Isbn: 9787030434425 - 正版书籍先进电子封装技术与关键材料丛书--微电子封装和集成的建模与仿真：制造、可靠性和测试（第二版）刘胜化学工业出版社 (1 risultati)

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Microelectronic packaging technology higher education second five planning materials and electronic materials and application technology planning materials series(Chinese Edition)
HU YONG DA
Lingua: Cinese
Editore: Science Press, 2015
7030434420 / 9787030434425
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Da: liu xing, Nanjing, JS, Cinaliu xing
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Condizione: Nuovo
EUR 67,28
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paperback. Condizione: New. Language:Chinese.Microelectronic packaging technology higher education second five planning materials and electronic materials and application technology planning materials series.