foreign electronic communication textbook (45 risultati)

paperback. Condizione: New. Paperback. Pub Date: 2005 Pages: 180 Language: Chinese in Publisher: Electronic Industry Press book Digital signal processing - computer-based methods (second edition). a book supporting laboratory manual. covering the signal and signal processing. time domain discrete-time signals and systems. discrete-time signal transform domain. transform domain LTI discrete-time systems. continuous-time digital signal processing. digital filter structure and design. DSP algorithm implementation . error a.

paperback. Condizione: New. Paperback. Pub Date: 2006 Pages: 503 Publisher: Electronic Industry Press book maintain this characteristic of the basic content of the first edition focuses on digital logic design concepts and methods. and combined with the development of digital design techniques. update hardware technology. adding the latest knowledge of programmable logic technology. also introduces the design of electronic design automation tools. through the use of the currently dominant in the design of digital logic .

paperback. Condizione: New. Paperback. Pub Date: 2005. Pages: 447 in Publisher: Publishing House of Electronics Industry. written by University of Arizona professor Palais optical fiber communication is a prestigious book. The book describes the main devices used in optical fiber communication. optical fiber transmission principle. the optical signal generator and receiver. the optical fiber communication system design and the optical fiber communications network. Chapter 1 is an introduction to the book to introduce op.

paperback. Condizione: New. Paperback. Pub the Date: November 2005 Pages: 371 in Publisher: Electronic Industry Publishing House wireless communication system simulation: C + + utility model of engaging in large-scale modern communication system simulation work more than 20 years of experience sum up. the use of C + + language system to explain the principles and methods of the various modules in complex wireless communication system simulation. and given the large number of practical model source code. Of wireless comm.

paperback. Condizione: New. Paperback. Pub Date: 2006 Pages: 366 Publisher: Publishing House of Electronics Industry (5) described the new device: After the improvement can more fully take advantage of a new fiber optical bandwidth of the optical fiber communication; non-zero dispersion shifted fiber; small size factor; graded-index polymer optical fiber Raman amplifier; erbium-doped waveguide amplifier; arrayed waveguide grating; electro-absorption modulator; optical micro-electro-mechanical devices; dispersion compens.

paperback. Condizione: New. Paperback. Pub Date: 2005 Pages: 448 Language: Chinese in Publisher: Electronic Industry Press book depth introduction to the advanced semiconductor memory technology and the development of comprehensive exposition. covering new technological achievements in recent years. Book explain the static random access memory technology. high performance of dynamic random access memory. the structure and design of the dedicated DRAM. advanced non-volatile memory design and technology. the design and ap.

paperback. Condizione: New. Paperback. Pub Date: 2006. Pages: 448 in Publisher: Electronic Industry Press book is a new wireless communications. The book has distinctive features in the material choice. content organization. and teaches ways. The book mainly for the physical layer of the wireless network of radio communication infrastructure and modern wireless communication theory and technology. A notable feature of the book is the modulation. coding. spreading and diversity techniques with frequency division multiple.

paperback. Condizione: New. Paperback. Pub Date: 2006 Pages: 503 Publisher: Electronic Industry Press book maintain this characteristic of the basic content of the first edition focuses on digital logic design concepts and methods. and combined with the development of digital design techniques. update hardware technology. adding the latest knowledge of programmable logic technology. also introduces the design of electronic design automation tools. through the use of the currently dominant in the design of digital logic .

paperback. Condizione: New. Paperback. Pub Date: 2005 Pages: 710 Language: Chinese in Publisher: Electronic Industry Press book explained by a large number of complete instances the use VerilogHDL VLSI design structured modeling method. key steps and design verification method and other useful content. The book is divided into 11 chapters. covering modeling. structural balance. functional verification. fault simulation. and logic synthesis. and other key issues. as well as after the comprehensive design validation. timi.

paperback. Condizione: New. Paperback. Pub Date: 2005 Pages: 644 in Publisher: Electronic Industry Press book is a classic textbook analog integrated circuit design courses of departure from the forefront of CMOS technology. combined with a wealth of engineering and teaching experience. CMOS analog circuit design principles and techniques as well as easily ignored given a detailed exposition on the hierarchical design method. The book is divided into 10 chapters. describes the background knowledge of the analog integrat.

paperback. Condizione: New. Paperback. Pub Date: 2008 07 Pages: 608 Language: English in Publisher: Publishing House of Electronics Industry. a system introduced the authoritative textbooks digital circuit design. aimed at the Church of readers the basic concepts of digital design. The book is divided into 12 chapters. covering digital system and binary numbers. Boolean algebra. logic gates. gate-level minimization. combinational logic. synchronous sequential logic. registers and counters. memory and programmable logic.

