Isbn: 9780470511916 - esd testing: from components to systems (18 risultati)

HRD. Condizione: New. New Book. Shipped from UK. Established seller since 2000.

Condizione: new.

Condizione: New.

Condizione: New.

Condizione: New. In English.

Condizione: New.

Condizione: New. Presenting information on electrostatic discharge (ESD) and the characterization of semiconductor devices, this book examines ESD physical models and discusses the test systems and testing and specifications of each model, including the RF ESD test systems and magnetic recording (MR) systems and latchup. Num Pages: 328 pages. BIC Classification: TJFC. Category: (P) Professional & Vocational. Dimension: 252 x 172 x 21. Weight in Grams: 652. . 2016. Hardback. . . . .…

Condizione: New. Dr Steven H. Voldman, IEEE Fellow, Vermont, USADr. Steven H. Voldman is the first IEEE Fellow in the field of electrostatic discharge (ESD) for Contributions in ESD protection in CMOS, Silicon On Insulator and Silicon Germanium Technology. Voldman was a m.

Condizione: New. Presenting information on electrostatic discharge (ESD) and the characterization of semiconductor devices, this book examines ESD physical models and discusses the test systems and testing and specifications of each model, including the RF ESD test systems and magnetic recording (MR) systems and latchup. Num Pages: 328 pages. BIC Classification: TJFC. Category: (P) Professional & Vocational. Dimension: 252 x 172 x 21. Weight in Grams: 652. . 2016. Hardback. . . . . Books ship from the US and Ireland.…

Buch. Condizione: Neu. Neuware - With the evolution of semiconductor technology and global diversification of the semiconductor business, testing of semiconductor devices to systems for electrostatic discharge (ESD) and electrical overstress (EOS) has increased in importance. ESD Testing: From Components to Systems updates the reader in the new tests, test models, and techniques in the characterization of semiconductor components for ESD, EOS, and latchup. Key features: - Provides understanding and knowledge of ESD models and specifications including human body model (HBM), machine model (MM), charged device model (CDM), charged board model (CBM), cable discharge events (CDE), human metal model (HMM), IEC 61000-4-2 and IEC 61000-4-5. - Discusses new testing methodologies such as transmission line pulse (TLP), to very fast transmission line pulse (VF-TLP), and future methods of long pulse TLP, to ultra-fast TLP (UF-TLP). - Describes both conventional testing and new testing techniques for both chip and system level evaluation. - Addresses EOS testing, electromagnetic compatibility (EMC) scanning, to current reconstruction methods. - Discusses latchup characterization and testing methodologies for evaluation of semiconductor technology to product testing. ESD Testing: From Components to Systems is part of the authors' series of books on electrostatic discharge (ESD) protection; this book will be an invaluable reference for the professional semiconductor chip and system-level ESD and EOS test engineer. Semiconductor device and process development, circuit designers, quality, reliability and failure analysis engineers will also find it an essential reference. In addition, its academic treatment will appeal to both senior and graduate students with interests in semiconductor process, device physics, semiconductor testing and experimental work.…

Condizione: As New. Unread book in perfect condition.

Hardcover. Condizione: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Condizione: As New. Unread book in perfect condition.

Condizione: New. pp. 352.

Condizione: New. pp. 352.

Hardcover. Condizione: new. Hardcover. With the evolution of semiconductor technology and global diversification of the semiconductor business, testing of semiconductor devices to systems for electrostatic discharge (ESD) and electrical overstress (EOS) has increased in importance. ESD Testing: From Components to Systems updates the reader in the new tests, test models, and techniques in the characterization of semiconductor components for ESD, EOS, and latchup. Key features: Provides understanding and knowledge of ESD models and specifications including human body model (HBM), machine model (MM), charged device model (CDM), charged board model (CBM), cable discharge events (CDE), human metal model (HMM), IEC 61000-4-2 and IEC 61000-4-5.Discusses new testing methodologies such as transmission line pulse (TLP), to very fast transmission line pulse (VF-TLP), and future methods of long pulse TLP, to ultra-fast TLP (UF-TLP).Describes both conventional testing and new testing techniques for both chip and system level evaluation.Addresses EOS testing, electromagnetic compatibility (EMC) scanning, to current reconstruction methods.Discusses latchup characterization and testing methodologies for evaluation of semiconductor technology to product testing. ESD Testing: From Components to Systems is part of the authors series of books on electrostatic discharge (ESD) protection; this book will be an invaluable reference for the professional semiconductor chip and system-level ESD and EOS test engineer. Semiconductor device and process development, circuit designers, quality, reliability and failure analysis engineers will also find it an essential reference. In addition, its academic treatment will appeal to both senior and graduate students with interests in semiconductor process, device physics, semiconductor testing and experimental work. Presenting information on electrostatic discharge (ESD) and the characterization of semiconductor devices, this book examines ESD physical models and discusses the test systems and testing and specifications of each model, including the RF ESD test systems and magnetic recording (MR) systems and latchup. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.…

Hardcover. Condizione: Brand New. 1st edition. 328 pages. 9.50x6.75x0.75 inches. In Stock. This item is printed on demand.

Condizione: New. PRINT ON DEMAND pp. 352.