Isbn: 9789811007996 - crosstalk in modern on-chip interconnects: a fdtd approach (17 risultati)

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Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - The book provides accurate FDTDmodels for on-chip interconnects, covering most recent advancements inmaterials and design. Furthermore, depending on the geometry and physicalconfigurations, different electrical equivalent models for CNT and GNR basedinterconnects are presented. Based on the electrical equivalent models theperformance comparison among the Cu, CNT and GNR-based interconnects are alsodiscussed in the book.The proposed models are validated with the HSPICEsimulations.The book introduces the currentresearch scenario in the modeling of on-chip interconnects. It presents thestructure, properties, and characteristics of graphene based on-chipinterconnects and the FDTD modeling of Cu based on-chip interconnects. Themodel considers the non-linear effects of CMOS driver as well as thetransmission line effects of interconnect line that includes couplingcapacitance and mutual inductance effects. In a more realistic manner, theproposed model includes theeffect of width-dependent MFP of the MLGNR whiletaking into account the edge roughness.…

Taschenbuch. Condizione: Neu. Crosstalk in Modern On-Chip Interconnects | A FDTD Approach | B. K. Kaushik (u. a.) | Taschenbuch | SpringerBriefs in Applied Sciences and Technology | xv | Englisch | 2016 | Springer | EAN 9789811007996 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. …

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Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The book provides accurate FDTDmodels for on-chip interconnects, covering most recent advancements inmaterials and design. Furthermore, depending on the geometry and physicalconfigurations, different electrical equivalent models for CNT and GNR basedinterconnects are presented. Based on the electrical equivalent models theperformance comparison among the Cu, CNT and GNR-based interconnects are alsodiscussed in the book.The proposed models are validated with the HSPICEsimulations.The book introduces the currentresearch scenario in the modeling of on-chip interconnects. It presents thestructure, properties, and characteristics of graphene based on-chipinterconnects and the FDTD modeling of Cu based on-chip interconnects. Themodel considers the non-linear effects of CMOS driver as well as thetransmission line effects of interconnect line that includes couplingcapacitance and mutual inductance effects. In a more realistic manner, theproposed model includes the effect of width-dependent MFP of the MLGNR whiletaking into account the edge roughness. 132 pp. Englisch.…

Condizione: New. Print on Demand pp. 132.

Condizione: New. PRINT ON DEMAND pp. 132.

Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Presents the modeling of on-chip interconnects using FDTDtechniqueIncludes the modeling of future VLSI interconnects likecarbon nanotubes and graphene nanoribbons Discusses fast and accurate analysis of performanceparameters such as delay a.…

Taschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -The book provides accurate FDTDmodels for on-chip interconnects, covering most recent advancements inmaterials and design. Furthermore, depending on the geometry and physicalconfigurations, different electrical equivalent models for CNT and GNR basedinterconnects are presented. Based on the electrical equivalent models theperformance comparison among the Cu, CNT and GNR-based interconnects are alsodiscussed in the book. The proposed models are validated with the HSPICEsimulations.The book introduces the currentresearch scenario in the modeling of on-chip interconnects. It presents thestructure, properties, and characteristics of graphene based on-chipinterconnects and the FDTD modeling of Cu based on-chip interconnects. Themodel considers the non-linear effects of CMOS driver as well as thetransmission line effects of interconnect line that includes couplingcapacitance and mutual inductance effects. In a more realistic manner, theproposed model includes theeffect of width-dependent MFP of the MLGNR whiletaking into account the edge roughness.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 132 pp. Englisch.…