation using Silvaco© ATLAS Technology Computer Aided Design (TCAD) software. Physics-based TCAD modeling of SiC power devices can be extremely challenging due to the wide bandgap of the semiconductor material. The material presented in this book aims to shorten the learning curve required to start successful SiC device simulation by providing a detailed explanation of simulation code and the impact of various modeling and simulation parameters on the simulation results. Non-isothermal simulation to predict heat dissipation and lattice temperature rise in a SiC device structure under switching condition has been explained in detail. Key pointers including runtime error messages, code debugging, implications of using certain models and parameter values, and other factors beneficial to device simulation are provided based on the authors' experience while simulating SiC device structures. This book is useful for students, researchers, and semiconductor professionals working in the area of SiC semiconductor technology. Readers will be provided with the source code of several fully functional simulation programs that illustrate the use of Silvaco© ATLAS to simulate SiC power device structure, as well as supplementary material for download.Related Link(s).…

  • Lingua: Inglese

    Editore: WSPC, 2019

    9813237821 / 9789813237827

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    Da: moluna, Greven, Germaniamoluna

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    Gebunden. Condizione: New.

  • Lingua: Inglese

    Editore: World Scientific Publishing Co Pte Ltd, 2019

    9813237821 / 9789813237827

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    EUR 259,33

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  • Lingua: Inglese

    Editore: World Scientific Publishing Co Pte Ltd, 2019

    9813237821 / 9789813237827

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    Da: Majestic Books, Hounslow, Regno UnitoMajestic Books

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  • Lingua: Inglese

    Editore: World Scientific Publishing Co Pte Ltd, SG, 2019

    9813237821 / 9789813237827

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    Hardback. Condizione: New. The primary goal of this book is to provide a sound understanding of wide bandgap Silicon Carbide (SiC) power semiconductor device simulation using Silvaco© ATLAS Technology Computer Aided Design (TCAD) software. Physics-based TCAD modeling of SiC power devices can be extremely challenging due to the wide bandgap of the semiconductor material. The material presented in this book aims to shorten the learning curve required to start successful SiC device simulation by providing a detailed explanation of simulation code and the impact of various modeling and simulation parameters on the simulation results. Non-isothermal simulation to predict heat dissipation and lattice temperature rise in a SiC device structure under switching condition has been explained in detail. Key pointers including runtime error messages, code debugging, implications of using certain models and parameter values, and other factors beneficial to device simulation are provided based on the authors' experience while simulating SiC device structures. This book is useful for students, researchers, and semiconductor professionals working in the area of SiC semiconductor technology. Readers will be provided with the source code of several fully functional simulation programs that illustrate the use of Silvaco© ATLAS to simulate SiC power device structure, as well as supplementary material for download.Related Link(s).…

  • Lingua: Inglese

    Editore: Springer, 2025

    3031802519 / 9783031802515

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    Da: Brook Bookstore On Demand, Napoli, NA, ItaliaBrook Bookstore On Demand

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    Condizione: new. Questo è un articolo print on demand.

  • Lingua: Inglese

    Editore: Springer Mär 2026, 2026

    3031802543 / 9783031802546

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    Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermaniaBuchWeltWeit Ludwig Meier e.K.

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    EUR 106,99

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    Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book provides students and professionals, including pulsed power designers, with a complete overview of advanced semiconductor devices that can improve the performance of pulsed power systems. The development and advancement of pulsed power technology was driven by research into nuclear fusion and military applications. As technology advances, pulsed power systems are finding their way into industrial and commercial applications. The book begins with a detailed discussion of various applications of pulsed power technology with a primary focus on nuclear fusion. Historically, traditional pulsed-power switches (spark gaps, thyratrons, ignitrons, etc.) have been used in such pulsed power systems. A comparative analysis of the cost and performance specifications of wide bandgap solid-state devices and traditional switches and a review of various pulsed-power architectures is provided. The superior properties of advanced wide bandgap material have enabled the development of high-power, high-temperature, and fast-switching semiconductor devices. Based on the successful integration of wide bandgap technology in high-power traction and renewable energy applications, wide bandgap solid-state switches have the potential to have a profound impact on pulsed-power systems; however, this modern technology introduces added complexity with respect to design, fabrication, and packaging of the semiconductor. The concluding chapters of this book will provide readers with an in-depth look into the key aspects and challenges associated with wide bandgap device fabrication and packaging. 204 pp. Englisch.…

  • Lingua: Inglese

    Editore: Springer Verlag GmbH, 2026

    3031802543 / 9783031802546

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    Da: moluna, Greven, Germaniamoluna

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    Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt.

  • Lingua: Inglese

    Editore: Springer, Berlin, Springer Nature Switzerland, Springer, 2025

    3031802519 / 9783031802515

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    Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermaniaBuchWeltWeit Ludwig Meier e.K.

