Isbn: 9783030861766 - theory and practice of thermal transient testing of electronic components (17 risultati)

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  • Lingua: Inglese

    Editore: Springer, 2024

    3030861767 / 9783030861766

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    Editore: Springer Nature Switzerland AG, CH, 2024

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    Paperback. Condizione: New. 2022 ed. This book discusses the significant aspects of thermal transient testing, the most important method of thermal characterization of electronics available today. The book presents the theoretical background of creating structure functions from the measured results with mathematical details. It then shows how the method can be used for thermal qualification, structure integrity testing, determining material parameters, and calibrating simulation models. General practical questions about measurements are discussed to help beginners carry out thermal transient testing. The particular problems and tricks of measuring with various electronic components, such as Si diodes, bipolar transistors, MOS transistors, IGBT devices, resistors, capacitors, wide bandgap materials, and LEDs, are covered in detail with the help of various use cases. This hands-on book will enable readers to accomplish thermal transient testing on any new type of electronics and provides the theoretical details needed tounderstand the opportunities and limitations offered by the methodology. The book will be an invaluable reference for practicing engineers, students, and researchers.

  • Lingua: Inglese

    Editore: Springer, 2024

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  • Lingua: Inglese

    Editore: Springer, 2024

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    Condizione: New. 1st ed. 2022 edition NO-PA16APR2015-KAP.

  • Lingua: Inglese

    Editore: Springer Nature, 2024

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    Paperback. Condizione: Brand New. 394 pages. 9.25x6.10x0.81 inches. In Stock.

  • Lingua: Inglese

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    Taschenbuch. Condizione: Neu. Theory and Practice of Thermal Transient Testing of Electronic Components | Marta Rencz (u. a.) | Taschenbuch | ix | Englisch | 2024 | Springer | EAN 9783030861766 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.

  • Lingua: Inglese

    Editore: Springer, 2024

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    Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book discusses the significant aspects of thermal transient testing, the most important method of thermal characterization of electronics available today. The book presents the theoretical background of creating structure functions from the measured results with mathematical details. It then shows how the method can be used for thermal qualification, structure integrity testing, determining material parameters, and calibrating simulation models. General practical questions about measurements are discussed to help beginners carry out thermal transient testing. The particular problems and tricks of measuring with various electronic components, such as Si diodes, bipolar transistors, MOS transistors, IGBT devices, resistors, capacitors, wide bandgap materials, and LEDs, are covered in detail with the help of various use cases. This hands-on book will enable readers to accomplish thermal transient testing on any new type of electronics and provides the theoretical details needed tounderstand the opportunities and limitations offered by the methodology. The book will be an invaluable reference for practicing engineers, students, and researchers.

  • Lingua: Inglese

    Editore: Springer Nature Switzerland AG, CH, 2024

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    Paperback. Condizione: New. 2022 ed. This book discusses the significant aspects of thermal transient testing, the most important method of thermal characterization of electronics available today. The book presents the theoretical background of creating structure functions from the measured results with mathematical details. It then shows how the method can be used for thermal qualification, structure integrity testing, determining material parameters, and calibrating simulation models. General practical questions about measurements are discussed to help beginners carry out thermal transient testing. The particular problems and tricks of measuring with various electronic components, such as Si diodes, bipolar transistors, MOS transistors, IGBT devices, resistors, capacitors, wide bandgap materials, and LEDs, are covered in detail with the help of various use cases. This hands-on book will enable readers to accomplish thermal transient testing on any new type of electronics and provides the theoretical details needed tounderstand the opportunities and limitations offered by the methodology. The book will be an invaluable reference for practicing engineers, students, and researchers.

  • Lingua: Inglese

    Editore: Springer, 2024

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    Editore: Springer International Publishing Jan 2024, 2024

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    Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermaniaBuchWeltWeit Ludwig Meier e.K.

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    Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book discusses the significant aspects of thermal transient testing, the most important method of thermal characterization of electronics available today. The book presents the theoretical background of creating structure functions from the measured results with mathematical details. It then shows how the method can be used for thermal qualification, structure integrity testing, determining material parameters, and calibrating simulation models. General practical questions about measurements are discussed to help beginners carry out thermal transient testing. The particular problems and tricks of measuring with various electronic components, such as Si diodes, bipolar transistors, MOS transistors, IGBT devices, resistors, capacitors, wide bandgap materials, and LEDs, are covered in detail with the help of various use cases. This hands-on book will enable readers to accomplish thermal transient testing on any new type of electronics and provides the theoretical details needed tounderstand the opportunities and limitations offered by the methodology. The book will be an invaluable reference for practicing engineers, students, and researchers. 396 pp. Englisch.

  • Lingua: Inglese

    Editore: Springer, Berlin|Springer International Publishing|Springer, 2024

    3030861767 / 9783030861766

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    Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book discusses the significant aspects of thermal transient testing, the most important method of thermal characterization of electronics available today. The book presents the theoretical background of creating structure functions from the measured.

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    Editore: Springer, 2024

    3030861767 / 9783030861766

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  • Lingua: Inglese

    Editore: Springer, Springer Jan 2024, 2024

    3030861767 / 9783030861766

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    Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germaniabuchversandmimpf2000

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    Taschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book discusses the significant aspects of thermal transient testing, the most important method of thermal characterization of electronics available today. The book presents the theoretical background of creating structure functions from the measured results with mathematical details. It then shows how the method can be used for thermal qualification, structure integrity testing, determining material parameters, and calibrating simulation models. General practical questions about measurements are discussed to help beginners carry out thermal transient testing. The particular problems and tricks of measuring with various electronic components, such as Si diodes, bipolar transistors, MOS transistors, IGBT devices, resistors, capacitors, wide bandgap materials, and LEDs, are covered in detail with the help of various use cases. This hands-on book will enable readers to accomplish thermal transient testing on any new type of electronics and provides the theoretical details needed tounderstand the opportunities and limitations offered by the methodology. The book will be an invaluable reference for practicing engineers, students, and researchers.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 396 pp. Englisch.