Saguet pierre (20 risultati)

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Agrafé. Condizione: Bon état. in-8 Description :Non paginé. Langue : Français Nb de volumes : 1.

Condizione: As New. Unread book in perfect condition.

Condizione: As New. Unread book in perfect condition.

Condizione: As New. Unread book in perfect condition.

Condizione: As New. Unread book in perfect condition.

Condizione: New. This book presents a history of TLM method leads to the different 2D and 3D nodes currently used, determines the scattering matrices, dispersion, propagation in open space, and absorbing boundary conditions. It covers how to include the coupling between thin wires and electromagnetic waves and how to include passive and active components. Num Pages: 184 pages, black & white illustrations, black & white tables, figures. BIC Classification: TJ. Category: (P) Professional & Vocational. Dimension: 234 x 166 x 22. Weight in Grams: 530. . 2012. . . . .…

Condizione: New. This book, written by recognized experts in the field, is intended for designers of RF or microwave passive integrated circuits. Editor(s): Saguet, Pierre. Series: ISTE. Num Pages: 288 pages, Illustrations. BIC Classification: TJFC. Category: (P) Professional & Vocational. Dimension: 242 x 163 x 20. Weight in Grams: 558. . 2009. 1st Edition. Hardcover. . . . . …

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Condizione: New. Brand new! Please provide a physical shipping address.

Condizione: New.

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Gebunden. Condizione: New. This book, written by recognized experts in the field, is intended for designers of RF or microwave passive integrated circuits. It describes methods used for modeling passive circuits using the most common numerical analysis techniques (the method of momen.

Condizione: New. This book, written by recognized experts in the field, is intended for designers of RF or microwave passive integrated circuits. Editor(s): Saguet, Pierre. Series: ISTE. Num Pages: 288 pages, Illustrations. BIC Classification: TJFC. Category: (P) Professional & Vocational. Dimension: 242 x 163 x 20. Weight in Grams: 558. . 2009. 1st Edition. Hardcover. . . . . Books ship from the US and Ireland. …

Condizione: New. This book presents a history of TLM method leads to the different 2D and 3D nodes currently used, determines the scattering matrices, dispersion, propagation in open space, and absorbing boundary conditions. It covers how to include the coupling between thin wires and electromagnetic waves and how to include passive and active components. Num Pages: 184 pages, black & white illustrations, black & white tables, figures. BIC Classification: TJ. Category: (P) Professional & Vocational. Dimension: 234 x 166 x 22. Weight in Grams: 530. . 2012. . . . . Books ship from the US and Ireland.…

Buch. Condizione: Neu. Neuware - The aim of this book is to give a broad overview of the TLM (Transmission Line Matrix) method, which is one of the 'time-domain numerical methods'. These methods are reputed for their significant reliance on computer resources. However, they have the advantage of being highly general.The TLM method has acquired a reputation for being a powerful and effective tool by numerous teams and still benefits today from significant theoretical developments. In particular, in recent years, its ability to simulate various situations with excellent precision, including complex materials, has been demonstrated.Application examples are included in the last two chapters of the book, enabling the reader to draw conclusions regarding the performance of the implemented techniques and, at the same time, to validate them.Contents1. Basis of the TLM Method: the 2D TLM Method.2. 3D Nodes.3. Introduction of Discrete Elements and Thin Wires in the TLM Method.4. The TLM Method in Matrix Form and the Z Transform.Appendix A. Development of Maxwell's Equations using the Z Transform with a Variable Mesh.Appendix B. Treatment of Plasma using the Z Transform for the TLM Method.…

Buch. Condizione: Neu. Neuware - This book, written by recognized experts in the field, is intended for designers of RF or microwave passive integrated circuits. It describes methods used for modeling passive circuits using the most common numerical analysis techniques (the method of moments, finite element methods, FDTD, TLM), and pays particular attention to propagation phenomena. Interconnections and packaging modeling are included, as well as an original method for multi-scale circuit modeling.Characterization and measurement methods in the time and frequency domains are the subject of two very detailed chapters. Measurement errors using Vector Network Analyzer (VNA ) and appropriate corrections are detailed and the divergences between all the various parameters S, Z, Y, h, T, ABCD are given. Time domain reflectometry and its use are also covered in detail.…