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Aggiungi al carrelloHardcover. Condizione: Brand New. 1st edition. 281 pages. 9.25x6.25x0.75 inches. In Stock.
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Aggiungi al carrelloBuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - Adopting new fabrication technologies not only provides higher integration and enhances performance, but also increases the types of manufacturing defects. With design size in millions of gates and working frequency in GHz timing-related defects havv become a high proportion of the total chip defects. For nanometer technology designs, the stuck-at fault test alone cannot ensure a high quality level of chips. At-speed tests using the transition fault model has become a requirement in technologies below 180nm.Traditional at-speed test methods cannot guarantee high quality test results as they face many new challenges. Supply noise (including IR-drop, ground bounce, and Ldi/dt) effects on chip performance, high test pattern volume, low fault/defect coverage, small delay defect test pattern generation, high cost of test implementation and application, and utilizing low-cost testers are among these challenges. This book discusses these challenges in detail and proposes new techniques and methodologies to improve the overall quality of the transition fault test.
Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germania
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Aggiungi al carrelloBuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Traditional at-speed test methods cannot guarantee high quality test results as they face many new challenges. Supply noise effects on chip performance, high test pattern volume, small delay defect test pattern generation, high cost of test implementation and application, and utilizing low-cost testers are among these challenges. This book discusses these challenges in detail and proposes new techniques and methodologies to improve the overall quality of the transition fault test. 304 pp. Englisch.
Da: moluna, Greven, Germania
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Aggiungi al carrelloGebunden. Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Identifies defects in traditional at-speed test methodsProposes new techniques and methodologes to improve the overall quality of transition fault testsIncludes discussion of the effects of IR-dropProvides an introduction to path del.
Da: preigu, Osnabrück, Germania
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Aggiungi al carrelloBuch. Condizione: Neu. Nanometer Technology Designs | High-Quality Delay Tests | Nisar Ahmed | Buch | xviii | Englisch | 2007 | Springer | EAN 9780387764863 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand.
Lingua: Inglese
Editore: Springer, Springer Dez 2007, 2007
ISBN 10: 0387764860 ISBN 13: 9780387764863
Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germania
EUR 106,99
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Aggiungi al carrelloBuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Adopting new fabrication technologies not only provides higher integration and enhances performance, but also increases the types of manufacturing defects. With design size in millions of gates and working frequency in GHz timing-related defects havv become a high proportion of the total chip defects. For nanometer technology designs, the stuck-at fault test alone cannot ensure a high quality level of chips. At-speed tests using the transition fault model has become a requirement in technologies below 180nm.Traditional at-speed test methods cannot guarantee high quality test results as they face many new challenges. Supply noise (including IR-drop, ground bounce, and Ldi/dt) effects on chip performance, high test pattern volume, low fault/defect coverage, small delay defect test pattern generation, high cost of test implementation and application, and utilizing low-cost testers are among these challenges. This book discusses these challenges in detail and proposes new techniques and methodologies to improve the overall quality of the transition fault test.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 304 pp. Englisch.