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Lingua: Inglese
Editore: Springer Nature Switzerland AG, Cham, 2022
ISBN 10: 3030801349 ISBN 13: 9783030801342
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Hardcover. Condizione: new. Hardcover. This book thoroughly reviews the present knowledge on silicon micromechanical transducers and addresses emerging and future technology challenges. Readers will acquire a solid theoretical and practical background that will allow them to analyze the key performance aspects of devices, critically judge a fabrication process, and then conceive and design new ones for future applications. Envisioning a future complex versatile microsystem, the authors take inspiration from Richard Feynmans visionary talk There is Plenty of Room at the Bottom to propose that the time has come to see silicon sensors as part of a Feynman Roadmap instead of the More-than-Moore technology roadmap. The sharing of the authors industrially proven track record of development, design, and manufacturing, along with their visionary approach to the technology, will allow readers to jump ahead in their understanding of the core of the topic in a very effective way. Students, researchers, engineers, and technologists involved in silicon-based sensor and actuator research and development will find a wealth of useful and groundbreaking information in this book. This book thoroughly reviews the present knowledge on silicon micromechanical transducers and addresses emerging and future technology challenges. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
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Editore: Springer International Publishing, 2023
ISBN 10: 3030801373 ISBN 13: 9783030801373
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ISBN 10: 3030801349 ISBN 13: 9783030801342
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Aggiungi al carrelloTaschenbuch. Condizione: Neu. Silicon Sensors and Actuators | The Feynman Roadmap | Benedetto Vigna (u. a.) | Taschenbuch | xiii | Englisch | 2023 | Springer | EAN 9783030801373 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Lingua: Inglese
Editore: Springer International Publishing, Springer International Publishing, 2023
ISBN 10: 3030801373 ISBN 13: 9783030801373
Da: AHA-BUCH GmbH, Einbeck, Germania
EUR 69,54
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Aggiungi al carrelloTaschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book thoroughly reviews the present knowledge on silicon micromechanical transducers and addresses emerging and future technology challenges. Readers will acquire a solid theoretical and practical background that will allow them to analyze the key performance aspects of devices, critically judge a fabrication process, and then conceive and design new ones for future applications. Envisioning a future complex versatile microsystem, the authors take inspiration from Richard Feynman's visionary talk 'There is Plenty of Room at the Bottom' to propose that the time has come to see silicon sensors as part of a 'Feynman Roadmap' instead of the 'More-than-Moore' technology roadmap. The sharing of the author's industrially proven track record of development, design, and manufacturing, along with their visionary approach to the technology, will allow readers to jump ahead in their understanding of the core of the topic in a very effective way. Students, researchers, engineers, and technologists involved in silicon-based sensor and actuator research and development will find a wealth of useful and groundbreaking information in this book.
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Editore: Springer, Berlin|Springer International Publishing|Springer, 2021
ISBN 10: 3030801349 ISBN 13: 9783030801342
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Aggiungi al carrelloCondizione: New. This book thoroughly reviews the present knowledge on silicon micromechanical transducers and addresses emerging and future technology challenges.This book thoroughly reviews the present knowledge on silicon micromechanical transducers and addresses .
Lingua: Inglese
Editore: Springer Nature Switzerland AG, CH, 2022
ISBN 10: 3030801349 ISBN 13: 9783030801342
Da: Rarewaves USA United, OSWEGO, IL, U.S.A.
Hardback. Condizione: New. 2022 ed.