Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 140,06
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. In.
Condizione: New. pp. 202.
EUR 131,20
Quantità: 5 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. Ultra-Low Power Wireless Technologies for Sensor Networks | Brian Otis (u. a.) | Taschenbuch | Integrated Circuits and Systems | xv | Englisch | 2011 | Springer | EAN 9781441940469 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
EUR 152,50
Quantità: 1 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - transconductance e ciency of all critical devices in order to reduce the n- essary bias current. However, reducing the current density also results in a severely decreased device f . An optimization of the current density is re- T quired to provide the correct balance between transconductance e ciency and bandwidth. Plots such as Figure 2. 1 are useful tools for designers when choosing appropriate transistor bias points. Technology scaling allows greatly increased f realization for a given IC. Thus, weak inversion biasing for RF T design will become increasingly useful in future technology nodes. Throughout this work, the IC of critical transistors will be discussed. Most of the RF devices are biased in moderate to weak inversion to achieve enhanced transconductance e ciency and reduced bias current. 2. 2 MEMS Background The relatively new eld of Radio Frequency Microelectro Mechanical Systems (RF MEMS) provides unique opportunities for RF transceiver designers. This section provides background on RF MEMS and provides insight into the - portunities presented by these new technologies. The eld of RF MEMS - cludes the design and utilization of RF lters, resonators, switches, and other passive mechanical structures constructed using bulk processed integrated c- cuit fabrication techniques. To date, these devices have been commercially used as discrete board-mounted components, primarily used to enhance the miniaturization of mobile phones. However, RF MEMS components have the potential to be batch fabricated using existing integrated circuit fabrication techniques.
Da: Revaluation Books, Exeter, Regno Unito
EUR 222,15
Quantità: 2 disponibili
Aggiungi al carrelloPaperback. Condizione: Brand New. 300 pages. 9.29x6.06x0.63 inches. In Stock.
Da: Mispah books, Redhill, SURRE, Regno Unito
EUR 213,62
Quantità: 1 disponibili
Aggiungi al carrelloPaperback. Condizione: Like New. Like New. book.
Da: Brook Bookstore On Demand, Napoli, NA, Italia
EUR 118,41
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: new. Questo è un articolo print on demand.
Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germania
EUR 149,98
Quantità: 2 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book is written for academic and professional researchers designing communication systems for pervasive and low power applications. There is an introduction to wireless sensor networks, but the main emphasis of the book is on design techniques for low power, highly integrated transceivers. Instead of presenting a single design perspective, this book presents the design philosophies from three diverse research groups, providing three completely different strategies for achieving similar goals. By presenting diverse perspectives, this book prepares the reader for the countless design decisions they will be making in their own designs. 200 pp. Englisch.
Da: moluna, Greven, Germania
EUR 124,36
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Includes an introduction to wireless sensor networksProblems specific to sensor node communications are described and addressedDesign methodologies presentedInvited chapters by leading research expertsThis book is written .
Lingua: Inglese
Editore: Springer-Verlag New York Inc., 2011
ISBN 10: 1441940464 ISBN 13: 9781441940469
Da: THE SAINT BOOKSTORE, Southport, Regno Unito
EUR 166,01
Quantità: Più di 20 disponibili
Aggiungi al carrelloPaperback / softback. Condizione: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days.
Lingua: Inglese
Editore: Springer US, Springer US Sep 2011, 2011
ISBN 10: 1441940464 ISBN 13: 9781441940469
Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germania
EUR 149,98
Quantità: 1 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -transconductance e ciency of all critical devices in order to reduce the n- essary bias current. However, reducing the current density also results in a severely decreased device f . An optimization of the current density is re- T quired to provide the correct balance between transconductance e ciency and bandwidth. Plots such as Figure 2. 1 are useful tools for designers when choosing appropriate transistor bias points. Technology scaling allows greatly increased f realization for a given IC. Thus, weak inversion biasing for RF T design will become increasingly useful in future technology nodes. Throughout this work, the IC of critical transistors will be discussed. Most of the RF devices are biased in moderate to weak inversion to achieve enhanced transconductance e ciency and reduced bias current. 2. 2 MEMS Background The relatively new eld of Radio Frequency Microelectro Mechanical Systems (RF MEMS) provides unique opportunities for RF transceiver designers. This section provides background on RF MEMS and provides insight into the - portunities presented by these new technologies. The eld of RF MEMS - cludes the design and utilization of RF lters, resonators, switches, and other passive mechanical structures constructed using bulk processed integrated c- cuit fabrication techniques. To date, these devices have been commercially used as discrete board-mounted components, primarily used to enhance the miniaturization of mobile phones. However, RF MEMS components have the potential to be batch fabricated using existing integrated circuit fabrication techniques.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 200 pp. Englisch.
Da: Majestic Books, Hounslow, Regno Unito
EUR 213,81
Quantità: 4 disponibili
Aggiungi al carrelloCondizione: New. Print on Demand pp. 202 49:B&W 6.14 x 9.21 in or 234 x 156 mm (Royal 8vo) Perfect Bound on White w/Gloss Lam.
Da: Biblios, Frankfurt am main, HESSE, Germania
EUR 212,39
Quantità: 4 disponibili
Aggiungi al carrelloCondizione: New. PRINT ON DEMAND pp. 202.