9781402017650 - structural integrity and reliability in electronics: enhancing performance in a lead-free environment di plumbridge, w. j.; matela, raymond j.; westwater, a. (10 risultati)
- Rilegato
Da: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.Romtrade Corp.
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 137,00
Spedizione gratuitaSpedito in U.S.A.Quantità: 1 disponibili
Condizione: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
- Rilegato
Da: Basi6 International, Irving, TX, U.S.A.Basi6 International
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 137,84
Spedizione gratuitaSpedito in U.S.A.Quantità: 1 disponibili
Condizione: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
- Rilegato
Da: Ria Christie Collections, Uxbridge, Regno UnitoRia Christie Collections
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 165,24
EUR 13,94 spedizioneSpedito da Regno Unito a U.S.A.Quantità: Più di 20 disponibili
Condizione: New. In.
- Rilegato
Da: Books Puddle, New York, NY, U.S.A.Books Puddle
Contatta il venditoreVenditore con 4 stelleCondizione: Usato
EUR 198,14
EUR 3,44 spedizioneSpedito in U.S.A.Quantità: 1 disponibili
Condizione: Used. pp. 360.
- Rilegato
Da: Majestic Books, Hounslow, Regno UnitoMajestic Books
Contatta il venditoreVenditore con 4 stelleCondizione: Usato
EUR 204,20
EUR 7,56 spedizioneSpedito da Regno Unito a U.S.A.Quantità: 1 disponibili
Condizione: Used. pp. 360 Illus.
Structural Integrity and Reliability in Electronics
Plumbridge, W.J. (The Open University, Milton Keynes, UK); Matela, Raymond J.; Westwater, A. (Rohm Electronics (UK) Ltd., Milton Keynes, UK)
- Rilegato
Da: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrlandaKennys Bookshop and Art Galleries Ltd.
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 198,21
EUR 9,50 spedizioneSpedito da Irlanda a U.S.A.Quantità: 15 disponibili
Condizione: New. The World's largest industrial sector, Electronics, is facing twin challenges arising from the transition to environmentally-benign solder alloys and the necessity to maintain structural integrity and reliability in the face of continuing miniaturisation. This book addresses the situation from a multidisciplinar…y teaching perspective. Num Pages: 355 pages, 248 black & white illustrations, biography. BIC Classification: TJF. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 20. Weight in Grams: 774. . 2003. Hardback. . . . .
- Rilegato
Da: Biblios, frankfurt am main, HESSE, GermaniaBiblios
Contatta il venditoreVenditore con 4 stelleCondizione: Usato
EUR 207,89
EUR 9,95 spedizioneSpedito da Germania a U.S.A.Quantità: 1 disponibili
Condizione: Used. pp. 360.
- Rilegato
Da: moluna, Greven, Germaniamoluna
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 178,14
EUR 48,99 spedizioneSpedito da Germania a U.S.A.Quantità: Più di 20 disponibili
Gebunden. Condizione: New. Knowledge itself is soon obsolete It is a blunt instrument. Only by understanding can problems be solved and progress achieved. Reliability in performance of electronic equipment, in the face of demands for continuing miniaturisation and the anticipated ab.
Structural Integrity and Reliability in Electronics
Plumbridge, W.J. (The Open University, Milton Keynes, UK); Matela, Raymond J.; Westwater, A. (Rohm Electronics (UK) Ltd., Milton Keynes, UK)
- Rilegato
Da: Kennys Bookstore, Olney, MD, U.S.A.Kennys Bookstore
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 247,37
EUR 9,04 spedizioneSpedito in U.S.A.Quantità: 15 disponibili
Condizione: New. The World's largest industrial sector, Electronics, is facing twin challenges arising from the transition to environmentally-benign solder alloys and the necessity to maintain structural integrity and reliability in the face of continuing miniaturisation. This book addresses the situation from a multidisciplinar…y teaching perspective. Num Pages: 355 pages, 248 black & white illustrations, biography. BIC Classification: TJF. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 20. Weight in Grams: 774. . 2003. Hardback. . . . . Books ship from the US and Ireland.
- Rilegato
Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 247,94
EUR 30,50 spedizioneSpedito da Germania a U.S.A.Quantità: 2 disponibili
Buch. Condizione: Neu. Neuware - Knowledge itself is soon obsolete; It is a blunt instrument. Only by understanding can problems be solved and progress achieved. Reliability in performance of electronic equipment, in the face of demands for continuing miniaturisation and the anticipated abolition of lead containing solders, repr…esents a major engineering challenge. The involvement of numerous disciplines; such as electrical, electronic, mechanical, manufacturing, and materials engineering together with physicists and computer specialists, adds to the complexity of the situation. Nevertheless, with electronics being the World's largest industrial sector, the potential rewards to the winners are substantial. This book aims to provide the ingredients for understanding, together with knowledge of reliability in interconnection technology and of the implementation of lead free solders. It is strongly contended that such a combination forms the necessary basis for greater structural integrity and enhanced performance The text is essentially in three parts: The intentions of the Part I component {The Materials Perspective, Chapters 1 6) are to present a snapshot of the current, but rapidly changing, global scene and to establish a firm understanding of the fundamentals surrounding interconnection performance. With potential readers possessing a broad spectrum of knowledge and expertise, this is essential. It could be argued that the reason for the limited progress made in this field to date has been due to the difficulties encountered in communicating effectively across the discipline boundaries.
