9780792397342 - synthesis of power distribution to manage signal integrity in mixed-signal ics di stanisic, balsha r.; carley, l. richard; rutenbar, rob a. (20 risultati)
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Hardcover. Condizione: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority.
Lingua: Inglese
Editore: Kluwer Academic Publishers, Norwell, Massachusetts, U.S.A., 1996
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hardcover. Condizione: Very Good. No Dust Jacket. First Edition. Hardcover with black lettering on spine and upper board and contents in almost new condition, showing minimal signs of wear. Previous owner's name on FEP. No dust jacket. T. Used.
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hardcover. Condizione: New. In shrink wrap. Looks like an interesting title.
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Condizione: Très bon. Synthesis of Power Distribution to Manage Signal Integrity in Mixed-Signal Ics| Stanisic, Balsha R.; Rutenbar, Rob A.; Carley, L. Richard | Kluwer, 1996. In-8° cartonné, 206p . Couverture propre . Dos solide. Intérieur frais sans soulignage ou annotation. Exemplaire de bibliothèque : petit code barre en pie…d de 1re de couv., cotation au dos, rares et discrets petits tampons à l'intérieur de l'ouvrage.Très bon état général pour cet ouvrage. [Ba 52] Pour les expéditions internationales, nous consulter au préalable pour l ajustement des frais de port qui seront peut-être revus à la baisse/ For international shipments, please contact us in advance to adjust shipping costs. |.
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Da: Ria Christie Collections, Uxbridge, Regno UnitoRia Christie Collections
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Condizione: New. In.
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Da: moluna, Greven, Germaniamoluna
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Gebunden. Condizione: New.
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Da: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrlandaKennys Bookshop and Art Galleries Ltd.
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Condizione: New. Describes algorithms for analog power distribution synthesis and demonstrates their effectiveness. This book addresses power distribution synthesis for mixed-signal integrated circuits. It also describes several key challenges in power distribution design are identified and automated methods to overcome them. Nu…m Pages: 208 pages, biography. BIC Classification: TJFC. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 14. Weight in Grams: 509. . 1996. 1996th Edition. hardcover. . . . .
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Da: Books Puddle, New York, NY, U.S.A.Books Puddle
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Condizione: New. pp. 236.
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Da: Buchpark, Trebbin, GermaniaBuchpark
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Condizione: Gut. Zustand: Gut | Sprache: Englisch | Produktart: Bücher | In the early days of VLSI, the design of the power distribution for an integrated cir cuit was rather simple. Power distribution --the design of the geometric topology for the network of wires that connect the various power supplies, the widths of the indi… vidual segments for each of these wires, the number and location of the power I/O pins around the periphery of the chip --was simple because the chips were simpler. Few available wiring layers forced floorplans that allowed simple, planar (non-over lapping) power networks. Lower speeds and circuit density made the choice of the wire widths easier: we made them just fat enough to avoid resistive voltage drops due to switching currents in the supply network. And we just didn't need enormous num bers of power and ground pins on the package for the chips to work. It's not so simple any more. Increased integration has forced us to focus on reliability concerns such as metal elec tromigration, which affects wire sizing decisions in the power network. Extra metal layers have allowed more flexibility in the topological layout of the power networks.
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Da: Kennys Bookstore, Olney, MD, U.S.A.Kennys Bookstore
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EUR 168,93
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Condizione: New. Describes algorithms for analog power distribution synthesis and demonstrates their effectiveness. This book addresses power distribution synthesis for mixed-signal integrated circuits. It also describes several key challenges in power distribution design are identified and automated methods to overcome them. Nu…m Pages: 208 pages, biography. BIC Classification: TJFC. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 14. Weight in Grams: 509. . 1996. 1996th Edition. hardcover. . . . . Books ship from the US and Ireland.
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Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH
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Buch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - In the early days of VLSI, the design of the power distribution for an integrated cir cuit was rather simple. Power distribution --the design of the geometric topology for the network of wires that connect the various power supplies, the widths of the in…di vidual segments for each of these wires, the number and location of the power I/O pins around the periphery of the chip --was simple because the chips were simpler. Few available wiring layers forced floorplans that allowed simple, planar (non-over lapping) power networks. Lower speeds and circuit density made the choice of the wire widths easier: we made them just fat enough to avoid resistive voltage drops due to switching currents in the supply network. And we just didn't need enormous num bers of power and ground pins on the package for the chips to work. It's not so simple any more. Increased integration has forced us to focus on reliability concerns such as metal elec tromigration, which affects wire sizing decisions in the power network. Extra metal layers have allowed more flexibility in the topological layout of the power networks.
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Da: GreatBookPricesUK, Woodford Green, Regno UnitoGreatBookPricesUK
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Condizione: As New. Unread book in perfect condition.
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Da: Mispah books, Redhill, SURRE, Regno UnitoMispah books
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Hardcover. Condizione: Like New. Like New. book.
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Condizione: As New. Unread book in perfect condition.
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Da: Majestic Books, Hounslow, Regno UnitoMajestic Books
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Condizione: New. Print on Demand pp. 236 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam.
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Da: Biblios, frankfurt am main, HESSE, GermaniaBiblios
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Condizione: New. PRINT ON DEMAND pp. 236.
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Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germaniabuchversandmimpf2000
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Buch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -In the early days of VLSI, the design of the power distribution for an integrated cir cuit was rather simple. Power distribution --the design of the geometric topology for the network of wires that connect the various power supplies, the widt…hs of the indi vidual segments for each of these wires, the number and location of the power I/O pins around the periphery of the chip --was simple because the chips were simpler. Few available wiring layers forced floorplans that allowed simple, planar (non-over lapping) power networks. Lower speeds and circuit density made the choice of the wire widths easier: we made them just fat enough to avoid resistive voltage drops due to switching currents in the supply network. And we just didn't need enormous num bers of power and ground pins on the package for the chips to work. It's not so simple any more. Increased integration has forced us to focus on reliability concerns such as metal elec tromigration, which affects wire sizing decisions in the power network. Extra metal layers have allowed more flexibility in the topological layout of the power networks.Springer-Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 236 pp. Englisch.
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Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermaniaBuchWeltWeit Ludwig Meier e.K.
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Buch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -In the early days of VLSI, the design of the power distribution for an integrated cir cuit was rather simple. Power distribution --the design of the geometric topology for the network of wires that connect the various power supplies, the…widths of the indi vidual segments for each of these wires, the number and location of the power I/O pins around the periphery of the chip --was simple because the chips were simpler. Few available wiring layers forced floorplans that allowed simple, planar (non-over lapping) power networks. Lower speeds and circuit density made the choice of the wire widths easier: we made them just fat enough to avoid resistive voltage drops due to switching currents in the supply network. And we just didn't need enormous num bers of power and ground pins on the package for the chips to work. It's not so simple any more. Increased integration has forced us to focus on reliability concerns such as metal elec tromigration, which affects wire sizing decisions in the power network. Extra metal layers have allowed more flexibility in the topological layout of the power networks. 236 pp. Englisch.
