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Da: preigu, Osnabrück, Germania
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Aggiungi al carrelloTaschenbuch. Condizione: Neu. Thermal Reliability of Power Semiconductor Device in the Renewable Energy System | Xiong Du (u. a.) | Taschenbuch | xvi | Englisch | 2023 | Springer | EAN 9789811931345 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Da: AHA-BUCH GmbH, Einbeck, Germania
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Aggiungi al carrelloTaschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimental tests are presented to explain existing reliability improvement techniques. This book is a valuable reference for the students and researchers who pay attention to the thermal reliability design of power semiconductor device.
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Aggiungi al carrellopaperback. Condizione: New. NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
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Aggiungi al carrelloCondizione: new. Questo è un articolo print on demand.
Lingua: Inglese
Editore: Springer Nature Singapore Jul 2023, 2023
ISBN 10: 9811931348 ISBN 13: 9789811931345
Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germania
EUR 160,49
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Aggiungi al carrelloTaschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimental tests are presented to explain existing reliability improvement techniques. This book is a valuable reference for the students and researchers who pay attention to the thermal reliability design of power semiconductor device. 188 pp. Englisch.
Lingua: Inglese
Editore: Springer, Berlin|Springer Nature Singapore|Springer, 2023
ISBN 10: 9811931348 ISBN 13: 9789811931345
Da: moluna, Greven, Germania
EUR 136,16
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Aggiungi al carrelloCondizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimenta.
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EUR 201,78
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Aggiungi al carrelloCondizione: New. Print on Demand.
Lingua: Inglese
Editore: Springer, Springer Jul 2023, 2023
ISBN 10: 9811931348 ISBN 13: 9789811931345
Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germania
EUR 160,49
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Aggiungi al carrelloTaschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimental tests are presented to explain existing reliability improvement techniques. This book is a valuable reference for the students and researchers who pay attention to the thermal reliability design of power semiconductor device.Springer-Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 188 pp. Englisch.
Da: Biblios, Frankfurt am main, HESSE, Germania
EUR 220,77
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Aggiungi al carrelloCondizione: New. PRINT ON DEMAND.