Adhesion microelectronics (21 risultati)

Paperback. Condizione: As New. Ex-Company Library. Labels to front cover. Like New, light shelf wear. Year 2000. 164 pp.

HRD. Condizione: New. New Book. Shipped from UK. Established seller since 2000.

Condizione: New.

Condizione: New.

Condizione: New. This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Series: Adhesion and Adhesives: Fundamental and Applied Aspects. Num Pages: 368 pages, black & white illustrations, black & white line drawings, black & white tables, figures. BIC Classification: TDCB; TJF. Category: (P) Professional & Vocational. Dimension: 244 x 163 x 25. Weight in Grams: 636. . 2014. Hardback. . . . . …

Hardcover. Condizione: new. Hardcover. This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesionSurface (physical or chemical) characterization of materials as it pertains to adhesionSurface cleaning as it pertains to adhesionWays to improve adhesionUnraveling of interfacial interactions using an array of pertinent techniquesCharacterization of interfaces / interphasesPolymer-polymer adhesionMetal-polymer adhesion (metallized polymers)Polymer adhesion to various substratesAdhesion of thin filmsAdhesion of underfillsAdhesion of molding compoundsAdhesion of different dielectric materialsDelamination and reliability issues in packaged devicesInterface mechanics and crack propagationAdhesion measurement of thin films and coatings This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.…

Hardback. Condizione: New. This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesionSurface (physical or chemical) characterization of materials as it pertains to adhesionSurface cleaning as it pertains to adhesionWays to improve adhesionUnraveling of interfacial interactions using an array of pertinent techniquesCharacterization of interfaces / interphasesPolymer-polymer adhesionMetal-polymer adhesion  (metallized polymers)Polymer adhesion to various substratesAdhesion of thin filmsAdhesion of underfillsAdhesion of molding compoundsAdhesion of different dielectric materialsDelamination and reliability issues in packaged devicesInterface mechanics and crack propagationAdhesion measurement of thin films and coatings. …

Condizione: New. In English.

Condizione: New. Brand new! Please provide a physical shipping address.

Hardback. Condizione: New. This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesionSurface (physical or chemical) characterization of materials as it pertains to adhesionSurface cleaning as it pertains to adhesionWays to improve adhesionUnraveling of interfacial interactions using an array of pertinent techniquesCharacterization of interfaces / interphasesPolymer-polymer adhesionMetal-polymer adhesion  (metallized polymers)Polymer adhesion to various substratesAdhesion of thin filmsAdhesion of underfillsAdhesion of molding compoundsAdhesion of different dielectric materialsDelamination and reliability issues in packaged devicesInterface mechanics and crack propagationAdhesion measurement of thin films and coatings. …

Hardcover. Condizione: new. Hardcover. This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesionSurface (physical or chemical) characterization of materials as it pertains to adhesionSurface cleaning as it pertains to adhesionWays to improve adhesionUnraveling of interfacial interactions using an array of pertinent techniquesCharacterization of interfaces / interphasesPolymer-polymer adhesionMetal-polymer adhesion (metallized polymers)Polymer adhesion to various substratesAdhesion of thin filmsAdhesion of underfillsAdhesion of molding compoundsAdhesion of different dielectric materialsDelamination and reliability issues in packaged devicesInterface mechanics and crack propagationAdhesion measurement of thin films and coatings This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.…

Hardcover. Condizione: Brand New. 350 pages. 9.25x6.25x1.00 inches. In Stock.

Condizione: New. This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include* Various theories or mechanisms of adhesion* Surface (phys.

Condizione: New. This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Series: Adhesion and Adhesives: Fundamental and Applied Aspects. Num Pages: 368 pages, black & white illustrations, black & white line drawings, black & white tables, figures. BIC Classification: TDCB; TJF. Category: (P) Professional & Vocational. Dimension: 244 x 163 x 25. Weight in Grams: 636. . 2014. Hardback. . . . . Books ship from the US and Ireland. …

Hardback. Condizione: New. This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesionSurface (physical or chemical) characterization of materials as it pertains to adhesionSurface cleaning as it pertains to adhesionWays to improve adhesionUnraveling of interfacial interactions using an array of pertinent techniquesCharacterization of interfaces / interphasesPolymer-polymer adhesionMetal-polymer adhesion  (metallized polymers)Polymer adhesion to various substratesAdhesion of thin filmsAdhesion of underfillsAdhesion of molding compoundsAdhesion of different dielectric materialsDelamination and reliability issues in packaged devicesInterface mechanics and crack propagationAdhesion measurement of thin films and coatings. …

Buch. Condizione: Neu. Adhesion in Microelectronics | K L Mittal (u. a.) | Buch | Preface xiiiAcknowledgements xviPart 1: Adhesion: Fundamentals and Measurement1 Study of Molecular Bonding or Adhesion by Inelastic Electron Tunneling Spectroscopy | Englisch | 2014 | Wiley | EAN 9781118831335 | Verantwortliche Person für die EU: Libri GmbH, Europaallee 1, 36244 Bad Hersfeld, gpsr[at]libri[dot]de | Anbieter: preigu.…

Hardback. Condizione: New. This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesionSurface (physical or chemical) characterization of materials as it pertains to adhesionSurface cleaning as it pertains to adhesionWays to improve adhesionUnraveling of interfacial interactions using an array of pertinent techniquesCharacterization of interfaces / interphasesPolymer-polymer adhesionMetal-polymer adhesion  (metallized polymers)Polymer adhesion to various substratesAdhesion of thin filmsAdhesion of underfillsAdhesion of molding compoundsAdhesion of different dielectric materialsDelamination and reliability issues in packaged devicesInterface mechanics and crack propagationAdhesion measurement of thin films and coatings. …

Condizione: As New. Unread book in perfect condition.

Hardcover. Condizione: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Condizione: As New. Unread book in perfect condition.

Hardcover. Condizione: new. Hardcover. This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesionSurface (physical or chemical) characterization of materials as it pertains to adhesionSurface cleaning as it pertains to adhesionWays to improve adhesionUnraveling of interfacial interactions using an array of pertinent techniquesCharacterization of interfaces / interphasesPolymer-polymer adhesionMetal-polymer adhesion (metallized polymers)Polymer adhesion to various substratesAdhesion of thin filmsAdhesion of underfillsAdhesion of molding compoundsAdhesion of different dielectric materialsDelamination and reliability issues in packaged devicesInterface mechanics and crack propagationAdhesion measurement of thin films and coatings This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.…