9783030934439 - recent progress in lead-free solder technology: materials development, processing and performances (10 risultati)

Lingua: Inglese
Editore: Springer 2023
Serie: Topics in Mining, Metallurgy and Materials Engineering, Libro 34 di 35. Libro 34 di 35 - Topics in Mining, Metallurgy and Materials Engineering
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Da: Ria Christie Collections, Uxbridge, Regno UnitoRia Christie Collections
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Condizione: New. In.
Altre immaginiLingua: Inglese
Editore: Springer 2023
Serie: Topics in Mining, Metallurgy and Materials Engineering, Libro 34 di 35. Libro 34 di 35 - Topics in Mining, Metallurgy and Materials Engineering
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Da: preigu, Osnabrück, Germaniapreigu
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Taschenbuch. Condizione: Neu. Recent Progress in Lead-Free Solder Technology | Materials Development, Processing and Performances | Mohd Arif Anuar Mohd Salleh (u. a.) | Taschenbuch | Topics in Mining, Metallurgy and Materials Engineering | xii | Englisch | 2023 | Springer | EAN 9783030934439 | Verantwortliche Person für die EU:… Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.

Lingua: Inglese
Editore: Springer 2023
Serie: Topics in Mining, Metallurgy and Materials Engineering, Libro 34 di 35. Libro 34 di 35 - Topics in Mining, Metallurgy and Materials Engineering
- Brossura
Da: Books Puddle, New York, NY, U.S.A.Books Puddle
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Condizione: New. 1st ed. 2022 edition NO-PA16APR2015-KAP.

Lingua: Inglese
Editore: Springer International Publishing, Springer Nature Switzerland 2023
Serie: Topics in Mining, Metallurgy and Materials Engineering, Libro 34 di 35. Libro 34 di 35 - Topics in Mining, Metallurgy and Materials Engineering
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Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH
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Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials' development, encompassing composite solders, transie…nt liquid phase sintering, and alloying. The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder.

Lingua: Inglese
Editore: Springer Nature 2023
Serie: Topics in Mining, Metallurgy and Materials Engineering, Libro 34 di 35. Libro 34 di 35 - Topics in Mining, Metallurgy and Materials Engineering
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Da: Revaluation Books, Exeter, , Regno UnitoRevaluation Books
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Paperback. Condizione: Brand New. 340 pages. 9.25x6.10x0.71 inches. In Stock.

Lingua: Inglese
Editore: Springer 2023
Serie: Topics in Mining, Metallurgy and Materials Engineering, Libro 34 di 35. Libro 34 di 35 - Topics in Mining, Metallurgy and Materials Engineering
- Brossura
- Print on Demand
Da: Brook Bookstore On Demand, Napoli, NA, ItaliaBrook Bookstore On Demand
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Condizione: new. Questo è un articolo print on demand.

Lingua: Inglese
Editore: Springer International Publishing, Springer Nature Switzerland Mär 2023 2023
Serie: Topics in Mining, Metallurgy and Materials Engineering, Libro 34 di 35. Libro 34 di 35 - Topics in Mining, Metallurgy and Materials Engineering
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- Print on Demand
Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, , GermaniaBuchWeltWeit Ludwig Meier e.K.
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Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials' development, encompassing composite…solders, transient liquid phase sintering, and alloying. The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder. 340 pp. Englisch.

Lingua: Inglese
Editore: Springer 2023
Serie: Topics in Mining, Metallurgy and Materials Engineering, Libro 34 di 35. Libro 34 di 35 - Topics in Mining, Metallurgy and Materials Engineering
- Brossura
- Print on Demand
Da: Biblios, frankfurt am main, HESSE, GermaniaBiblios
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EUR 241,85
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Condizione: New. PRINT ON DEMAND.

Lingua: Inglese
Editore: Springer, Palgrave Macmillan Mär 2023 2023
Serie: Topics in Mining, Metallurgy and Materials Engineering, Libro 34 di 35. Libro 34 di 35 - Topics in Mining, Metallurgy and Materials Engineering
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- Print on Demand
Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germaniabuchversandmimpf2000
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EUR 192,59
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Taschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials' development, encompassing composite sold…ers, transient liquid phase sintering, and alloying. The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 340 pp. Englisch.

Lingua: Inglese
Editore: Springer 2023
Serie: Topics in Mining, Metallurgy and Materials Engineering, Libro 34 di 35. Libro 34 di 35 - Topics in Mining, Metallurgy and Materials Engineering
- Brossura
- Print on Demand
Da: Majestic Books, Hounslow, , Regno UnitoMajestic Books
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EUR 259,37
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Condizione: New. Print on Demand.