9789811698262 - electronics production defects and analysis di thomas, oommen tharakan kuttiyil; gopalan, padma padmanabhan (13 risultati)
Electronics Production Defects and Analysis (Springer Tracts in Electrical and Electronics Engineering)
Kuttiyil Thomas, Oommen Tharakan; Gopalan, Padma Padmanabhan
Lingua: Inglese
Editore: Springer, 2023
Serie: Libro 1 di 17 - Springer Tracts in Electrical and Electronics Engineering
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Da: Books Puddle, New York, NY, U.S.A.Books Puddle
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EUR 142,19
EUR 3,47 spedizioneSpedito in U.S.A.Quantità: 4 disponibili
Condizione: New.
Lingua: Inglese
Editore: SPRINGER NP, 2022
Serie: Libro 1 di 17 - Springer Tracts in Electrical and Electronics Engineering
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- Edizione Internazionale
Da: UK BOOKS STORE, London, LONDO, Regno UnitoUK BOOKS STORE
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EUR 155,42
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Condizione: New Books. Brand New! Fast Delivery This is an International Edition and ship within 24-48 hours. Deliver by FedEx and Dhl, & Aramex, UPS, & USPS and we do accept APO and PO BOX Addresses. Order can be delivered worldwide within 6-10 days and we do have flat rate for up to 2LB. Extra shipping charges will be requeste…d if the Book weight is more than 5 LB. This Item May be shipped from India, United states & United Kingdom. Depending on your location and availability.
Lingua: Inglese
Editore: Springer Nature Singapore, 2023
Serie: Libro 1 di 17 - Springer Tracts in Electrical and Electronics Engineering
- Brossura
Da: Buchpark, Trebbin, GermaniaBuchpark
Contatta il venditoreVenditore con 5 stelleCondizione: Usato - Molto buono
EUR 56,79
EUR 105,00 spedizioneSpedito da Germania a U.S.A.Quantità: 1 disponibili
Condizione: Gut. Zustand: Gut | Sprache: Englisch | Produktart: Bücher | This book is a unique book capturing defects that are frequently encountered during various fabrication phases of electronic packages. These defects have been analyzed to their root cause and mitigation techniques and presented in the book. The book include…s 228 cases with more than 480 color and magnified images of the defects. These defects are covered under eight subheads, viz soldering defects, PCB defects, mounting defects, conformal coating and potting defects, EEE component defects, workmanship defects, defects due to usage of non-FFF components, and defects in CAD layout. The possible reasons for the occurrence of the defects and the methods/practices by which they can be eliminated/mitigated have also been discussed. The chapter "mounting defects" shows the correct approach in the adjacent photograph, so that the users can refer to the right procedures. The book is helpful to those who are involved in the production of electronics packages to familiarize them with the different cases shown carefully and revised frequently. Exposure to the different defects is useful to all who are working in fabrication and quality control to realize a zero-defect product sans much time and investment. The book is valuable for the technical community working for aerospace applications, industry partners in the realization of space programs, aerospace, and high-reliability institutions, various electronic fabrication agencies in the country, engineers and technicians taking up courses in high-reliability soldering and fabrication techniques, and the students.
Lingua: Inglese
Editore: Springer Nature Singapore, Springer Nature Singapore, 2023
Serie: Libro 1 di 17 - Springer Tracts in Electrical and Electronics Engineering
- Brossura
Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH
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EUR 109,94
EUR 61,45 spedizioneSpedito da Germania a U.S.A.Quantità: 1 disponibili
Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book is a unique book capturing defects that are frequently encountered during various fabrication phases of electronic packages. These defects have been analyzed to their root cause and mitigation techniques and presented in the book. The bo…ok includes 228 cases with more than 480 color and magnified images of the defects. These defects are covered under eight subheads, viz soldering defects, PCB defects, mounting defects, conformal coating and potting defects, EEE component defects, workmanship defects, defects due to usage of non-FFF components, and defects in CAD layout. The possible reasons for the occurrence of the defects and the methods/practices by which they can be eliminated/mitigated have also been discussed. The chapter 'mounting defects' shows the correct approach in the adjacent photograph, so that the users can refer to the right procedures. The book is helpful to those who are involved in the production of electronics packages to familiarize them with the different cases shown carefully and revised frequently. Exposure to the different defects is useful to all who are working in fabrication and quality control to realize a zero-defect product sans much time and investment. The book is valuable for the technical community working for aerospace applications, industry partners in the realization of space programs, aerospace, and high-reliability institutions, various electronic fabrication agencies in the country, engineers and technicians taking up courses in high-reliability soldering and fabrication techniques, and the students.
