Isbn: 9787122394842 - tsv三维射频集成 高阻硅转接板技术 tsv 3d rf integration hr-si interposer technology英文 微电子先进封装领域研究人员参考 (1 risultati)

Hardcover. Condizione: New. HardCover.Pub Date:2021-12-01 Pages:273 Language:English Publisher:Chemical Industry Press 3D RF integration application is an important application development direction of through silicon via (TSV) 3D integration technology. With the rise of 5G and millimeter-wave applications. thin-film bulk acoustic resonator (FBAR) devices based on high-resistance silicon TSV wafer-level packaging. and radio frequency microelectromechanical system (RF MEMS) switching devices have gradually achieved comme.…