9787122392275 - 先进电子封装技术与关键材料丛书--微电子封装和集成的建模与仿真(英文版) (2 risultati)
- Rilegato
Da: liu xing, Nanjing, JS, Cinaliu xing
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 443,55
EUR 15,55 spedizioneSpedito da Cina a U.S.A.Quantità: 1 disponibili
Hardcover. Condizione: New. HardCover.Pub Date:2021-12-01 Pages:696 Language:English Publisher:Chemical Industry Press With the development of electronic packaging. electronic packaging has changed from the traditional four main functions (power system. signal distribution and transmission. heat dissipation and Mechanical protec…tion) is expanded to six functions. namely. two new functions. DFX and system test. are added. Where DFX is designed for X. X includes: manufacturability. reliability. maintainability. cost. and .
- Rilegato
Da: liu xing, Nanjing, JS, Cinaliu xing
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 443,55
EUR 15,55 spedizioneSpedito da Cina a U.S.A.Quantità: 3 disponibili
Hardcover. Condizione: New. HardCover.Pub Date:2021-12-01 Pages:696 Language:English Publisher:Chemical Industry Press With the development of electronic packaging. electronic packaging has changed from the traditional four main functions (power system. signal distribution and transmission. heat dissipation and Mechanical protec…tion) is expanded to six functions. namely. two new functions. DFX and system test. are added. Where DFX is designed for X. X includes: manufacturability. reliability. maintainability. cost. and .
