Isbn: 9780470907238 - mitigating tin whisker risks: theory and practice: 1 (24 risultati)

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  • Lingua: Inglese

    Editore: Wiley-IEEE Press, 2016

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    Editore: Wiley-IEEE Press, 2016

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    Editore: Wiley, 2016

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  • Lingua: Inglese

    Editore: John Wiley & Sons, 2016

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    Editore: John Wiley & Sons, 2016

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  • Lingua: Inglese

    Editore: Wiley-IEEE Press, 2016

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  • Lingua: Inglese

    Editore: Wiley-IEEE Press, 2016

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  • Lingua: Inglese

    Editore: Wiley-IEEE Press, 2016

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  • Lingua: Inglese

    Editore: John Wiley and Sons Inc, US, 2016

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    Hardback. Condizione: New. Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described. Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distributionExamines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB)Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD)Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries.…

  • Lingua: Inglese

    Editore: Wiley-IEEE Press 2011-05-23, 2011

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    Hardcover. Condizione: New. Brand new book, sourced directly from publisher. Dispatch time is 6-7 days from our warehouse. Book will be sent in robust, secure packaging to ensure it reaches you securely.

  • Lingua: Inglese

    Editore: John Wiley & Sons Inc, New York, 2016

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    Hardcover. Condizione: new. Hardcover. Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described. Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distributionExamines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB)Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD)Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries. Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.…

  • Lingua: Inglese

    Editore: John Wiley & Sons Inc, 2016

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    Hardback. Condizione: New. New copy - Usually dispatched within 4 working days.

  • Lingua: Inglese

    Editore: Wiley-IEEE Press, 2016

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    Condizione: New. In English.

  • Lingua: Inglese

    Editore: Wiley, 2016

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    Condizione: New. Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. Editor(s): Kato, Takahiko; Handwerker, Carol A.; Bath, Jasbir. Series: Wiley Series on Processing of Engineering Materials. Num Pages: 272 pages. BIC Classification: TJ. Category: (P) Professional & Vocational. Dimension: 165 x 243 x 23. Weight in Grams: 586. . 2016. 1st Edition. Hardcover. . . . .…

  • Lingua: Inglese

    Editore: John Wiley & Sons Inc, New York, 2016

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    Hardcover. Condizione: new. Hardcover. Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described. Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distributionExamines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB)Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD)Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries. Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.…

  • Lingua: Inglese

    Editore: John Wiley & Sons, 2016

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    Condizione: New. Takahiko Kato, PhD, is a chief researcher in the Center for Technology Innovation - Materials, Research & Development Group at Hitachi Ltd, Tokyo, Japan. He is also a Guest Professor in the Center for Advanced Research of Energy and Materials at Hokkaido Un.

  • Lingua: Inglese

    Editore: John Wiley & Sons Inc, 2016

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    Hardcover. Condizione: Brand New. 1st edition. 272 pages. 8.00x5.00x1.00 inches. In Stock.

  • Lingua: Inglese

    Editore: Wiley, 2016

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    Condizione: New. Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. Editor(s): Kato, Takahiko; Handwerker, Carol A.; Bath, Jasbir. Series: Wiley Series on Processing of Engineering Materials. Num Pages: 272 pages. BIC Classification: TJ. Category: (P) Professional & Vocational. Dimension: 165 x 243 x 23. Weight in Grams: 586. . 2016. 1st Edition. Hardcover. . . . . Books ship from the US and Ireland.…

  • Lingua: Inglese

    Editore: John Wiley and Sons Inc, US, 2016

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    Hardback. Condizione: New. Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described. Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distributionExamines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB)Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD)Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries.…

  • Lingua: Inglese

    Editore: John Wiley & Sons Mai 2016, 2016

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    Buch. Condizione: Neu. Neuware - Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risksThis book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described.\* Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distribution\* Examines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB)\* Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD)\* Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskersMitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries.…

  • Lingua: Inglese

    Editore: John Wiley & Sons Inc, New York, 2016

    0470907231 / 9780470907238

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    Hardcover. Condizione: new. Hardcover. Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described. Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distributionExamines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB)Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD)Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries. Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.…

  • Lingua: Inglese

    Editore: John Wiley & Sons Inc, 2016

    0470907231 / 9780470907238

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    Hardcover. Condizione: Brand New. 1st edition. 272 pages. 8.00x5.00x1.00 inches. In Stock. This item is printed on demand.

  • Lingua: Inglese

    Editore: John Wiley & Sons, 2016

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    Condizione: New. PRINT ON DEMAND pp. 300.