paperback. Condizione: New. Paperback. Pub Date: 2007 02 Pages: 586 in Publisher: Electronic Industry Press book comprehensively discusses signal integrity problems. Focuses on signal integrity and physical design Introduction. bandwidth. inductance and the real meaning of the characteristic impedance. resistance. capacitance. inductance and impedance analysis to solve signal integrity issues four technical means physical interconnect design on signal integrity mathematical derivation behind the solutions. as well as im.

paperback. Condizione: Very Good. Paperback. Pub Date: 2009 Pages: 531 Language: Chinese in Publisher: Publishing House of Electronics Industry foreign electronics and communication materials: mixed-signal IC test and measurement detailed analog and mixed-signal integrated circuits for test and measurement methods . is the first monograph about a comprehensive and systematic introduction to mixed-signal integrated circuit testing. The book is based on the author's many years of scientific research and teaching practice. combi.

paperback. Condizione: New. Paperback. Pub Date: 2006 Pages: 1002 in Publisher: Publishing House of Electronics Industry digital communication (English version) (4th edition) is a photocopy of the large format version of the classic textbook. Digital communication (English version) (4) is a classic textbook in the field of digital communication. detailed review of probability theory and stochastic processes. digital and analog source coding. digital modulation signal and narrowband signal system characteristics. additiv.

paperback. Condizione: New. Paperback. Pub Date: 2011 Pages: 652 Language: English in Publisher: Publishing House of Electronics Industry foreign electronic and communication textbook series: Optical Fiber Communication (4th Edition) (English) a systematic introduction to all aspects of optical fiber communication knowledge. The book is 14 chapters and content covering optical fiber transmission principle and transmission characteristics. semiconductor light sources and photodetectors works and work characteristics. dig.

paperback. Condizione: New. Paperback. Pub Date: 2006 Pages: 817 Language: English in Publisher: Publishing House of Electronics Industry Silicon VLSI technology: theory. practice and model is the United States Department of Electrical Engineering. Stanford University. Silicon VLSI manufacturing process course materials. the course is a four-year undergraduate and first year graduate students in the Department of Electrical Engineering and Microelectronics professional specialized courses. Silicon VLSI technology: theor.

Soft cover. Condizione: New. Language:Chinese.Author: MEI John G.Proakis ZHU ZHANG LI JUN ZHENG BAO YU YI.Binding:.Publisher:Publishing House of Electronics Industry.

Paperback. Condizione: Good. Satisfaction 100% guaranteed.

paperback. Condizione: New. Paperback. Pub Date: 2005 Pages: 284 Publisher: Publishing House of Electronics Industry VHDL digital circuit design tutorial is divided into three basic components. the first detailed background knowledge of VHDL language. basic grammatical structure and VHDL code preparation methods; then introduced the VHDL circuit structure and use of the cell library. as well as how to add a new design to existing or newly created cell libraries. in order to carry out the split. sharing and reuse of code.

paperback. Condizione: New. Paperback. Pub Date: 2010 07 Pages: 318 in Publisher: Electronic Industry Press book is divided into multiple courses segments typically encountered in the common skills and technology. engineering design taught digital IC design specific design debugging method. Including digital IC design process encountered many typical examples (counter type structure. data storage and Verilog array. the state machine. FIFO. etc.) as well as the typical problems (up - down delay. serial-to-parallel conver.

paperback. Condizione: New. Paperback. Pub Date: 2007 Pages: 590 in Publisher: Publishing House of Electronics Industry abroad Electronics and Communication textbook series: the analog electronic technologies (English) an excellent analog electronic circuits Basic English original materials (Ninth Edition) adapted version includes the basis of the semiconductor device. the diode and its application circuit. transistors. and the basic principle of the FET amplifier and frequency response. the power amplifier circuit. mul.

