Editore: Henan People's Publishing House, 2023
ISBN 10: 7215134059 ISBN 13: 9787215134058
Lingua: Inglese
Da: liu xing, Nanjing, JS, Cina
EUR 78,49
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Aggiungi al carrellopaperback. Condizione: New. Paperback.Pub Date:2023-11 Pages:330 Language:Chinese Publisher:Henan People's Publishing House This book is a popular reading about Mr. Feng Youlan. Based on the text of Feng Youlan's works. combined with comments and pictures. it gives a panoramic introduction and interpretation of Mr. Feng Youlan. It is divided into six parts: Feng's Family Style. Three Histories Explaining the Past and Present. Six Books Recording Zhenyuan. Educational Thoughts. Family and Country Feelings. and Feng's Hom.
ISBN 10: 7113177514 ISBN 13: 9787113177515
Lingua: Inglese
Da: liu xing, Nanjing, JS, Cina
EUR 69,37
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Aggiungi al carrellopaperback. Condizione: New. Paperback.Pub Date:2017-02 Pages:186 Language:Chinese Publisher:China Railway Publishing House After more than ten years of development and technological accumulation. my country's high-speed railway technology has become increasingly mature and perfect. With the advancement of the high-speed rail going global strategy. high-speed rail has become a business card of Made in China. Based on the high-speed rail related scientific research projects and achievements in the past ten years. Principl.
Editore: New York : Sotheby's, 1989, 1989
Da: Joseph Valles - Books, Stockbridge, GA, U.S.A.
EUR 67,72
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Aggiungi al carrelloSoft cover. Condizione: Fine. No Jacket. 1 v. (unpaged) : ill. ; 27 cm. ; Sale code: 6027 QICHANG/ Place of sale: New York ; OCLC: 477122841 ; color photographic stiff paper wrappers ; prices realized laid in ; features works by Zhao Mengfu, Jie Jisi, Ni Zan, hu Tinghui, Zheng Yuanyou, Dai Jin, Shen Zhou, Wu Wei, Tang Yin, Zhu Yunming, Wen Zhengming, Chen Shun, Qiu Ying, Qian Gu, Yu Yuanlun, Fan Dongming, Dong Qichang, Chen Jiru, Qian Gong, Huang Biao, Guan Si, Zhang Ruitu, Wang Duo, Lan Ying, Huang Xiangjian, Wang Jian, Xie Bin, Gao Cen, Li Yin, Mei Qing, Da Chongguang, Lai Jing, Zha Shibiao, Sheng Maojun, Zhang Qi, Wu Hong, Ma Quan, Qin Ji, Ye Xin, Fu Shan, Huang Daoqian, Jiang Shijie, Luo Mu, Fa Rouzhen, Wang Hui, Ma Yuanyu, Li Shan, Jiao Bingzhen, Wang Gang, ao Qipei, Jiang Tingxi, Hua Yan, Jin Nong, Zhang Ruoai, Zheng Xie, Huang Shen, Zhang Ruocheng, Dong Bangda, Wang Chen, Qian Feng, Yuan Ying, Fang Xun, Luo Ping, Pan Gongshou, Jiang Wenzai, Sun Shigao, Xi Gang, Tie Bao, Yuan Pei, Zhai Jichang, Weng Luo, Zhu Haonian, Shen Rong, Tang Yifen, Mao Zhou, Qu Yingshao, Su Renshan, Dai Xi, He Shaoji, Su Liupeng, Peng Yulin, Ren Yi, Wu Changshuo, Gu Linshi, Zeng Xi, Qi Baishi, Pu Ru, Pu Jin, Fu Baoshi, Feng Zhikai, Ding Yanyon, Zhang DaiqianLin FengmianWang Kangle, He Haixia, Xu Zhe, Li Xiongcai, Wu Guanzhong, Zhang Shoucheng, Cheng Shifa ; FINE. Book.
ISBN 10: 7030534182 ISBN 13: 9787030534187
Da: liu xing, Nanjing, JS, Cina
EUR 104,45
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Aggiungi al carrellopaperback. Condizione: New. Paperback. Pub Date: 2017-09-01 Pages: $number Language: Chinese Publisher: The Science Press the new interconnect technology of the post-Moore era for the interconnection problems of the post-Moore era integrated circuits. This paper focuses on the technology of Wafer interconnect based on carbon nanomaterials and silicon through-hole in three-dimensional integrated circuit. New interconnection of the post-Moore era IC .