ISBN: 9798188991432 - microchips fabrications textbooks: fundamentals of semiconductor manufacturing: lithography, deposition, etching, and packaging (6 risultati)

Taschenbuch. Condizione: Neu. Neuware - Every integrated circuit begins as a silicon ingot and ends as a packaged device. Between those points lies a precisely controlled sequence of manufacturing steps, and understanding the science behind each one is what enables engineers to diagnose, optimise, and design semiconductor processes rather than simply follow procedures. Many semiconductor manufacturing resources either oversimplify the science or treat individual processes in isolation, leaving readers to assemble a complete understanding from multiple sources. This textbook provides a rigorous, single-volume guide to the entire IC fabrication process, combining physical principles, engineering practice, and fully worked numerical examples in one consistent reference. Inside this book you will: - Understand the physical and chemical principles behind every major fabrication process through clearly derived equations instead of memorised rules. - Apply quantitative methods using fully worked examples with complete unit tracking and step-by-step calculations. - Strengthen problem-solving skills through practice questions with fully explained solutions. - Follow the complete CMOS manufacturing flow, from silicon crystal growth and wafer preparation to transistors, interconnects, packaging, and final device assembly. - Learn the terminology, metrology, yield analysis, and statistical process control techniques used in modern semiconductor fabrication facilities. - Study the material at a depth suitable for upper-level undergraduate and first-year graduate engineering courses. Topics include crystal growth, wafer preparation, clean-room practices, photolithography, advanced patterning, physical and chemical vapour deposition, epitaxy, atomic layer deposition, ion implantation, rapid thermal processing, wet and plasma etching, chemical mechanical planarisation, copper metallisation, dual-damascene interconnects, CMOS process integration, yield modelling, defect analysis, metrology, statistical process control, and semiconductor packaging. Designed for upper-level undergraduate and graduate students in electrical engineering, materials science, and chemical engineering, this book also serves process engineers and fabrication technicians seeking a rigorous, equation-based foundation in semiconductor manufacturing. Open the first chapter and begin building the quantitative, process-level understanding required to master modern integrated circuit fabrication. …

PAP. Condizione: New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.

Paperback. Condizione: new. Paperback. Every integrated circuit begins as a silicon ingot and ends as a packaged device. Between those points lies a precisely controlled sequence of manufacturing steps, and understanding the science behind each one is what enables engineers to diagnose, optimise, and design semiconductor processes rather than simply follow procedures. Many semiconductor manufacturing resources either oversimplify the science or treat individual processes in isolation, leaving readers to assemble a complete understanding from multiple sources. This textbook provides a rigorous, single-volume guide to the entire IC fabrication process, combining physical principles, engineering practice, and fully worked numerical examples in one consistent reference. Inside this book you will: - Understand the physical and chemical principles behind every major fabrication process through clearly derived equations instead of memorised rules. - Apply quantitative methods using fully worked examples with complete unit tracking and step-by-step calculations. - Strengthen problem-solving skills through practice questions with fully explained solutions. - Follow the complete CMOS manufacturing flow, from silicon crystal growth and wafer preparation to transistors, interconnects, packaging, and final device assembly. - Learn the terminology, metrology, yield analysis, and statistical process control techniques used in modern semiconductor fabrication facilities. - Study the material at a depth suitable for upper-level undergraduate and first-year graduate engineering courses. Topics include crystal growth, wafer preparation, clean-room practices, photolithography, advanced patterning, physical and chemical vapour deposition, epitaxy, atomic layer deposition, ion implantation, rapid thermal processing, wet and plasma etching, chemical mechanical planarisation, copper metallisation, dual-damascene interconnects, CMOS process integration, yield modelling, defect analysis, metrology, statistical process control, and semiconductor packaging. Designed for upper-level undergraduate and graduate students in electrical engineering, materials science, and chemical engineering, this book also serves process engineers and fabrication technicians seeking a rigorous, equation-based foundation in semiconductor manufacturing. Open the first chapter and begin building the quantitative, process-level understanding required to master modern integrated circuit fabrication. This item is printed on demand. Shipping may be from multiple locations in the US or from the UK, depending on stock availability. …

Condizione: New. Print on Demand.

PAP. Condizione: New. New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.

Paperback. Condizione: new. Paperback. Every integrated circuit begins as a silicon ingot and ends as a packaged device. Between those points lies a precisely controlled sequence of manufacturing steps, and understanding the science behind each one is what enables engineers to diagnose, optimise, and design semiconductor processes rather than simply follow procedures. Many semiconductor manufacturing resources either oversimplify the science or treat individual processes in isolation, leaving readers to assemble a complete understanding from multiple sources. This textbook provides a rigorous, single-volume guide to the entire IC fabrication process, combining physical principles, engineering practice, and fully worked numerical examples in one consistent reference. Inside this book you will: - Understand the physical and chemical principles behind every major fabrication process through clearly derived equations instead of memorised rules. - Apply quantitative methods using fully worked examples with complete unit tracking and step-by-step calculations. - Strengthen problem-solving skills through practice questions with fully explained solutions. - Follow the complete CMOS manufacturing flow, from silicon crystal growth and wafer preparation to transistors, interconnects, packaging, and final device assembly. - Learn the terminology, metrology, yield analysis, and statistical process control techniques used in modern semiconductor fabrication facilities. - Study the material at a depth suitable for upper-level undergraduate and first-year graduate engineering courses. Topics include crystal growth, wafer preparation, clean-room practices, photolithography, advanced patterning, physical and chemical vapour deposition, epitaxy, atomic layer deposition, ion implantation, rapid thermal processing, wet and plasma etching, chemical mechanical planarisation, copper metallisation, dual-damascene interconnects, CMOS process integration, yield modelling, defect analysis, metrology, statistical process control, and semiconductor packaging. Designed for upper-level undergraduate and graduate students in electrical engineering, materials science, and chemical engineering, this book also serves process engineers and fabrication technicians seeking a rigorous, equation-based foundation in semiconductor manufacturing. Open the first chapter and begin building the quantitative, process-level understanding required to master modern integrated circuit fabrication. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability. …