Lingua: Inglese
Editore: Springer Nature Singapore, 2023
Serie: Libro 1 di 17 - Springer Tracts in Electrical and Electronics Engineering
- Brossura
Da: Buchpark, Trebbin, GermaniaBuchpark
Contatta il venditoreVenditore con 5 stelleCondizione: Usato
EUR 71,90
EUR 105,00 spedizioneSpedito da Germania a U.S.A.Quantità: 10 disponibili
Condizione: Hervorragend. Zustand: Hervorragend | Sprache: Englisch | Produktart: Bücher | This book is a unique book capturing defects that are frequently encountered during various fabrication phases of electronic packages. These defects have been analyzed to their root cause and mitigation techniques and presented in the book…. The book includes 228 cases with more than 480 color and magnified images of the defects. These defects are covered under eight subheads, viz soldering defects, PCB defects, mounting defects, conformal coating and potting defects, EEE component defects, workmanship defects, defects due to usage of non-FFF components, and defects in CAD layout. The possible reasons for the occurrence of the defects and the methods/practices by which they can be eliminated/mitigated have also been discussed. The chapter "mounting defects" shows the correct approach in the adjacent photograph, so that the users can refer to the right procedures. The book is helpful to those who are involved in the production of electronics packages to familiarize them with the different cases shown carefully and revised frequently. Exposure to the different defects is useful to all who are working in fabrication and quality control to realize a zero-defect product sans much time and investment. The book is valuable for the technical community working for aerospace applications, industry partners in the realization of space programs, aerospace, and high-reliability institutions, various electronic fabrication agencies in the country, engineers and technicians taking up courses in high-reliability soldering and fabrication techniques, and the students.
Lingua: Inglese
Editore: Springer Nature Singapore, 2023
Serie: Libro 1 di 17 - Springer Tracts in Electrical and Electronics Engineering
- Brossura
Da: BUCHSERVICE / ANTIQUARIAT Lars Lutzer, Wahlstedt, GermaniaBUCHSERVICE / ANTIQUARIAT Lars Lutzer
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EUR 179,90
EUR 39,95 spedizioneSpedito da Germania a U.S.A.Quantità: 1 disponibili
Softcover. Condizione: gut. 2023. Electronics Production Defects and Analysis In deutscher Sprache. pages.
Lingua: Inglese
Editore: Springer, 2023
Serie: Libro 1 di 17 - Springer Tracts in Electrical and Electronics Engineering
- Brossura
- Print on Demand
Da: Brook Bookstore On Demand, Napoli, NA, ItaliaBrook Bookstore On Demand
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EUR 86,24
EUR 5,50 spedizioneSpedito da Italia a U.S.A.Quantità: Più di 20 disponibili
Condizione: new. Questo è un articolo print on demand.
Electronics Production Defects and Analysis
Kuttiyil Thomas, Oommen Tharakan; Gopalan, Padma Padmanabhan
Lingua: Inglese
Editore: Springer, 2023
Serie: Libro 1 di 17 - Springer Tracts in Electrical and Electronics Engineering
- Brossura
- Print on Demand
Da: Basi6 International, Irving, TX, U.S.A.Basi6 International
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EUR 99,54
Spedizione gratuitaSpedito in U.S.A.Quantità: Più di 20 disponibili
Condizione: Brand New. New. Delivery takes 20-25 days. Print on Demand.
Lingua: Inglese
Editore: Springer Nature Singapore, Springer Nature Singapore Apr 2023, 2023
Serie: Libro 1 di 17 - Springer Tracts in Electrical and Electronics Engineering
- Brossura
- Print on Demand
Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermaniaBuchWeltWeit Ludwig Meier e.K.
