Da: World of Books (was SecondSale), Montgomery, IL, U.S.A.
Condizione: Good. Item in good condition. Textbooks may not include supplemental items i.e. CDs, access codes etc.
Da: Chiron Media, Wallingford, Regno Unito
EUR 120,05
Quantità: Più di 20 disponibili
Aggiungi al carrelloHardcover. Condizione: New.
Da: Majestic Books, Hounslow, Regno Unito
EUR 137,66
Quantità: 3 disponibili
Aggiungi al carrelloCondizione: New. pp. 750.
Da: GreatBookPrices, Columbia, MD, U.S.A.
EUR 156,77
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
Da: Books Puddle, New York, NY, U.S.A.
Condizione: New. pp. 750 2nd Edition.
Lingua: Inglese
Editore: Elsevier Science Publishing Co Inc, 2014
ISBN 10: 0120885743 ISBN 13: 9780120885749
Da: THE SAINT BOOKSTORE, Southport, Regno Unito
EUR 148,89
Quantità: Più di 20 disponibili
Aggiungi al carrelloHardback. Condizione: New. New copy - Usually dispatched within 4 working days.
Da: Biblios, Frankfurt am main, HESSE, Germania
EUR 160,88
Quantità: 3 disponibili
Aggiungi al carrelloCondizione: New. pp. 750.
Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 166,58
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. In.
Da: GreatBookPrices, Columbia, MD, U.S.A.
EUR 181,80
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: As New. Unread book in perfect condition.
Da: GreatBookPricesUK, Woodford Green, Regno Unito
EUR 166,57
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
Da: GreatBookPricesUK, Woodford Green, Regno Unito
EUR 184,04
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: As New. Unread book in perfect condition.
EUR 187,41
Quantità: Più di 20 disponibili
Aggiungi al carrelloKartoniert / Broschiert. Condizione: New. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on fail.
Da: Brook Bookstore On Demand, Napoli, NA, Italia
EUR 118,06
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: new. Questo è un articolo print on demand.
Da: Revaluation Books, Exeter, Regno Unito
EUR 137,10
Quantità: 2 disponibili
Aggiungi al carrelloHardcover. Condizione: Brand New. 2nd edition. 734 pages. 9.00x6.25x1.75 inches. In Stock. This item is printed on demand.
Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germania
EUR 150,00
Quantità: 2 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. 760 pp. Englisch.
Da: AHA-BUCH GmbH, Einbeck, Germania
EUR 158,00
Quantità: 1 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices.