9781394289950 - artificial plasmonics for vlsi interconnects: bridging the gap between electronics and optics di joy, soumitra r.; mazumder, pinaki (20 risultati)
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Da: PBShop.store UK, Fairford, GLOS, Regno UnitoPBShop.store UK
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Da: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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Da: Brook Bookstore On Demand, Napoli, NA, ItaliaBrook Bookstore On Demand
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Da: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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EUR 134,10
EUR 2,28 spedizioneSpedito in U.S.A.Quantità: Più di 20 disponibili
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Da: GreatBookPricesUK, Woodford Green, Regno UnitoGreatBookPricesUK
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EUR 123,74
EUR 17,53 spedizioneSpedito da Regno Unito a U.S.A.Quantità: Più di 20 disponibili
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Da: Ria Christie Collections, Uxbridge, Regno UnitoRia Christie Collections
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EUR 134,02
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Condizione: New. In English.
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Da: California Books, Miami, FL, U.S.A.California Books
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Da: GreatBookPricesUK, Woodford Green, Regno UnitoGreatBookPricesUK
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EUR 140,30
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Da: THE SAINT BOOKSTORE, Southport, Regno UnitoTHE SAINT BOOKSTORE
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Hardback. Condizione: New. New copy - Usually dispatched within 4 working days.
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Da: Majestic Books, Hounslow, Regno UnitoMajestic Books
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Condizione: New.
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- Prima edizione
Da: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrlandaKennys Bookshop and Art Galleries Ltd.
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EUR 167,07
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Condizione: New. 2025. 1st Edition. hardcover. . . . . .
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Da: Books Puddle, New York, NY, U.S.A.Books Puddle
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EUR 180,52
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Condizione: New. 1st edition NO-PA16APR2015-KAP.
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Da: moluna, Greven, Germaniamoluna
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EUR 140,96
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Condizione: New.
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Da: Kennys Bookstore, Olney, MD, U.S.A.Kennys Bookstore
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Condizione: New. 2025. 1st Edition. hardcover. . . . . . Books ship from the US and Ireland.
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Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH
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EUR 193,00
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Buch. Condizione: Neu. Neuware - Build the microchips of the future with this revolutionary new information transfer technology Advancements in high-performance computing have continually demanded for progress in disruptive technological research and innovations. Moore's Law has pushed the Very Large Scale Integration (VLSI) tec…hnology to pack MOS devices inside a chip at an exponential rate, thereby surpassing now eight billion transistors per cm2. This has concomitantly fueled the growth of multilayered on-chip interconnects comprising metallic and low dielectric materials. Artificial Plasmonics for VLSI Interconnects introduces a new method for improving chip performance by harnessing the power of information transfer among chips at terahertz frequency. This revolutionary new electromagnetic wave engineering, called a spoof surface plasmon polariton, adapts the principles of VLSI and terahertz interconnect technology along with the artificial plasmonics to transfer huge quantities of data at vastly improved speeds. It constitutes a potentially decisive contribution to the pursuit of faster and more capacious VLSI chips. In Artificial Plasmonics for VLSI Interconnects, readers will also find: - A cutting-edge new approach supported by pioneering research - Detailed discussion of essential components related to the development of THz interconnect technology, including theory, modeling, simulation, and validation - Roadmap to future technological development in the branch of artificial plasmonics Artificial Plasmonics for VLSI Interconnects is ideal for engineers, researchers, and scientists working in electronics, electromagnetics, and optics.
