ISBN: 9787111697091 - 微电子引线键合（原书第3版）乔治哈曼著 超声键合系统 测试方法工艺建模 微电子芯片封装技术引线键合金属界面反应 罗建强 机工社 (1 risultati)

Hardcover. Condizione: New. Language:Chinese.HardCover.Pub Date:2022-06-01 Publisher:Machinery Industry Press Microelectronics Wire Bonding (3rd Edition) translated from Professor George Harman's book Wire Bonding in Microelectronics (3rd Edition) . systematically summarizes the development context and latest achievements of wire bonding technology in the past 70 years. and makes an outlook on the future development trend. The main contents include: ultrasonic bonding system and technology. metallurgical characteristics.…