Electronic industry press 1st edition (40 risultati)

Soft cover. Condizione: New. Language:Chinese.Author:BEI JING KE PU CHUANG ZUO XIE HUI.Binding:Soft cover.Publisher:Electronic Industry Press; 1st Edition.

Soft cover. Condizione: New. Language:Chinese.Author:YI LI SHA BAI LAI ER DE.Binding:Soft cover.Publisher:Electronic Industry Press; 1st Edition.

Soft cover. Condizione: New. Language:Chinese.Author:SUN YU.Binding:Soft cover.Publisher:Electronic Industry Press; 1st Edition.

Soft cover. Condizione: New. Language:Chinese.Author:SHANG ZHEN.Binding:Soft cover.Publisher:Electronic Industry Press; 1st Edition.

Soft cover. Condizione: New. Language:Chinese.Author:NI JIN SHENG.Binding:Soft cover.Publisher:Electronic Industry Press; 1st edition (2007 Octob.

Soft cover. Condizione: New. Language:Chinese.Author:BEN SHE.YI MING.Binding:Soft cover.Publisher:Electronic Industry Press; 1st Edition.

Soft cover. Condizione: New. Language:Chinese.Author:LIU ZONG YAO.Binding:Soft cover.Publisher:Electronic Industry Press; 1st Edition.

Soft cover. Condizione: New. Language:Chinese.Author:FEI SI ZHONG SHI DONG MAN CHAN PIN YAN FA ZHONG XIN.Binding:Soft cover.Publisher:electronic industry Press; 1st Edition.

Soft cover. Condizione: New. Language:Chinese.Author:BEN SHE.YI MING.Binding:Soft cover.Publisher:Electronic Industry Press; 1st Edition.

Soft cover. Condizione: New. Language:Chinese.Author:YANG HUA.Binding:Soft cover.Publisher:Electronic Industry Press; 1st Edition.

Soft cover. Condizione: New. Language:Chinese.Author:XI ER.Binding:Soft cover.Publisher:Electronic Industry Press; 1st Edition.

Soft cover. Condizione: New. Language:Chinese.Author:JIE FU LI JI TE MO.Binding:Soft cover.Publisher:Electronic Industry Press; 1st Edition.

Soft cover. Condizione: New. Language:Chinese.Author:HUANG XIN YUAN.Binding:Soft cover.Publisher:Electronic Industry Press; 1st edition (2008 Janua.

paperback. Condizione: New. Paperback. Pub Date: 2011 Pages: 220 in Publisher: Publishing House of Electronics Industry Electronic Information and Electrical disciplines planning materials (Electronic Science and Technology. professional): integrated circuit process design and process simulation. introduced the contemporary system-level IC design The front end. the back end of the placement and routing process to achieve the three main components of an overall technology development. a focus on the computer simulation a. …

Soft cover. Condizione: New. Language:Chinese.Author:BEN SHE.YI MING.Binding:Soft cover.Publisher:Electronic Industry Press; 1st Edition.

Soft cover. Condizione: New. Language:Chinese.Author:LIU LI.Binding:Soft cover.Publisher:Electronic Industry Press; 1st Edition.

Soft cover. Condizione: New. Language:Chinese.Author:YANG JUN.Binding:Soft cover.Publisher:Electronic Industry Press; 1st edition (2010 April.

Soft cover. Condizione: New. Language:Chinese.Author:WANG ER.Binding:Soft cover.Publisher:Electronic Industry Press; 1st edition (2011 Janua.

Soft cover. Condizione: New. Language:Chinese.Author:A ER BEI CI (Richard E.Hayes).Binding:Soft cover.Publisher:Electronic Industry Press; 1st edition (2009 Janua.

Soft cover. Condizione: New. Language:Chinese.Author:BEN SHE,YI MING.Binding:Soft cover.Publisher:Electronic Industry Press; 1st edition (January 1..

Soft cover. Condizione: New. Language:Chinese.Author:LI XIN CHENG.Binding:Soft cover.Publisher:Electronic Industry Press ; 1st Edition.

Hardcover. Condizione: New. Language:Chinese.Author:BEN SHE.YI MING.Binding:HardCover.Publisher:Electronic Industry Press; 1st Edition.

Hardcover. Condizione: New. Language:Chinese.Author:LANG LI.Binding:HardCover.Publisher:Electronic Industry Press; 1st Edition.

Soft cover. Condizione: New. Language:Chinese.Author:XU QIAN.Binding:Soft cover.Publisher:Electronic Industry Press; 1st Edition.

Soft cover. Condizione: New. Language:Chinese.Author:BEN SHE.YI MING.Binding:Soft cover.Publisher:Electronic Industry Press; 1st Edition.

Soft cover. Condizione: New. Language:Chinese.Author:ZHU DI SI BU LAI ER SI.Binding:Soft cover.Publisher:Electronic Industry Press; s 1st Edition.

Soft cover. Condizione: New. Language:Chinese.Author:BEN SHE.YI MING.Binding:Soft cover.Publisher:Electronic Industry Press; 1st Edition.

Soft cover. Condizione: New. Language:Chinese.Author:ZHANG XI XIANG.Binding:Soft cover.Publisher:Electronic Industry Press; 1st Edition.

Soft cover. Condizione: New. Language:Chinese.Author:YANG JING.Binding:Soft cover.Publisher:Electronic Industry Press; 1st Edition.

Soft cover. Condizione: New. Language:Chinese.Author:Mook1.Binding:Soft cover.Publisher:Electronic Industry Press; 1st Edition.