Isbn: 9783032274472 - proceedings of international conference on data, electronics and computing: icdec 2025, volume 1 (3 risultati)

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  • Lingua: Inglese

    Editore: Springer, 2026

    3032274478 / 9783032274472

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    Da: preigu, Osnabrück, Germaniapreigu

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    EUR 229,80

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    Taschenbuch. Condizione: Neu. Proceedings of International Conference on Data, Electronics and Computing | ICDEC 2025, Volume 1 | Nibaran Das (u. a.) | Taschenbuch | xiii | Englisch | 2026 | Springer | EAN 9783032274472 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.

  • Lingua: Inglese

    Editore: Springer Nature Switzerland AG, 2026

    3032274478 / 9783032274472

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    Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH

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    EUR 371,81

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    Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book features high-quality, peer-reviewed research papers presented at the International Conference on Data Electronics and Computing (ICDEC 2025), held at Baderia Global Institute of Engineering and Management, Jabalpur, India, during December 19 21, 2025. This book covers topics in communication, networking and security, image, video, and signal processing, cloud computing, IoT and smart city, AI/ML, big data and data mining, VLSI design, antenna, and microwave and control.

  • Lingua: Inglese

    Editore: Springer Nature Switzerland AG Aug 2026, 2026

    3032274478 / 9783032274472

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    • Print on Demand

    Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermaniaBuchWeltWeit Ludwig Meier e.K.

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    EUR 267,49

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    Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book features high-quality, peer-reviewed research papers presented at the International Conference on Data Electronics and Computing (ICDEC 2025), held at Baderia Global Institute of Engineering and Management, Jabalpur, India, during December 19 21, 2025. This book covers topics in communication, networking and security, image, video, and signal processing, cloud computing, IoT and smart city, AI/ML, big data and data mining, VLSI design, antenna, and microwave and control. 316 pp. Englisch.