ISBN: 9781447158400 - the elfnet book on failure mechanisms, testing methods, and quality issues of lead-free solder interconnects (13 risultati)

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  • Lingua: Inglese

    Editore: Springer, 2014

    1447158407 / 9781447158400

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    Da: Ria Christie Collections, Uxbridge, Regno UnitoRia Christie Collections

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    Condizione: New. In English.

  • Lingua: Inglese

    Editore: Springer, 2014

    1447158407 / 9781447158400

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  • Lingua: Inglese

    Editore: Springer, 2014

    1447158407 / 9781447158400

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    Da: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices

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    Lingua: Inglese

    Editore: Springer London, 2014

    1447158407 / 9781447158400

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    Da: preigu, Osnabrück, Germaniapreigu

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    Taschenbuch. Condizione: Neu. The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects | Christian Zardini (u. a.) | Taschenbuch | viii | Englisch | 2014 | Springer London | EAN 9781447158400 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.…

  • Lingua: Inglese

    Editore: Springer, 2014

    1447158407 / 9781447158400

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    Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH

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    Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is the work of the European network ELFNET which was founded by the European Commission in the 6th Framework Programme. It brings together contributions from the leading European experts in lead-free soldering.The limited validity of testing methods originating from tin-lead solder was a major point of concern in ELFNET members' discussions. As a result, the network's reliability group decided to bring together the material properties of lead-free solders, as well as the basics of material science, and to discuss their influence on the procedures for accelerated testing. This has led to a matrix of failure mechanisms and their activation and, as a result, to a comprehensive coverage of the scientific background and its applications in reliability testing of lead-free solder joints.The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is written for scientists, engineers and researchers involved with lead-free electronics.…

  • Lingua: Inglese

    Editore: Springer, 2014

    1447158407 / 9781447158400

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    Da: Books Puddle, Woodside, NY, U.S.A.Books Puddle

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  • Lingua: Inglese

    Editore: Springer, 2014

    1447158407 / 9781447158400

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    Da: Brook Bookstore On Demand, Napoli, NA, ItaliaBrook Bookstore On Demand

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  • Lingua: Inglese

    Editore: Springer London Nov 2014, 2014

    1447158407 / 9781447158400

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    Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermaniaBuchWeltWeit Ludwig Meier e.K.

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    Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is the work of the European network ELFNET which was founded by the European Commission in the 6th Framework Programme. It brings together contributions from the leading European experts in lead-free soldering.The limited validity of testing methods originating from tin-lead solder was a major point of concern in ELFNET members' discussions. As a result, the network's reliability group decided to bring together the material properties of lead-free solders, as well as the basics of material science, and to discuss their influence on the procedures for accelerated testing. This has led to a matrix of failure mechanisms and their activation and, as a result, to a comprehensive coverage of the scientific background and its applications in reliability testing of lead-free solder joints.The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is written for scientists, engineers and researchers involved with lead-free electronics. 324 pp. Englisch.…

  • Lingua: Inglese

    Editore: Springer London, 2014

    1447158407 / 9781447158400

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    Da: moluna, Greven, Germaniamoluna

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    Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Gives the results of research conducted within the European Lead-Free Soldering Network (ELFNET)Offers a compilation of material from European experts on the metallurgy and degradation of lead-free solder jointsContains numerous illustratio.…

  • Lingua: Inglese

    Editore: Springer London Ltd, 2014

    1447158407 / 9781447158400

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    Da: THE SAINT BOOKSTORE, Southport, Regno UnitoTHE SAINT BOOKSTORE

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    Paperback / softback. Condizione: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days.

  • Lingua: Inglese

    Editore: Springer London, Springer London Nov 2014, 2014

    1447158407 / 9781447158400

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    Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germaniabuchversandmimpf2000

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    Taschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is the work of the European network ELFNET which was founded by the European Commission in the 6th Framework Programme. It brings together contributions from the leading European experts in lead-free soldering.The limited validity of testing methods originating from tin-lead solder was a major point of concern in ELFNET members' discussions. As a result, the network's reliability group decided to bring together the material properties of lead-free solders, as well as the basics of material science, and to discuss their influence on the procedures for accelerated testing. This has led to a matrix of failure mechanisms and their activation and, as a result, to a comprehensive coverage of the scientific background and its applications in reliability testing of lead-free solder joints.The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is written for scientists, engineers and researchers involved with lead-free electronics.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 324 pp. Englisch.…

  • Lingua: Inglese

    Editore: Springer, 2014

    1447158407 / 9781447158400

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    Da: Majestic Books, Hounslow, Regno UnitoMajestic Books

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  • Lingua: Inglese

    Editore: Springer, 2014

    1447158407 / 9781447158400

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    Da: Biblios, frankfurt am main, HESSE, GermaniaBiblios

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