Isbn: 9780471954828 - failure mechanisms in semiconductor devices (18 risultati)

Condizione: Good. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Ex-library, so some stamps and wear, but in good overall condition. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions.…

HRD. Condizione: New. New Book. Shipped from UK. Established seller since 2000.

Condizione: New.

Condizione: new.

Condizione: New.

Condizione: As New. Unread book in perfect condition.

Condizione: New. In English.

Condizione: As New. Unread book in perfect condition.

Hardback. Condizione: New. 2nd. In dieser zweiten, aktualisierten Auflage identifizieren die Autoren die Ursachen und Mechanismen, die zu Ausfällen von Halbleiterbauelementen führen. Durch Erkennungsmethoden und Technologien zur Vermeidung von Defekten, die in diesem Buch ausführlich beschrieben werden, wird die Zuverlässigkeit der Bauelemente in der Praxis entscheidend bestimmt.…

Condizione: New. In this second edition, the authors identify the sources of failure mechanism in semiconductor devices, examine possible detection and elimination techniques, and determine the effectiveness of reliability devices. The references have been updated and recent advances are discussed. Num Pages: 358 pages, Illustrations. BIC Classification: PHFC; TGMT; TGPR; TJFD5. Category: (P) Professional & Vocational. Dimension: 239 x 165 x 25. Weight in Grams: 676. . 1997. 2nd Edition. Hardcover. . . . . …

Gebunden. Condizione: New. Failure Mechanisms in Semiconductor Devices Second Edition E. Ajith Amerasekera Texas Instruments Inc., Dallas, USA Farid N. Najm University of Illinois at Urbana-Champaign, USA Since the successful first edition of Failure Mechanisms in Semiconductor Devic.

Condizione: New.

Hardback. Condizione: New. 2nd. Failure Mechanisms in Semiconductor Devices Second Edition E. Ajith Amerasekera Texas Instruments Inc., Dallas, USA Farid N. Najm University of Illinois at Urbana-Champaign, USA Since the successful first edition of Failure Mechanisms in Semiconductor Devices, semiconductor technology has become increasingly important. The high complexity of today's integrated circuits has engendered a demand for greater component reliability. Reflecting the need for guaranteed performance in consumer applications, this thoroughly updated edition includes more detailed material on reliability modelling and prediction. The book analyses the main failure mechanisms in terms of cause, effects and prevention and explains the mathematics behind reliability analysis. The authors detail methodologies for the identification of failures and describe the approaches for building reliability into semiconductor devices. Their thorough yet accessible text covers the physics of failure mechanisms from the semiconductor die itself to the packaging and interconnections. Incorporating recent advances, this comprehensive survey of semiconductor reliability will be an asset to both engineers and graduate students in the field. …

Condizione: New. In this second edition, the authors identify the sources of failure mechanism in semiconductor devices, examine possible detection and elimination techniques, and determine the effectiveness of reliability devices. The references have been updated and recent advances are discussed. Num Pages: 358 pages, Illustrations. BIC Classification: PHFC; TGMT; TGPR; TJFD5. Category: (P) Professional & Vocational. Dimension: 239 x 165 x 25. Weight in Grams: 676. . 1997. 2nd Edition. Hardcover. . . . . Books ship from the US and Ireland. …

Hardcover. Condizione: Brand New. 2nd sub edition. 345 pages. 9.50x6.50x1.00 inches. In Stock.

Hardcover. Condizione: new. Hardcover. Failure Mechanisms in Semiconductor Devices Second Edition E. Ajith Amerasekera Texas Instruments Inc., Dallas, USA Farid N. Najm University of Illinois at Urbana-Champaign, USA Since the successful first edition of Failure Mechanisms in Semiconductor Devices, semiconductor technology has become increasingly important. The high complexity of today's integrated circuits has engendered a demand for greater component reliability. Reflecting the need for guaranteed performance in consumer applications, this thoroughly updated edition includes more detailed material on reliability modelling and prediction. The book analyses the main failure mechanisms in terms of cause, effects and prevention and explains the mathematics behind reliability analysis. The authors detail methodologies for the identification of failures and describe the approaches for building reliability into semiconductor devices. Their thorough yet accessible text covers the physics of failure mechanisms from the semiconductor die itself to the packaging and interconnections. Incorporating recent advances, this comprehensive survey of semiconductor reliability will be an asset to both engineers and graduate students in the field. In this second edition, the authors identify the sources of failure mechanism in semiconductor devices, examine possible detection and elimination techniques, and determine the effectiveness of reliability devices. The references have been updated and recent advances are discussed. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability. …

Condizione: New. pp. 358 This item is printed on demand.

Hardcover. Condizione: Brand New. 2nd sub edition. 345 pages. 9.50x6.50x1.00 inches. In Stock. This item is printed on demand.