Electromagnetic compatibility engineering (138 risultati)

Condizione: acceptable. Cover image may vary. Cover is worn. Item has staining and markings. Binding is split. Hardcover.

Hardcover. Condizione: Fair. No Jacket. Missing dust jacket; Readable copy. Pages may have considerable notes/highlighting. ~ ThriftBooks: Read More, Spend Less.

Hardcover. Condizione: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less.

Condizione: good. A copy that has been read, remains in good condition. All pages are intact, and the cover is intact. The spine and cover show signs of wear. Pages can include notes and highlighting and show signs of wear, and the copy can include "From the library of" labels or previous owner inscriptions. 100% GUARANTEE! Shipped with delivery confirmation, if you're not satisfied with purchase please return item! Ships via media mail.…

Condizione: Very Good. 563 pp., hardcover, previous owner's name to the front free endpaper, else very good. - If you are reading this, this item is actually (physically) in our stock and ready for shipment once ordered. We are not bookjackers. Buyer is responsible for any additional duties, taxes, or fees required by recipient's country. …

Hardcover. Condizione: Very Good. Book cover has light rubbing and is slightly cocked so that back cover doesn't lay fully flat - otherwise looks sharp and glossy. Tight binding, pages are clean and crisp. Overall a sharp copy with a clean sturdy interior.

Condizione: Fair. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. Clean from markings. In fair condition, suitable as a study copy. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,1000grams, ISBN:9780780311176.…

Hardcover. Condizione: COLLECTIBLE - NEAR FINE. No Jacket. First Edition, First Printing. Text/BRAND NEW. Linen boards/NF w/trace rubs to corner tips & lower spine edge. DJ/None. Textbook. Collection of research papers addressing intersystem electromagnetic compatibility regarding operating communications-electronics systems. 18 chapters are arranged into 7 parts: Part 1, Introduction; 2, Systems; 3, Signal Generation & Amplification; 4, Filters & Nonreciprocal Elements; 5, Signal Processing & Detection; 6, Antennas; and, 7, Intrasystem Electromagnetic Compatibility. Fine copy.…

Hardcover. Condizione: Very Good. 1st Edition. Very good pictorial covers, previous owner's name and phone number on the inside cover, otherwise unmarked.

Condizione: Poor. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. Book contains pen markings. In poor condition, suitable as a reading copy. No dust jacket. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,1350grams, ISBN:0471549274.…

Condizione: Poor. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In poor condition, suitable as a reading copy. No dust jacket. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,1350grams, ISBN:0471549274.…

Condizione: Good. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Ex-library, so some stamps and wear, but in good overall condition. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions.…

hardcover. Condizione: Very Good. Cover and edges may have some wear.

Hardcover. Condizione: Very Good. 2. CD or DVD included. It's a well-cared-for item that has seen limited use. The item may show minor signs of wear. All the text is legible, with all pages included. It may have slight markings and/or highlighting.

Condizione: acceptable. This book is in acceptable condition and may have highlighting and or writing throughout. The actual cover image may not match the stock photo, dust jacket may be damaged or missing. Book may show internal and or external wear on spine or cover and may be slightly skewed or have creased pages. This is a used book so codes may be invalid or accompanying media may be missing. May be an Ex library book with stickers and stamps.…

Condizione: acceptable. Used - Acceptable: All pages and the cover are intact, but shrink wrap, dust covers, or boxed set case may be missing. Pages may include limited notes, highlighting, or minor water damage but the text is readable. Item may be missing bundled media.

Condizione: Good. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Ex-library, so some stamps and wear, but in good overall condition. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions.…

PAP. Condizione: New. New Book. Shipped from UK. Established seller since 2000.

PAP. Condizione: New. New Book. Shipped from UK. Established seller since 2000.

Condizione: New.

PAP. Condizione: New. New Book. Shipped from UK. Established seller since 2000.

PAP. Condizione: New. New Book. Shipped from UK. Established seller since 2000.

PAP. Condizione: New. New Book. Shipped from UK. Established seller since 2000.

PAP. Condizione: New. New Book. Shipped from UK. Established seller since 2000.

Condizione: New. In English.

hardcover. Condizione: New. In shrink wrap. Looks like an interesting title.

hardcover. Condizione: New. In shrink wrap. Looks like an interesting title.

Soft cover. Condizione: New. Language:Chinese.Author:ZHAO YANG.Binding:Soft cover.Publisher:Mechanical Industry Press Pub. Date :2009-02-01.

paperback. Condizione: New. Language:Chinese.Paperback. Publisher: Electronic Industry.

Paperback. Condizione: new. Paperback. A design passes every simulation and every bench test, then fails a radiated-emissions scan two weeks before a certification deadline - and the engineer staring at the spectrum analyzer has no clear way to tell which of a dozen possible fixes will actually work. That moment is familiar to almost anyone who designs electronic hardware. Electromagnetic compatibility is rarely taught as a coherent discipline; most engineers assemble it in fragments, picking up a favorite fix here and a rule of thumb there, without connecting them to the physical mechanisms underneath. That gap is expensive: an interference problem that costs almost nothing to prevent at the schematic stage can cost weeks of redesign once it surfaces in a compliance chamber, and a product that quietly passes one category of testing can still fail in the field because its immunity margin was never engineered in. As new technologies such as wide-bandgap power devices enter mainstream design, engineers who rely on memorized precedents rather than transferable principles find it hardest to adapt. This handbook helps engineers build electromagnetic compatibility competency from first principles rather than folklore. Across eighteen chapters, it applies a single recurring model - source, path, and receptor - consistently from the smallest package-level parasitic through board design, platform integration, regulated-industry certification, and organization-wide compliance program management. Inside, you will: Practice classifying real interference scenarios using the source-path-receptor model, and evaluate which mitigation - at the source, along the path, or at the receiving circuit - is most cost-effective at each stage of a program.Apply differential-mode and common-mode analysis to cabling, filtering, grounding, and digital circuit radiation problems, using fully worked numerical examples with every unit tracked.Design and evaluate shielding enclosures, power distribution networks, and return-current paths using calculated absorption, reflection, and target-impedance budgets rather than rules of thumb.Evaluate wide-bandgap power converter designs for power-loop inductance and gate-drive layout trade-offs specific to faster-switching devices.Navigate the regulatory distinctions between commercial, automotive, aerospace, medical, and industrial electromagnetic compatibility requirements.Apply a structured diagnostic workflow to precompliance measurement data, choosing the right detector, antenna, and test setup for the failure in front of you.Move from individual technical mastery to running a documented, repeatable compliance program across a full product lifecycle.Key topics include regulatory standards families; cabling, grounding, and bonding; filtering, isolation, and passive components; shielding and enclosure design; return-current physics and power distribution networks; digital circuit radiation and conducted emissions; wide-bandgap power electronics; platform-level radio desense; device- and package-level design; signal and power integrity co-design; immunity to ESD, RF, transients, and surge; safety-critical and regulated-industry design; precompliance measurement; and EMC compliance program management.This handbook is written for practicing electrical, electronics, hardware, and power-electronics engineers; EMC and compliance specialists responsible for precompliance testing and regulatory submissions; engineers in automotive, aerospace, medical, and industrial contexts; engineering managers running a compliance program; and advanced students seeking a structured, example-driven course of study. Get your copy and discover a structured approach to the questions, challenges, and opportunities explored throughout the book. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.…