ISBN: 9787030522726 - 【按需印刷】-集成电路三维系统集成与封装工艺（中文导读） (1 risultati)

ISBN:

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Information Science and Technology academic Works series: integrated circuit three-dimensional system integration and packaging Technology (Chinese guide)(Chinese Edition)
[ MEI ] John . H.Lau ZHU
Lingua: Cinese
Editore: Science Press
7030522729 / 9787030522726
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Da: liu xing, Nanjing, JS, Cinaliu xing
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Condizione: Nuovo
EUR 200,17
EUR 16,16 spedizione
Spedito da Cina a U.S.A.
Quantità: 3 disponibili
paperback. Condizione: New. Paperback. Pub Date: 2017-03-01 Pages: $number Language: Chinese Publisher: Science Press. Journal of Information Science and technology: integrated circuit three-dimensional system integration and encapsulation Technology (Chinese Guide) system discussion for electronic. 2 of optoelectronic and MEMS devices. 5D. 3D. and 3D IC integration and packaging technology . …