ISBN: 9780071754279 - semiconductor process reliability in practice (15 risultati)

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  • Lingua: Inglese

    Editore: McGraw Hill, 2012

    007175427X / 9780071754279

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  • Lingua: Inglese

    Editore: McGraw Hill, 2012

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  • Lingua: Inglese

    Editore: McGraw Hill, 2012

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  • Lingua: Inglese

    Editore: McGraw Hill, 2012

    007175427X / 9780071754279

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    Da: California Books, Miami, FL, U.S.A.California Books

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  • Lingua: Inglese

    Editore: McGraw-Hill Education - Europe, US, 2012

    007175427X / 9780071754279

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    Hardback. Condizione: New. Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.Proven processes for ensuring semiconductor device reliabilityCo-written by experts in the field, Semiconductor Process Reliability in Practice contains detailed descriptions and analyses of reliability and qualification for semiconductor device manufacturing and discusses the underlying physics and theory. The book covers initial specification definition, test structure design, analysis of test structure data, and final qualification of the process. Real-world examples of test structure designs to qualify front-end-of-line devices and back-end-of-line interconnects are provided in this practical, comprehensive guide.Coverage includes:Basic device physicsProcess flow for MOS manufacturingMeasurements useful for device reliability characterizationHot carrier injectionGate-oxide integrity (GOI) and time-dependentdielectric breakdown (TDDB)Negative bias temperature instabilityPlasma-induced damageElectrostatic discharge protection of integrated circuitsElectromigrationStress migrationIntermetal dielectric breakdown.…

  • Lingua: Inglese

    Editore: McGraw Hill, 2012

    007175427X / 9780071754279

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  • Lingua: Inglese

    Editore: McGraw-Hill Education - Europe, US, 2012

    007175427X / 9780071754279

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    Hardback. Condizione: New. Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.Proven processes for ensuring semiconductor device reliabilityCo-written by experts in the field, Semiconductor Process Reliability in Practice contains detailed descriptions and analyses of reliability and qualification for semiconductor device manufacturing and discusses the underlying physics and theory. The book covers initial specification definition, test structure design, analysis of test structure data, and final qualification of the process. Real-world examples of test structure designs to qualify front-end-of-line devices and back-end-of-line interconnects are provided in this practical, comprehensive guide.Coverage includes:Basic device physicsProcess flow for MOS manufacturingMeasurements useful for device reliability characterizationHot carrier injectionGate-oxide integrity (GOI) and time-dependentdielectric breakdown (TDDB)Negative bias temperature instabilityPlasma-induced damageElectrostatic discharge protection of integrated circuitsElectromigrationStress migrationIntermetal dielectric breakdown.…

  • Lingua: Inglese

    Editore: McGraw-Hill Education - Europe, US, 2012

    007175427X / 9780071754279

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    Hardback. Condizione: New. Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.Proven processes for ensuring semiconductor device reliabilityCo-written by experts in the field, Semiconductor Process Reliability in Practice contains detailed descriptions and analyses of reliability and qualification for semiconductor device manufacturing and discusses the underlying physics and theory. The book covers initial specification definition, test structure design, analysis of test structure data, and final qualification of the process. Real-world examples of test structure designs to qualify front-end-of-line devices and back-end-of-line interconnects are provided in this practical, comprehensive guide.Coverage includes:Basic device physicsProcess flow for MOS manufacturingMeasurements useful for device reliability characterizationHot carrier injectionGate-oxide integrity (GOI) and time-dependentdielectric breakdown (TDDB)Negative bias temperature instabilityPlasma-induced damageElectrostatic discharge protection of integrated circuitsElectromigrationStress migrationIntermetal dielectric breakdown.…

  • Lingua: Inglese

    Editore: McGraw-Hill Education - Europe, US, 2012

    007175427X / 9780071754279

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    Da: Rarewaves.com UK, London, Regno UnitoRarewaves.com UK

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    Hardback. Condizione: New. Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.Proven processes for ensuring semiconductor device reliabilityCo-written by experts in the field, Semiconductor Process Reliability in Practice contains detailed descriptions and analyses of reliability and qualification for semiconductor device manufacturing and discusses the underlying physics and theory. The book covers initial specification definition, test structure design, analysis of test structure data, and final qualification of the process. Real-world examples of test structure designs to qualify front-end-of-line devices and back-end-of-line interconnects are provided in this practical, comprehensive guide.Coverage includes:Basic device physicsProcess flow for MOS manufacturingMeasurements useful for device reliability characterizationHot carrier injectionGate-oxide integrity (GOI) and time-dependentdielectric breakdown (TDDB)Negative bias temperature instabilityPlasma-induced damageElectrostatic discharge protection of integrated circuitsElectromigrationStress migrationIntermetal dielectric breakdown.…

  • Lingua: Inglese

    Editore: The McGraw-Hill Company, 2012

    007175427X / 9780071754279

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    Condizione: New. Print on Demand pp. 624 1st Edition.

  • Lingua: Inglese

    Editore: MCGRAW HILL BOOK CO, 2012

    007175427X / 9780071754279

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    Da: moluna, Greven, Germaniamoluna

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    Gebunden. Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Filled with practical examples, this is a comprehensive reference on process reliability for semiconductor process and design engineers.&Uumlber den AutorrnrnnZhenghao Gan is a reliability technical manager at the Semiconductor Ma.…

  • Lingua: Inglese

    Editore: The McGraw-Hill Company, 2012

    007175427X / 9780071754279

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    Da: Majestic Books, Hounslow, Regno UnitoMajestic Books

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    Condizione: New. Print on Demand pp. 624.

  • Lingua: Inglese

    Editore: The McGraw-Hill Company, 2012

    007175427X / 9780071754279

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    Da: Biblios, frankfurt am main, HESSE, GermaniaBiblios

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    Lingua: Inglese

    Editore: McGraw-Hill, 2012

    007175427X / 9780071754279

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    Buch. Condizione: Neu. Semiconductor Process Reliability in Practice | Zhenghao Gan (u. a.) | Buch | Gebunden | Englisch | 2012 | McGraw-Hill | EAN 9780071754279 | Verantwortliche Person für die EU: Libri GmbH, Europaallee 1, 36244 Bad Hersfeld, gpsr[at]libri[dot]de | Anbieter: preigu Print on Demand.…

  • Lingua: Inglese

    Editore: Mcgraw-Hill, 2012

    007175427X / 9780071754279

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    Buch. Condizione: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.Proven processes for ensuring semiconductor device reliabilityCo-written by experts in the field, Semiconductor Process Reliability in Practice contains detailed descriptions and analyses of reliability and qualification for semiconductor device manufacturing and discusses the underlying physics and theory. The book covers initial specification definition, test structure design, analysis of test structure data, and final qualification of the process. Real-world examples of test structure designs to qualify front-end-of-line devices and back-end-of-line interconnects are provided in this practical, comprehensive guide.Coverage includes:- Basic device physics- Process flow for MOS manufacturing- Measurements useful for device reliability characterization- Hot carrier injection- Gate-oxide integrity (GOI) and time-dependentdielectric breakdown (TDDB)- Negative bias temperature instability- Plasma-induced damage- Electrostatic discharge protection of integrated circuits- Electromigration- Stress migration- Intermetal dielectric breakdown.…