Da: HPB-Red, Dallas, TX, U.S.A.
Hardcover. Condizione: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
Da: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.
Condizione: New. Brand New. Soft Cover International Edition. Different ISBN and Cover Image. Priced lower than the standard editions which is usually intended to make them more affordable for students abroad. The core content of the book is generally the same as the standard edition. The country selling restrictions may be printed on the book but is no problem for the self-use. This Item maybe shipped from US or any other country as we have multiple locations worldwide.
Da: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.
Condizione: New. Brand New. Soft Cover International Edition. Different ISBN and Cover Image. Priced lower than the standard editions which is usually intended to make them more affordable for students abroad. The core content of the book is generally the same as the standard edition. The country selling restrictions may be printed on the book but is no problem for the self-use. This Item maybe shipped from US or any other country as we have multiple locations worldwide.
Condizione: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
Condizione: New.
EUR 161,89
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. Brand New.
Condizione: As New. Unread book in perfect condition.
Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 182,77
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Aggiungi al carrelloCondizione: New. In.
EUR 182,76
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Aggiungi al carrelloCondizione: New.
Lingua: Inglese
Editore: John Wiley & Sons Inc, Chicester, 2007
ISBN 10: 0471780464 ISBN 13: 9780471780465
Da: Grand Eagle Retail, Bensenville, IL, U.S.A.
Hardcover. Condizione: new. Hardcover. This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk. Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include: * Preliminary Concepts * Parasitic Resistances, Capacitances, and Inductances * Interconnection Delays * Crosstalk Analysis * Electromigration-Induced Failure Analysis * Future Interconnections High-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering. Updated to reflect the major developments in field of VLSI interconnections over the past decade, this Second Edition of High-Speed VLSI Interconnections includes new sections on Parasitic Inductances, Nanotechnology circuit interconnects, Electromigrations in the copper interconnections, and Optical Interconnections. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
EUR 190,12
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Aggiungi al carrelloCondizione: As New. Unread book in perfect condition.
Da: Ubiquity Trade, Miami, FL, U.S.A.
EUR 233,25
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. Brand new! Please provide a physical shipping address.
EUR 220,34
Quantità: 15 disponibili
Aggiungi al carrelloCondizione: New. 2007. 2nd Revised edition. Hardcover. Updated to reflect the major developments in field of VLSI interconnections over the past decade, this Second Edition of High-Speed VLSI Interconnections includes new sections on Parasitic Inductances, Nanotechnology circuit interconnects, Electromigrations in the copper interconnections, and Optical Interconnections. Series: Wiley Series in Microwave and Optical Engineering. Num Pages: 432 pages, Illustrations. BIC Classification: TJFC. Category: (P) Professional & Vocational. Dimension: 236 x 163 x 25. Weight in Grams: 730. . . . . .
EUR 200,47
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. AShok k. Goel, PhD, is Associate Professor of Electrical Engineering at Michigan Technological University. He is the author of more than thirty journal publications and numerous conference proceedings. His research interests include nanotechnology circuit d.
EUR 264,52
Quantità: 2 disponibili
Aggiungi al carrelloHardcover. Condizione: Brand New. 2nd edition. 407 pages. 9.50x6.50x1.25 inches. In Stock.
Condizione: New. 2007. 2nd Revised edition. Hardcover. Updated to reflect the major developments in field of VLSI interconnections over the past decade, this Second Edition of High-Speed VLSI Interconnections includes new sections on Parasitic Inductances, Nanotechnology circuit interconnects, Electromigrations in the copper interconnections, and Optical Interconnections. Series: Wiley Series in Microwave and Optical Engineering. Num Pages: 432 pages, Illustrations. BIC Classification: TJFC. Category: (P) Professional & Vocational. Dimension: 236 x 163 x 25. Weight in Grams: 730. . . . . . Books ship from the US and Ireland.
Condizione: New. pp. xix + 407 2nd Edition.
EUR 298,89
Quantità: 1 disponibili
Aggiungi al carrelloCondizione: New. pp. xix + 407 Illus.
Lingua: Inglese
Editore: John Wiley & Sons Sep 2007, 2007
ISBN 10: 0471780464 ISBN 13: 9780471780465
Da: AHA-BUCH GmbH, Einbeck, Germania
EUR 247,31
Quantità: 2 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. Neuware - This Second Edition focuses on emerging topics and advances in the field of VLSI interconnectionsIn the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk.Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include:\*Preliminary Concepts\*Parasitic Resistances, Capacitances, and Inductances\*Interconnection Delays\*Crosstalk Analysis\*Electromigration-Induced Failure Analysis\*Future InterconnectionsHigh-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering.
Lingua: Inglese
Editore: John Wiley & Sons Inc, Chicester, 2007
ISBN 10: 0471780464 ISBN 13: 9780471780465
Da: AussieBookSeller, Truganina, VIC, Australia
EUR 319,24
Quantità: 1 disponibili
Aggiungi al carrelloHardcover. Condizione: new. Hardcover. This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk. Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include: * Preliminary Concepts * Parasitic Resistances, Capacitances, and Inductances * Interconnection Delays * Crosstalk Analysis * Electromigration-Induced Failure Analysis * Future Interconnections High-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering. Updated to reflect the major developments in field of VLSI interconnections over the past decade, this Second Edition of High-Speed VLSI Interconnections includes new sections on Parasitic Inductances, Nanotechnology circuit interconnects, Electromigrations in the copper interconnections, and Optical Interconnections. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.
Da: PBShop.store UK, Fairford, GLOS, Regno Unito
EUR 185,98
Quantità: Più di 20 disponibili
Aggiungi al carrelloHRD. Condizione: New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
Lingua: Inglese
Editore: John Wiley & Sons Inc, Chicester, 2007
ISBN 10: 0471780464 ISBN 13: 9780471780465
Da: CitiRetail, Stevenage, Regno Unito
EUR 195,36
Quantità: 1 disponibili
Aggiungi al carrelloHardcover. Condizione: new. Hardcover. This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk. Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include: * Preliminary Concepts * Parasitic Resistances, Capacitances, and Inductances * Interconnection Delays * Crosstalk Analysis * Electromigration-Induced Failure Analysis * Future Interconnections High-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering. Updated to reflect the major developments in field of VLSI interconnections over the past decade, this Second Edition of High-Speed VLSI Interconnections includes new sections on Parasitic Inductances, Nanotechnology circuit interconnects, Electromigrations in the copper interconnections, and Optical Interconnections. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.