Isbn: 9783031947971 - electronic materials innovations and reliability in advanced memory packaging (4 risultati)

Taschenbuch. Condizione: Neu. Electronic Materials Innovations and Reliability in Advanced Memory Packaging | Chong Leong Gan (u. a.) | Taschenbuch | Springer Series in Reliability Engineering | xv | Englisch | 2026 | Springer | EAN 9783031947971 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.…

Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and integration in memory modules and solid state drives (SSD).The book is an extremely useful and applicable guide to professionals and students on materials reliability in memory device packaging - from component to system level.…

Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and integration in memory modules and solid state drives (SSD).The book is an extremely useful and applicable guide to professionals and students on materials reliability in memory device packaging - from component to system level. 178 pp. Englisch.…

Taschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and integration in memory modules and solid state drives (SSD).The book is an extremely useful and applicable guide to professionals and students on materials reliability in memory device packaging - from component to system level.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 196 pp. Englisch.…