ISBN: 9789819707669 - advances in micro-electronics, embedded systems and iot: proceedings of 8th international conference on microelectronics, electromagnetics and telecommunications (icmeet 2023): 1156 (8 risultati)
Advances in Micro-Electronics, Embedded Systems and IoT : Proceedings of 8th International Conference on Microelectronics, Electromagnetics and Telecommunications (ICMEET 2023)
Chakravarthy, V. V. S. S. S (EDT); Bhateja, Vikrant (EDT); Anguera, Jaume (EDT); Urooj, Shabana (EDT); Ghosh, Anumoy (EDT)
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Advances in Micro-Electronics, Embedded Systems and IoT : Proceedings of 8th International Conference on Microelectronics, Electromagnetics and Telecommunications (ICMEET 2023)
Chakravarthy, V. V. S. S. S (EDT); Bhateja, Vikrant (EDT); Anguera, Jaume (EDT); Urooj, Shabana (EDT); Ghosh, Anumoy (EDT)
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Buch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - The book discusses the latest developments and outlines future trends in the fields of microelectronics, electromagnetics, and telecommunication. It contains original research works presented at the International Conference on Microelectronics, Electromagnetics and Telecommunication (ICMEET 2023), organized by Department of Electronics and Communication Engineering, National Institute of Technology Mizoram, India, during 6-7 October 2023. The book is divided into two volumes, and it covers papers written by scientists, research scholars, and practitioners from leading universities, engineering colleges, and R&D institutes from all over the world and shares the latest breakthroughs in and promising solutions to the most important issues facing today's society.…
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Hardcover. Condizione: Brand New. 570 pages. 9.26x6.11x9.21 inches. In Stock.
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Condizione: new. Questo è un articolo print on demand.
Lingua: Inglese
Editore: Springer, Berlin|Springer Nature Singapore|Springer, 2024
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Da: moluna, Greven, Germaniamoluna
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Gebunden. Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. The book discusses the latest developments and outlines future trends in the fields of microelectronics, electromagnetics, and telecommunication. It contains original research works presented at the International Conference on Microelectronics, Electroma.…
Lingua: Inglese
Editore: Springer Nature Singapore, Springer Nature Singapore Mai 2024, 2024
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Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermaniaBuchWeltWeit Ludwig Meier e.K.
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Buch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The book discusses the latest developments and outlines future trends in the fields of microelectronics, electromagnetics, and telecommunication. It contains original research works presented at the International Conference on Microelectronics, Electromagnetics and Telecommunication (ICMEET 2023), organized by Department of Electronics and Communication Engineering, National Institute of Technology Mizoram, India, during 6-7 October 2023. The book is divided into two volumes, and it covers papers written by scientists, research scholars, and practitioners from leading universities, engineering colleges, and R&D institutes from all over the world and shares the latest breakthroughs in and promising solutions to the most important issues facing today's society. 572 pp. Englisch.…
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Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germaniabuchversandmimpf2000
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Buch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -The book discusses the latest developments and outlines future trends in the fields of microelectronics, electromagnetics, and telecommunication. It contains original research works presented at the International Conference on Microelectronics, Electromagnetics and Telecommunication (ICMEET 2023), organized by Department of Electronics and Communication Engineering, National Institute of Technology Mizoram, India, during 6¿7 October 2023. The book is divided into two volumes, and it covers papers written by scientists, research scholars, and practitioners from leading universities, engineering colleges, and R&D institutes from all over the world and shares the latest breakthroughs in and promising solutions to the most important issues facing today¿s society.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 572 pp. Englisch.…
