9781032881140 - practical guide for the reliable packaging of electronics: thermal and mechanical design and analysis di jamnia, ali (15 risultati)
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Da: California Books, Miami, FL, U.S.A.California Books
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Da: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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Da: GreatBookPricesUK, Woodford Green, Regno UnitoGreatBookPricesUK
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Da: Ria Christie Collections, Uxbridge, Regno UnitoRia Christie Collections
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Da: Majestic Books, Hounslow, Regno UnitoMajestic Books
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Da: Books Puddle, New York, NY, U.S.A.Books Puddle
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EUR 211,69
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Condizione: New. 4th edition NO-PA16APR2015-KAP.
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Da: Biblios, frankfurt am main, HESSE, GermaniaBiblios
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Da: THE SAINT BOOKSTORE, Southport, Regno UnitoTHE SAINT BOOKSTORE
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Hardback. Condizione: New. New copy - Usually dispatched within 4 working days.
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Da: Revaluation Books, Exeter, Regno UnitoRevaluation Books
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Hardcover. Condizione: Brand New. 4th edition. 352 pages. 9.18x6.12x9.45 inches. In Stock.
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Da: Grand Eagle Retail, Bensenville, IL, U.S.A.Grand Eagle Retail
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Hardcover. Condizione: new. Hardcover. A definitive guide for both newcomers to the field and those in need of a refresher, the fourth edition of Practical Guide to the Reliable Packaging of Electronics provides a comprehensive understanding of the thermal and mechanical aspects of electromechanical system design, along with ins…ights into potential failures. This edition equips design engineers with the tools to assess their work in the early stages of development, helping them identify and address weak points before they lead to system failures.As the demand for integrating more electronic capabilities into smaller packages continues to rise, product developers and manufacturers must carefully consider how module placement and component selection impact performance. This updated edition features expanded content, including advancements in cooling technologies and materials, guidance on vibration isolation and design challenges, deeper insights into system and subsystem reliability, robust test method development, and a newly added section on applying Six Sigma DMAIC methodology for thermal and mechanical failure analysis.By consulting this essential resource, engineers, program managers, and quality assurance professionals involved in electromechanical systems will gain a solid foundation in electronics packaging. Readers will learn to establish design guidelines, recognize potential reliability issues, and perform more thorough analyses, ultimately leading to more reliable and efficient system designs. The fourth edition of Practical Guide to the Reliable Packaging of Electronics provides a comprehensive understanding of the thermal and mechanical aspects of electromechanical system design, along with insights into potential failures. This item is printed on demand. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
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Da: CitiRetail, Stevenage, Regno UnitoCitiRetail
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EUR 153,71
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Hardcover. Condizione: new. Hardcover. A definitive guide for both newcomers to the field and those in need of a refresher, the fourth edition of Practical Guide to the Reliable Packaging of Electronics provides a comprehensive understanding of the thermal and mechanical aspects of electromechanical system design, along with ins…ights into potential failures. This edition equips design engineers with the tools to assess their work in the early stages of development, helping them identify and address weak points before they lead to system failures.As the demand for integrating more electronic capabilities into smaller packages continues to rise, product developers and manufacturers must carefully consider how module placement and component selection impact performance. This updated edition features expanded content, including advancements in cooling technologies and materials, guidance on vibration isolation and design challenges, deeper insights into system and subsystem reliability, robust test method development, and a newly added section on applying Six Sigma DMAIC methodology for thermal and mechanical failure analysis.By consulting this essential resource, engineers, program managers, and quality assurance professionals involved in electromechanical systems will gain a solid foundation in electronics packaging. Readers will learn to establish design guidelines, recognize potential reliability issues, and perform more thorough analyses, ultimately leading to more reliable and efficient system designs. The fourth edition of Practical Guide to the Reliable Packaging of Electronics provides a comprehensive understanding of the thermal and mechanical aspects of electromechanical system design, along with insights into potential failures. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.
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Da: AussieBookSeller, Truganina, VIC, AustraliaAussieBookSeller
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EUR 269,52
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Hardcover. Condizione: new. Hardcover. A definitive guide for both newcomers to the field and those in need of a refresher, the fourth edition of Practical Guide to the Reliable Packaging of Electronics provides a comprehensive understanding of the thermal and mechanical aspects of electromechanical system design, along with ins…ights into potential failures. This edition equips design engineers with the tools to assess their work in the early stages of development, helping them identify and address weak points before they lead to system failures.As the demand for integrating more electronic capabilities into smaller packages continues to rise, product developers and manufacturers must carefully consider how module placement and component selection impact performance. This updated edition features expanded content, including advancements in cooling technologies and materials, guidance on vibration isolation and design challenges, deeper insights into system and subsystem reliability, robust test method development, and a newly added section on applying Six Sigma DMAIC methodology for thermal and mechanical failure analysis.By consulting this essential resource, engineers, program managers, and quality assurance professionals involved in electromechanical systems will gain a solid foundation in electronics packaging. Readers will learn to establish design guidelines, recognize potential reliability issues, and perform more thorough analyses, ultimately leading to more reliable and efficient system designs. The fourth edition of Practical Guide to the Reliable Packaging of Electronics provides a comprehensive understanding of the thermal and mechanical aspects of electromechanical system design, along with insights into potential failures. This item is printed on demand. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.
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Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 228,45
EUR 63,33 spedizioneSpedito da Germania a U.S.A.Quantità: 1 disponibili
Buch. Condizione: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - A definitive guide for both newcomers to the field and those in need of a refresher, the fourth edition of Practical Guide to the Reliable Packaging of Electronics provides a comprehensive understanding of the thermal and mechanical aspects of… electromechanical system design, along with insights into potential failures. This edition equips design engineers with the tools to assess their work in the early stages of development, helping them identify and address weak points before they lead to system failures.
