Isbn: 9780803104037 - semiconductor processing: a symposium (4 risultati)

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EUR 27,21
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Condizione: good. A copy that has been read, remains in good condition. All pages are intact, and the cover is intact. The spine and cover show signs of wear. Pages can include notes and highlighting and show signs of wear, and the copy can include "From the library of" labels or previous owner inscriptions. 100% GUARANTEE! Shipped with delivery confirmation, if you're not satisfied with purchase please return item! Ships via media mail.…

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EUR 24,60
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hardcover. Condizione: Very Good. Connecting readers with great books since 1972! Used books may not include companion materials, and may have some shelf wear or limited writing. We ship orders daily and Customer Service is our top priority.

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Da: BookDepart, Shepherdstown, WV, U.S.A.BookDepart
Contatta il venditoreVenditore con 5 stelleCondizione: Usato - Molto buono
EUR 32,32
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Hardcover. Condizione: UsedVeryGood. Hardcover; ASTM Special Technical Publication 850; symposium held in San Jo se, California, Feb. 7-10, 1984; light fading, light shelf wear to cover; f ormer owner's name written inside front board; otherwise in very good condi tion with clean text, firm binding.
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Da: 100POCKETS, Berkeley, CA, U.S.A.100POCKETS
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EUR 34,19
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Hardcover. Condizione: New. Condizione sovraccoperta: None as Issued. First Edition. First Thus. Text/BRAND NEW & Bright First Edition, First Thus. Illustrated blue boards/NF; rub to lower back corner tip & light shelfwear. DJ/None as Issued. Papers presented at the 3rd ASTM Symposium on Semiconductor Processing, San Jose, Feb 7 - 10, 1984. Special Technical Publication 850. 671 pgs in 7 sections: 1, Standards in Semiconductor Industry; 2, Fabrication Technology; 3, Control of Particulate Contamination; 4, Defects & Gettering Techniques; 5, Material & Process Characterization; 6, Interconnection Technology: Wire & Tape Bonding; 7, Neutron Transmutation Doping Techniques & Facilities, followed by 3 appendices. Fine copy.…