paperback. Condizione: New. Ship out in 2 business day, And Fast shipping, Free Tracking number will be provided after the shipment.Paperback. Pub Date :2012-07-01 Pages: 258 Publisher: Electronic Industry Press book edge kc11.21 basic information about the title: foreign electronic communication textbook series: modern integrated circuit semiconductor devices List Price: 49.00 yuan Author: Hu Zhengming published Social: Electronic Industry Press Publication Date: July 1. 2012 ISBN: 9.787.121.176.623 words: Page: 258 Edition: 1st Edition Binding: Paperback: Weight: 399 g Editor's Choice foreign electronic communication textbook series: modern integrated circuit semiconductor devices as colleges Microelectronics undergraduate course textbook or reference books. are also available for reference in the relevant work in the field of professional and technical personnel. Executive Summary abroad Electronics and Communication textbook series: modern integrated circuit semiconductor devices system introduced in modern integrated circuit semiconductor devices. is to go into the details of the physical mechanisms of semiconductor devices and works with the practice of combining a textbook. Foreign electronic communications textbook series: modern integrated circuit semiconductor devices is not the usual form of classification of electronic devices. optoelectronic devices. microwave devices. but stressed that the common semiconductor devices. focusing on the PN junction. metal-semiconductor contact bipolar transistors and MOSFET. and several other basic device structure and theory. on this basis. the introduction of other important semiconductor devices such as solar cells. LED. a diode laser. CCD and CMOS image sensors. HEMT devices and memory or the like. Contents Chapter 1 in the semiconductor crystal structure of the electrons and holes 1.1 silicon 1.2 electrons and holes into the key model 1.3 band models 1.4 semiconductor. insulator and conductor 1.5 electron and a hole 1.7 1.6 density of states of thermal equilibrium and Fermi function of 1.8 electron and hole concentration 1.9n and the general theory of p 1.10 1.11 Chapter Summary Exercises References Readings Chapter 2. the movement of electrons and holes with the thermal motion of the composite 2.1 2.2 Drift 2.3 diffusion current in extreme temperature carrier concentration Einstein relation between the relationship between 2.5D and 2.4 band diagram with V. 2.6 electron hole recombination 2.7 hot 2.8 quasi-equilibrium and quasi-Fermi level 2.9 Chapter Summary Exercises References Chapter 3 Readings device manufacturing technology the 3.1 device manufacturing Introduction 3.2 silicon oxidation transfer lithography 3.4 graphics 3.3 - 3.5 doped with 3.6 dopant diffusion is etched thin film deposition 3.8 interconnect 3.7 - 3.10 Chapter Summary backend process 3.9 test. assembly and qualification - a device for producing instance Problem Reference Document Readings Chapter 4 of the PN junction and the metal-semiconductor junction 1 part: the 4.2 depletion layer of the theoretical basis of the PN junction 4.1PN Results model 4.3 4.5 Results of the reverse biased PN junction 4.4 capacitor voltage characteristic - quasi-equilibrium boundary condition 4.7 current continuity equation 4.8 is biased PN junction excess carrier 4.9PN I V characteristics of the junction diode breakdown 4.6 forward bias carrier injection 4.10 charge storage diode 4.11 Part 2: PN junction of the small-signal model optoelectronic devices 4.12 solar battery 4.13 4.14 diode laser 4.15 photodiode Part 3: metal semiconductor junction 4.16Schottky barrier of light-emitting diode and solid-state lighting 4.17 Thermal Emission the theory 4.18Schottky diode 4.19Schottky 4.20 diode applications quantum mechanical tunneling 4.21 ohmic contact 4.22 This chapter Summary Exercises References Readings Chapter 5 MOS capacitor 5.1 flatband conditions for peace with accumulated 5.3 surface depleted strong inversion 5.4 threshold voltage of 5.5 higher tha.

paperback. Condizione: New. Paperback. Pub Date: 2006 Pages: 444 in Publisher: Electronic Industry Press micro processing integrated circuits. micro-sensors. photonic crystals. ink jet printers. solar cells and flat panel displays. the key technology. micro-system more complex. but its basic micro-structure and micro-processing technology is fairly simple. Foreign electronic communications textbook series: Introduction to Micro Machining describes how many applications the ordinary micro-processing method to manufacture.

paperback. Condizione: New. Paperback. Pub Date: 2010 Pages: 553 in Publisher: Publishing House of Electronics Industry. RF Circuit Design: Theory and Applications (2nd edition) (English) starting from the low-frequency circuit theory to RF and microwave circuit theory of evolution basis to discuss the low frequency circuit theory and combined with the volatility characteristics of the high-frequency voltage. current methods of analysis and design of RF and microwave systems - microwave equivalent circuit method. so rea.

paperback. Condizione: New. Introduction to RF and microwave engineering practice foreign electronic communication textbook series.

paperback. Condizione: New. Paperback. Pub Date: 2008 07 Pages: 239 Language: Chinese in Publisher: Electronic Industry Press book focuses on the wireless local area network (WLAN). wireless personal area network (WPAN) and wireless metropolitan area network (WMAN) wireless communication the key technology of the network. The book is divided into seven sections. 16 chapters. namely: wireless network structure. the main discussion of the logical structure and physical structure; wireless communication. summed up the basi.

paperback. Condizione: New. Paperback. Pub Date: 2005 07 Pages: 254 Publisher: Electronic Industry Press This is a latest comprehensive textbook about digital waveform generation. digital filter design. digital signal processing tools. and technology applications. The book consists of nine chapters and seven appendices. the first eight chapters were introduced DSP development system. the DSK input and output. C6x series processor architecture and instruction set. finite impulse response filters. infinite impulse respons.