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EUR 106,99
EUR 23,00 spedizioneSpedito da Germania a U.S.A.Quantità: 2 disponibili
Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book is a unique book capturing defects that are frequently encountered during various fabrication phases of electronic packages. These defects have been analyzed to their root cause and mitigation techniques and presented in…the book. The book includes 228 cases with more than 480 color and magnified images of the defects. These defects are covered under eight subheads, viz soldering defects, PCB defects, mounting defects, conformal coating and potting defects, EEE component defects, workmanship defects, defects due to usage of non-FFF components, and defects in CAD layout. The possible reasons for the occurrence of the defects and the methods/practices by which they can be eliminated/mitigated have also been discussed. The chapter 'mounting defects' shows the correct approach in the adjacent photograph, so that the users can refer to the right procedures. The book is helpful to those who are involved in the production of electronics packages to familiarize them with the different cases shown carefully and revised frequently. Exposure to the different defects is useful to all who are working in fabrication and quality control to realize a zero-defect product sans much time and investment. The book is valuable for the technical community working for aerospace applications, industry partners in the realization of space programs, aerospace, and high-reliability institutions, various electronic fabrication agencies in the country, engineers and technicians taking up courses in high-reliability soldering and fabrication techniques, and the students. 164 pp. Englisch.
Lingua: Inglese
Editore: Springer, Berlin|Springer Nature Singapore|Springer, 2023
Serie: Libro 1 di 17 - Springer Tracts in Electrical and Electronics Engineering
- Brossura
- Print on Demand
Da: moluna, Greven, Germaniamoluna
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 89,99
EUR 48,99 spedizioneSpedito da Germania a U.S.A.Quantità: Più di 20 disponibili
Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book is a unique book capturing defects that are frequently encountered during various fabrication phases of electronic packages. These defects have been analyzed to their root cause and mitigation techniques an…d presented in the book. The book incl.
Electronics Production Defects and Analysis (Springer Tracts in Electrical and Electronics Engineering)
Kuttiyil Thomas, Oommen Tharakan; Gopalan, Padma Padmanabhan
Lingua: Inglese
Editore: Springer, 2023
Serie: Libro 1 di 17 - Springer Tracts in Electrical and Electronics Engineering
- Brossura
- Print on Demand
Da: Majestic Books, Hounslow, Regno UnitoMajestic Books
Contatta il venditoreVenditore con 4 stelleCondizione: Nuovo
EUR 147,22
EUR 7,58 spedizioneSpedito da Regno Unito a U.S.A.Quantità: 4 disponibili
Condizione: New. Print on Demand.
Electronics Production Defects and Analysis (Springer Tracts in Electrical and Electronics Engineering)
Kuttiyil Thomas, Oommen Tharakan; Gopalan, Padma Padmanabhan
Lingua: Inglese
Editore: Springer, 2023
Serie: Libro 1 di 17 - Springer Tracts in Electrical and Electronics Engineering
- Brossura
- Print on Demand
Da: Biblios, frankfurt am main, HESSE, GermaniaBiblios
Contatta il venditoreVenditore con 4 stelleCondizione: Nuovo
EUR 150,26
EUR 9,95 spedizioneSpedito da Germania a U.S.A.Quantità: 4 disponibili
Condizione: New. PRINT ON DEMAND.
Lingua: Inglese
Editore: Springer, Springer Apr 2023, 2023
Serie: Libro 1 di 17 - Springer Tracts in Electrical and Electronics Engineering
- Brossura
- Print on Demand
Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germaniabuchversandmimpf2000
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 106,99
EUR 60,00 spedizioneSpedito da Germania a U.S.A.Quantità: 1 disponibili
Taschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book is a unique book capturing defects that are frequently encountered during various fabrication phases of electronic packages. These defects have been analyzed to their root cause and mitigation techniques and presented in the…book. The book includes 228 cases with more than 480 color and magnified images of the defects. These defects are covered under eight subheads, viz soldering defects, PCB defects, mounting defects, conformal coating and potting defects, EEE component defects, workmanship defects, defects due to usage of non-FFF components, and defects in CAD layout. The possible reasons for the occurrence of the defects and the methods/practices by which they can be eliminated/mitigated have also been discussed. The chapter 'mounting defects' shows the correct approach in the adjacent photograph, so that the users can refer to the right procedures. The book is helpful to those who are involved in the production of electronics packages to familiarize them with the different cases shown carefully and revised frequently. Exposure to the different defects is useful to all who are working in fabrication and quality control to realize a zero-defect product sans much time and investment. The book is valuable for the technical community working for aerospace applications, industry partners in the realization of space programs, aerospace, and high-reliability institutions, various electronic fabrication agencies in the country, engineers and technicians taking up courses in high-reliability soldering and fabrication techniques, and the students.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 164 pp. Englisch.