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Da: Grand Eagle Retail, Bensenville, IL, U.S.A.Grand Eagle Retail
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EUR 150,52
Spedizione gratuitaSpedito in U.S.A.Quantità: 1 disponibili
Hardcover. Condizione: new. Hardcover. Build the microchips of the future with this revolutionary new information transfer technology Advancements in high-performance computing have continually demanded for progress in disruptive technological research and innovations. Moores Law has pushed the Very Large Scale Integration (VLSI…) technology to pack MOS devices inside a chip at an exponential rate, thereby surpassing now eight billion transistors per cm2. This has concomitantly fueled the growth of multilayered on-chip interconnects comprising metallic and low dielectric materials. Artificial Plasmonics for VLSI Interconnects introduces a new method for improving chip performance by harnessing the power of information transfer among chips at terahertz frequency. This revolutionary new electromagnetic wave engineering, called a spoof surface plasmon polariton, adapts the principles of VLSI and terahertz interconnect technology along with the artificial plasmonics to transfer huge quantities of data at vastly improved speeds. It constitutes a potentially decisive contribution to the pursuit of faster and more capacious VLSI chips. In Artificial Plasmonics for VLSI Interconnects, readers will also find: A cutting-edge new approach supported by pioneering researchDetailed discussion of essential components related to the development of THz interconnect technology, including theory, modeling, simulation, and validationRoadmap to future technological development in the branch of artificial plasmonics Artificial Plasmonics for VLSI Interconnects is ideal for engineers, researchers, and scientists working in electronics, electromagnetics, and optics. This item is printed on demand. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
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Da: Revaluation Books, Exeter, Regno UnitoRevaluation Books
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EUR 175,26
EUR 14,61 spedizioneSpedito da Regno Unito a U.S.A.Quantità: 2 disponibili
Hardcover. Condizione: Brand New. 320 pages. 11.02x8.66x2.76 inches. In Stock. This item is printed on demand.
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Da: CitiRetail, Stevenage, Regno UnitoCitiRetail
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EUR 165,48
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Hardcover. Condizione: new. Hardcover. Build the microchips of the future with this revolutionary new information transfer technology Advancements in high-performance computing have continually demanded for progress in disruptive technological research and innovations. Moores Law has pushed the Very Large Scale Integration (VLSI…) technology to pack MOS devices inside a chip at an exponential rate, thereby surpassing now eight billion transistors per cm2. This has concomitantly fueled the growth of multilayered on-chip interconnects comprising metallic and low dielectric materials. Artificial Plasmonics for VLSI Interconnects introduces a new method for improving chip performance by harnessing the power of information transfer among chips at terahertz frequency. This revolutionary new electromagnetic wave engineering, called a spoof surface plasmon polariton, adapts the principles of VLSI and terahertz interconnect technology along with the artificial plasmonics to transfer huge quantities of data at vastly improved speeds. It constitutes a potentially decisive contribution to the pursuit of faster and more capacious VLSI chips. In Artificial Plasmonics for VLSI Interconnects, readers will also find: A cutting-edge new approach supported by pioneering researchDetailed discussion of essential components related to the development of THz interconnect technology, including theory, modeling, simulation, and validationRoadmap to future technological development in the branch of artificial plasmonics Artificial Plasmonics for VLSI Interconnects is ideal for engineers, researchers, and scientists working in electronics, electromagnetics, and optics. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.
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Da: AussieBookSeller, Truganina, VIC, AustraliaAussieBookSeller
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 206,80
EUR 31,95 spedizioneSpedito da Australia a U.S.A.Quantità: 1 disponibili
Hardcover. Condizione: new. Hardcover. Build the microchips of the future with this revolutionary new information transfer technology Advancements in high-performance computing have continually demanded for progress in disruptive technological research and innovations. Moores Law has pushed the Very Large Scale Integration (VLSI…) technology to pack MOS devices inside a chip at an exponential rate, thereby surpassing now eight billion transistors per cm2. This has concomitantly fueled the growth of multilayered on-chip interconnects comprising metallic and low dielectric materials. Artificial Plasmonics for VLSI Interconnects introduces a new method for improving chip performance by harnessing the power of information transfer among chips at terahertz frequency. This revolutionary new electromagnetic wave engineering, called a spoof surface plasmon polariton, adapts the principles of VLSI and terahertz interconnect technology along with the artificial plasmonics to transfer huge quantities of data at vastly improved speeds. It constitutes a potentially decisive contribution to the pursuit of faster and more capacious VLSI chips. In Artificial Plasmonics for VLSI Interconnects, readers will also find: A cutting-edge new approach supported by pioneering researchDetailed discussion of essential components related to the development of THz interconnect technology, including theory, modeling, simulation, and validationRoadmap to future technological development in the branch of artificial plasmonics Artificial Plasmonics for VLSI Interconnects is ideal for engineers, researchers, and scientists working in electronics, electromagnetics, and optics. This item is printed on demand. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.
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Da: Biblios, frankfurt am main, HESSE, GermaniaBiblios
Contatta il venditoreVenditore con 4 stelleCondizione: Nuovo
EUR 225,76
EUR 9,95 spedizioneSpedito da Germania a U.S.A.Quantità: 4 disponibili
Condizione: New. PRINT ON DEMAND.
