Isbn: 9787302495529 - 集成电路芯片制造 9787302495529 杨发顺 清华大学出版社 (1 risultati)

paperback. Condizione: New. Language:Chinese.Paperback. Pub Date: 2018-08-01 Pages: 155 Publisher: Tsinghua University Press. a total of 11 chapters. including integrated circuit chip manufacturing overview. substrate material silicon wafer structure and fabrication. common microelectronic device structure. integration Circuit chip manufacturing process. silicon wafer contamination and cleaning. photolithography process. etching process. doping process. film growth process. surface.…