paperback. Condizione: New. Paperback. Pub Date: 2008 Pages: 436 Language: Chinese in Publisher: China Machine Press for LabVIEW. step-by-step introduction of the thrust of the virtual instrument design. as well as the principle of the graphical programming language. methods and application technology. The book is divided into 11 chapters. otherwise Appendix A. B. and introduces the basics of LabVIEW virtual instrument composed. MathScript technology. editing and debugging of virtual instruments. the importance of reusi.

paperback. Condizione: New. Ship out in 2 business day, And Fast shipping, Free Tracking number will be provided after the shipment.Paperback. Pub Date :2012-08-01 Pages: 596 Publisher: the basic information title of the Electronic Industry Press book edge kc11.21: foreign electronic communication textbook series: CMOS RF integrated circuit design (2nd edition) Original Price: 78.00 yuan Author: Thomas H. Lee (Thomas H.Lee) Publisher: Electronic Industry Press Publication Date: August 1. 2012 ISBN: 9787121175954 words: Pages: 596 Edition: 1st Edition Binding: Paperback: Weight: 939 g Editor's Choice foreign electronic communications textbook series: CMOS RF IC Design (2nd Edition) known as radio frequency integrated circuit design guide book. Abroad Electronics and Communication textbook series: CMOS radio frequency integrated circuit design (2nd edition) is the ideal textbook for undergraduates and graduate students studying the course of the RF electronics aspects. engineering and technical personnel engaged in radio frequency integrated circuit design or other areas a very useful reference book. The executive summary of foreign electronic communication textbook series: CMOS radio frequency integrated circuit design (2nd edition) full-depth introduction to the design gigahertz (GHz) CMOS RF ICs details. Briefly describes the principle of radio history of the development and wireless systems; reviews integrated circuit device characteristics of MOS device physics and model on the basis of the RLC series and parallel oscillation network and distributed system features. introduced Smith chart. S-parameters and bandwidth estimation techniques; highlights the modern high-frequency broadband amplifier design method. discussed in detail the key RF circuit module. including the low noise amplifier (LNA). a reference voltage source. mixer. RF power amplifier. oscillator and frequency synthesizer devices. Depth discussion of the various types of noise and noise characteristics of RF ICs (including the phase noise of the oscillator circuit). Abroad Electronics and Communication textbook series: CMOS radio frequency integrated circuit design (2nd edition) Finally. examine the overall structure of the transceiver and look forward to the future development prospects of the RF circuit. The book includes a number of very practical circuit diagrams and other illustrations. together with many instructive exercises. Table of Contents Chapter 1 radio history intermittent Review Electronics 1.4 1.3 1.1 Introduction 1.2 Maxwell and Hertz and inventor of the vacuum before the vacuum tube of the birth of 1.5 armstrong and regenerative amplifier / detector / oscillator 1.6 Other radio circuit 1.7 armstrong and super-regenerative electric dance 1.8 oleglosev and a solid-state circuit amplifier 1.9 Conclusion 1.10 Appendix a: vacuum tube base 1.11 Appendix b: what is who invented radio Chapter 2 Wireless Communication Theory Overview 2.1 wireless system fragments Brief History 2.2 non-cellular wireless communications applications 2.3 Shannon theorem . modulation 2.4 spread 2.5 Conclusion 2.6 Appendix: Chapter 3 of the other characteristics of the wireless systems Passive rlc networks 3.1 Introduction 3.2 parallel rlc rlc resonant circuit in series 3.3 network 3.4 rlc resonant network 3.5 as an impedance converter the rlc Network 3.6 instance 4.1 Introduction Chapter 4 passive characteristics of the integrated circuit components the interconnection line: 4.2 RF case skin effect 4.3 resistance 4.4 capacitive 4.5 4.6 Transformer 4.7 high frequency interconnect inductance 4.8 Summary 4.9 Appendix: capacitance equations are summarized in Chapter 5 5.7 Other effects of the mos mos the device Physical Review 5.1 Introduction 5.2 brief history 5.3 FET: a little story 5.4 mosfet physical: long channel approximation 5.5 weak inversion (subthreshold region) work 5.6 semisulcatus case of device physics 5.8 Summary 5.9 Appendix a 5.10 Appendix b: 0.5mlevel the spice model: level-3spice model.

paperback. Condizione: New. Paperback. Pub Date: November 2009 Pages: 367 Language: Chinese in Publisher: Publishing House of Electronics Industry digital VLSI chip design: Cadence and Synopsys CAD Tools. describes how to use the Cadence and Synopsys CAD tools to the actual design of digital VLSI chips . Readers through digital VLSI chip design: Cadence and Synopsys CAD tools can gradually learn these CAD tools and digital integrated circuit chip design can be manufactured using these software. Digital VLSI chip design:.