9789811570926 - 3d microelectronic packaging: from architectures to applications: 64 (9 risultati)
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Da: preigu, Osnabrück, Germaniapreigu
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Taschenbuch. Condizione: Neu. 3D Microelectronic Packaging | From Architectures to Applications | Yan Li (u. a.) | Taschenbuch | Springer Series in Advanced Microelectronics | xvii | Englisch | 2021 | Springer | EAN 9789811570926 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juer…gen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Lingua: Inglese
Editore: Springer 2021
Serie: Springer Series in Advanced Microelectronics, Libro 66. Libro 66 - Springer Series in Advanced Microelectronics
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Da: Books Puddle, New York, NY, U.S.A.Books Puddle
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Condizione: New. 2nd ed. 2021 edition NO-PA16APR2015-KAP.
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Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH
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Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides read…ers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.
Lingua: Inglese
Editore: Springer 2021
Serie: Springer Series in Advanced Microelectronics, Libro 66. Libro 66 - Springer Series in Advanced Microelectronics
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Da: Brook Bookstore On Demand, Napoli, NA, ItaliaBrook Bookstore On Demand
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Condizione: new. Questo è un articolo print on demand.
Lingua: Inglese
Editore: Springer, Berlin|Springer Nature Singapore|Springer 2021
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Da: moluna, Greven, , Germaniamoluna
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EUR 162,51
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Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectro…nic packaging.This book off.
Lingua: Inglese
Editore: Springer, Springer Nov 2021 2021
Serie: Springer Series in Advanced Microelectronics, Libro 66. Libro 66 - Springer Series in Advanced Microelectronics
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Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, , GermaniaBuchWeltWeit Ludwig Meier e.K.
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EUR 192,59
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Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging.…It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development. 640 pp. Englisch.
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Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germaniabuchversandmimpf2000
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EUR 192,59
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Taschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It p…rovides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 640 pp. Englisch.
Lingua: Inglese
Editore: Springer 2021
Serie: Springer Series in Advanced Microelectronics, Libro 66. Libro 66 - Springer Series in Advanced Microelectronics
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Da: Majestic Books, Hounslow, , Regno UnitoMajestic Books
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EUR 263,52
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Condizione: New. Print on Demand.
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Da: Biblios, frankfurt am main, HESSE, GermaniaBiblios
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EUR 266,62
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Condizione: New. PRINT ON DEMAND.
