9786204740263 - a comprehensive study on heat transfer in electronic cooling systems: flow optimization of heat sinks for different al/cu compositions di hanumanthrappa, ramesha; k, ananda g; r, varun k (5 risultati)
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Da: preigu, Osnabrück, Germaniapreigu
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 52,55
EUR 70,00 spedizioneSpedito da Germania a U.S.A.Quantità: 5 disponibili
Taschenbuch. Condizione: Neu. A Comprehensive Study on Heat Transfer in Electronic Cooling Systems | Flow optimization of heat sinks for different Al/Cu compositions | Ramesha Hanumanthrappa (u. a.) | Taschenbuch | Englisch | 2022 | LAP LAMBERT Academic Publishing | EAN 9786204740263 | Verantwortliche Person für die EU: preigu G…mbH & Co. KG, Lengericher Landstr. 19, 49078 Osnabrück, mail[at]preigu[dot]de | Anbieter: preigu.
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Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermaniaBuchWeltWeit Ludwig Meier e.K.
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 60,90
EUR 23,00 spedizioneSpedito da Germania a U.S.A.Quantità: 2 disponibili
Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -In electronic cooling applications, a TE cooler serves as a device for transporting heat away from a surface that has a temperature higher than the ambient temperature. Electronic devices such as PC processors generate a huge amoun…t of heat during operation poses a great thermal management challenge because reliable operation temperature for electronic devices has to be maintained. In most cases, the maximum electronic device junction temperature needs to be held at less than 85°C for reliable operation. The maximum heat flow from a high-performance electronic package can be about 200 W and is still constantly increasing. Conventional passive cooling technologies using air or water as working fluid, such as the microchannel sink, cannot fully meet the heat dissipation requirement and active cooling methods should be applied. Due to the limited installation space in electronic packages, conventional bulk cooling systems are too big. TE coolers combined with air cooling or liquid cooling approach at the hot sideshow have great potential because of their small size, high reliability, and no noise. 128 pp. Englisch.
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Da: moluna, Greven, Germaniamoluna
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 49,92
EUR 48,99 spedizioneSpedito da Germania a U.S.A.Quantità: Più di 20 disponibili
Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. In electronic cooling applications, a TE cooler serves as a device for transporting heat away from a surface that has a temperature higher than the ambient temperature. Electronic devices such as PC processors genera…te a huge amount of heat during operation.
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Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germaniabuchversandmimpf2000
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 60,90
EUR 60,00 spedizioneSpedito da Germania a U.S.A.Quantità: 1 disponibili
Taschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -In electronic cooling applications, a TE cooler serves as a device for transporting heat away from a surface that has a temperature higher than the ambient temperature. Electronic devices such as PC processors generate a huge amount of… heat during operation poses a great thermal management challenge because reliable operation temperature for electronic devices has to be maintained. In most cases, the maximum electronic device junction temperature needs to be held at less than 85°C for reliable operation. The maximum heat flow from a high-performance electronic package can be about 200 W and is still constantly increasing. Conventional passive cooling technologies using air or water as working fluid, such as the microchannel sink, cannot fully meet the heat dissipation requirement and active cooling methods should be applied. Due to the limited installation space in electronic packages, conventional bulk cooling systems are too big. TE coolers combined with air cooling or liquid cooling approach at the hot sideshow have great potential because of their small size, high reliability, and no noise.VDM Verlag, Dudweiler Landstraße 99, 66123 Saarbrücken 128 pp. Englisch.
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Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 61,63
EUR 61,05 spedizioneSpedito da Germania a U.S.A.Quantità: 1 disponibili
Taschenbuch. Condizione: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - In electronic cooling applications, a TE cooler serves as a device for transporting heat away from a surface that has a temperature higher than the ambient temperature. Electronic devices such as PC processors generate a huge amount of…heat during operation poses a great thermal management challenge because reliable operation temperature for electronic devices has to be maintained. In most cases, the maximum electronic device junction temperature needs to be held at less than 85°C for reliable operation. The maximum heat flow from a high-performance electronic package can be about 200 W and is still constantly increasing. Conventional passive cooling technologies using air or water as working fluid, such as the microchannel sink, cannot fully meet the heat dissipation requirement and active cooling methods should be applied. Due to the limited installation space in electronic packages, conventional bulk cooling systems are too big. TE coolers combined with air cooling or liquid cooling approach at the hot sideshow have great potential because of their small size, high reliability, and no noise.
