Isbn: 9781138075405 - semiconductor packaging: materials interaction and reliability (21 risultati)

Condizione: Good. : En la fabricación de semiconductores, es fundamental comprender cómo se comportan e interactúan los diversos materiales para crear un paquete de semiconductores robusto y confiable. 'Semiconductor Packaging: Materials Interaction and Reliability' proporciona una comprensión fundamental de las propiedades físicas subyacentes de los materiales utilizados en un paquete de semiconductores. El libro se centra en un paso importante en el ensamblaje y las pruebas de paquetes de fabricación de semiconductores. Cubre los conceptos básicos de las propiedades de los materiales y explica cómo determinar qué comportamientos son importantes para el rendimiento del paquete. Los autores también analizan cómo las propiedades de los materiales de embalaje interactúan entre sí y exploran cómo maximizar el rendimiento de estos materiales con respecto a la integridad y la confiabilidad del paquete. Al unir los elementos dispares esenciales para un paquete de semiconductores, este libro de fácil lectura muestra cómo todas las partes encajan y funcionan juntas para brindar una protección duradera para el chip de circuito integrado en el interior, así como un medio para que el chip se comunique con el mundo exterior. EAN: 9781138075405 Tipo: Libros Categoría: Tecnología Título: Semiconductor Packaging Autor: Andrea Chen Idioma: en Páginas: 216 Formato: tapa dura.…

Condizione: As New. Unread book in perfect condition.

Condizione: New.

Condizione: New. pp. 216.

Condizione: New. pp. 216.

Condizione: New.

Condizione: As New. Unread book in perfect condition.

Paperback / softback. Condizione: New. New copy - Usually dispatched within 4 working days.

Condizione: New.

Condizione: New. pp. 216.

Condizione: New. In English.

Paperback. Condizione: New. In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. The book focuses on an important step in semiconductor manufacturing-package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance. The authors also discuss how the properties of packaging materials interact with each another and explore how to maximize the performance of these materials in regard to package integrity and reliability.By tying together the disparate elements essential to a semiconductor package, this easy-to-read book shows how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world.…

Paperback. Condizione: Brand New. 216 pages. 9.21x6.14x0.63 inches. In Stock.

Taschenbuch. Condizione: Neu. Semiconductor Packaging | Materials Interaction and Reliability | Andrea Chen (u. a.) | Taschenbuch | Einband - flex.(Paperback) | Englisch | 2017 | CRC Press | EAN 9781138075405 | Verantwortliche Person für die EU: Libri GmbH, Europaallee 1, 36244 Bad Hersfeld, gpsr[at]libri[dot]de | Anbieter: preigu. …

Paperback. Condizione: New. New. book.

Paperback. Condizione: New. In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. The book focuses on an important step in semiconductor manufacturing-package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance. The authors also discuss how the properties of packaging materials interact with each another and explore how to maximize the performance of these materials in regard to package integrity and reliability.By tying together the disparate elements essential to a semiconductor package, this easy-to-read book shows how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world.…

PAP. Condizione: New. New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.

PAP. Condizione: New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.

Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. The book focuses on an important step in semiconductor manufacturing-package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance. The authors also discuss how the properties of packaging materials interact with each another and explore how to maximize the performance of these materials in regard to package integrity and reliability.By tying together the disparate elements essential to a semiconductor package, this easy-to-read book shows how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. 218 pp. Englisch.…

Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Andrea Chen is a technical marketing manager at Siliconware USA, Inc. She previously worked in the Technology Development group at ChipPAC, Inc. and in the Package Technology group at National Semiconductor Corporation. She has coauthore.…

Taschenbuch. Condizione: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. The book focuses on an important step in semiconductor manufacturing-package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance. The authors also discuss how the properties of packaging materials interact with each another and explore how to maximize the performance of these materials in regard to package integrity and reliability.By tying together the disparate elements essential to a semiconductor package, this easy-to-read book shows how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world.…