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    EUR 139,09

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    Buch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book provides students and professionals, including pulsed power designers, with a complete overview of advanced semiconductor devices that can improve the performance of pulsed power systems. The development and advancement of pulsed power technology was driven by research into nuclear fusion and military applications. As technology advances, pulsed power systems are finding their way into industrial and commercial applications. The book begins with a detailed discussion of various applications of pulsed power technology with a primary focus on nuclear fusion. Historically, traditional pulsed-power switches (spark gaps, thyratrons, ignitrons, etc.) have been used in such pulsed power systems. A comparative analysis of the cost and performance specifications of wide bandgap solid-state devices and traditional switches and a review of various pulsed-power architectures is provided. The superior properties of advanced wide bandgap material have enabled the development of high-power, high-temperature, and fast-switching semiconductor devices. Based on the successful integration of wide bandgap technology in high-power traction and renewable energy applications, wide bandgap solid-state switches have the potential to have a profound impact on pulsed-power systems; however, this modern technology introduces added complexity with respect to design, fabrication, and packaging of the semiconductor. The concluding chapters of this book will provide readers with an in-depth look into the key aspects and challenges associated with wide bandgap device fabrication and packaging. 174 pp. Englisch.…

  • Lingua: Inglese

    Editore: Springer Mär 2026, 2026

    3031802543 / 9783031802546

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    Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germaniabuchversandmimpf2000

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    Taschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book provides students and professionals, including pulsed power designers, with a complete overview of advanced semiconductor devices that can improve the performance of pulsed power systems. The development and advancement of pulsed power technology was driven by research into nuclear fusion and military applications. As technology advances, pulsed power systems are finding their way into industrial and commercial applications. The book begins with a detailed discussion of various applications of pulsed power technology with a primary focus on nuclear fusion. Historically, traditional pulsed-power switches (spark gaps, thyratrons, ignitrons, etc.) have been used in such pulsed power systems. A comparative analysis of the cost and performance specifications of wide bandgap solid-state devices and traditional switches and a review of various pulsed-power architectures is provided. The superior properties of advanced wide bandgap material have enabled the development of high-power, high-temperature, and fast-switching semiconductor devices. Based on the successful integration of wide bandgap technology in high-power traction and renewable energy applications, wide bandgap solid-state switches have the potential to have a profound impact on pulsed-power systems; however, this modern technology introduces added complexity with respect to design, fabrication, and packaging of the semiconductor. The concluding chapters of this book will provide readers with an in-depth look into the key aspects and challenges associated with wide bandgap device fabrication and packaging. 204 pp. Englisch.…

  • Lingua: Inglese

    Editore: Palgrave Macmillan, 2025

    3031802519 / 9783031802515

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    Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH

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    Buch. Condizione: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - This book provides students and professionals, including pulsed power designers, with a complete overview of advanced semiconductor devices that can improve the performance of pulsed power systems. The development and advancement of pulsed power technology was driven by research into nuclear fusion and military applications. As technology advances, pulsed power systems are finding their way into industrial and commercial applications. The book begins with a detailed discussion of various applications of pulsed power technology with a primary focus on nuclear fusion. Historically, traditional pulsed-power switches (spark gaps, thyratrons, ignitrons, etc.) have been used in such pulsed power systems. A comparative analysis of the cost and performance specifications of wide bandgap solid-state devices and traditional switches and a review of various pulsed-power architectures is provided. The superior properties of advanced wide bandgap material have enabled the development of high-power, high-temperature, and fast-switching semiconductor devices. Based on the successful integration of wide bandgap technology in high-power traction and renewable energy applications, wide bandgap solid-state switches have the potential to have a profound impact on pulsed-power systems; however, this modern technology introduces added complexity with respect to design, fabrication, and packaging of the semiconductor. The concluding chapters of this book will provide readers with an in-depth look into the key aspects and challenges associated with wide bandgap device fabrication and packaging.…

  • Lingua: Inglese

    Editore: Springer, Springer Mär 2025, 2025

    3031802519 / 9783031802515

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    Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germaniabuchversandmimpf2000

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    EUR 139,09

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    Buch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book provides students and professionals, including pulsed power designers, with a complete overview of advanced semiconductor devices that can improve the performance of pulsed power systems. The development and advancement of pulsed power technology was driven by research into nuclear fusion and military applications. As technology advances, pulsed power systems are finding their way into industrial and commercial applications. The book begins with a detailed discussion of various applications of pulsed power technology with a primary focus on nuclear fusion. Historically, traditional pulsed-power switches (spark gaps, thyratrons, ignitrons, etc.) have been used in such pulsed power systems. A comparative analysis of the cost and performance specifications of wide bandgap solid-state devices and traditional switches and a review of various pulsed-power architectures is provided. The superior properties of advanced wide bandgap material have enabled the development of high-power, high-temperature, and fast-switching semiconductor devices. Based on the successful integration of wide bandgap technology in high-power traction and renewable energy applications, wide bandgap solid-state switches have the potential to have a profound impact on pulsed-power systems; however, this modern technology introduces added complexity with respect to design, fabrication, and packaging of the semiconductor. The concluding chapters of this book will provide readers with an in-depth look into the key aspects and challenges associated with wide bandgap device fabrication and packaging.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 204 pp. Englisch.…