ISBN: 9783844381115 - high speed end milling of single crystal silicon wafer: an economic method of machining of silicon in ductile mode (9 risultati)

Condizione: New. pp. 96.

Taschenbuch. Condizione: Neu. High Speed End Milling of Single Crystal Silicon Wafer | An Economic Method of Machining of Silicon in Ductile Mode | A. K. M. Nurul Amin (u. a.) | Taschenbuch | 96 S. | Englisch | 2013 | LAP LAMBERT Academic Publishing | EAN 9783844381115 | Verantwortliche Person für die EU: preigu GmbH & Co. KG, Lengericher Landstr. 19, 49078 Osnabrück, mail[at]preigu[dot]de | Anbieter: preigu.…

Paperback. Condizione: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Machining of single crystal silicon is a challenging and expensive affair due to the high hardness and inherent brittleness of the material. Major problem in conventional machining of brittle materials like silicon is the generation of cracks and subsurface damages. This book outlines a ductile mode machining process developed for silicon employing high speed end milling using diamond coated tools. The developed method was found to ensure integrity of the machined surface and good surface finish. The influence of the cutting parameters, such as, cutting speed, feed and depth of cut, on ductile mode machining are discussed in the book. A 3-level full factorial design of experiments using Response Surface Methodology (RSM) was employed to develop regression model of average surface roughness. The developed model was tested using Analysis of Variance (ANOVA) at 95% confidence level. The best average surface roughness achieved was 0.2 m, which could alleviate the need for further grinding and rough polishing operations to save cost and cycle time of machining silicon. 96 pp. Englisch.…

Taschenbuch. Condizione: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Machining of single crystal silicon is a challenging and expensive affair due to the high hardness and inherent brittleness of the material. Major problem in conventional machining of brittle materials like silicon is the generation of cracks and subsurface damages. This book outlines a ductile mode machining process developed for silicon employing high speed end milling using diamond coated tools. The developed method was found to ensure integrity of the machined surface and good surface finish. The influence of the cutting parameters, such as, cutting speed, feed and depth of cut, on ductile mode machining are discussed in the book. A 3-level full factorial design of experiments using Response Surface Methodology (RSM) was employed to develop regression model of average surface roughness. The developed model was tested using Analysis of Variance (ANOVA) at 95% confidence level. The best average surface roughness achieved was 0.2 m, which could alleviate the need for further grinding and rough polishing operations to save cost and cycle time of machining silicon.…

Condizione: New. Print on Demand pp. 96 2:B&W 6 x 9 in or 229 x 152 mm Perfect Bound on Creme w/Gloss Lam.

Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: Amin A.K.M. NurulA.K.M. Nurul Amin, Mohd Dali Bin Mohd Ismail and Muhammad Iqbal Bin MusaDr. Amin is a Senior Professor at the International Islamic University Malaysia (IIUM). His research areas include chatter/vibration in machinin.…

Condizione: New. PRINT ON DEMAND pp. 96.

Taschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Machining of single crystal silicon is a challenging and expensive affair due to the high hardness and inherent brittleness of the material. Major problem in conventional machining of brittle materials like silicon is the generation of cracks and subsurface damages. This book outlines a ductile mode machining process developed for silicon employing high speed end milling using diamond coated tools. The developed method was found to ensure integrity of the machined surface and good surface finish. The influence of the cutting parameters, such as, cutting speed, feed and depth of cut, on ductile mode machining are discussed in the book. A 3-level full factorial design of experiments using Response Surface Methodology (RSM) was employed to develop regression model of average surface roughness. The developed model was tested using Analysis of Variance (ANOVA) at 95% confidence level. The best average surface roughness achieved was 0.2¿m, which could alleviate the need for further grinding and rough polishing operations to save cost and cycle time of machining silicon.VDM Verlag, Dudweiler Landstraße 99, 66123 Saarbrücken 96 pp. Englisch.…