Da: BennettBooksLtd, San Diego, NV, U.S.A.
hardcover. Condizione: New. In shrink wrap. Looks like an interesting title!
EUR 159,40
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
Condizione: New.
Da: Lucky's Textbooks, Dallas, TX, U.S.A.
EUR 159,65
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
Da: GreatBookPricesUK, Woodford Green, Regno Unito
EUR 159,15
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 163,16
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. In.
Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 163,16
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. In.
EUR 73,11
Quantità: 1 disponibili
Aggiungi al carrelloCondizione: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher.
EUR 73,11
Quantità: 1 disponibili
Aggiungi al carrelloCondizione: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher.
Condizione: New. pp. 468.
Condizione: New. pp. vii + 453.
EUR 141,90
Quantità: 5 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. Interconnect-Centric Design for Advanced SOC and NOC | Jari Nurmi (u. a.) | Taschenbuch | viii | Englisch | 2010 | Springer | EAN 9781441954428 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
EUR 178,14
Quantità: Più di 20 disponibili
Aggiungi al carrelloGebunden. Condizione: New. In Interconnect-centric Design for Advanced SoC and NoC, we have tried to create a comprehensive understanding about on-chip interconnect characteristics, design methodologies, layered views on different abstraction levels and finally about.
EUR 166,62
Quantità: 1 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - In Interconnect-centric Design for Advanced SoC and NoC, we have tried to create a comprehensive understanding about on-chip interconnect characteristics, design methodologies, layered views on different abstraction levels and finally about applying the interconnect-centric design in system-on-chip design. Traditionally, on-chip communication design has been done using rather ad-hoc and informal approaches that fail to meet some of the challenges posed by next-generation SOC designs, such as performance and throughput, power and energy, reliability, predictability, synchronization, and management of concurrency. To address these challenges, it is critical to take a global view of the communication problem, and decompose it along lines that make it more tractable. We believe that a layered approach similar to that defined by the communication networks community should also be used for on-chip communication design. The design issues are handled on physical and circuit layer, logic and architecture layer, and from system design methodology and tools point of view. Formal communication modeling and refinement is used to bridge the communication layers, and network-centric modeling of multiprocessor on-chip networks and socket-based design will serve the development of platforms for SoC and NoC integration. Interconnect-centric Design for Advanced SoC and NoC is concluded by two application examples: interconnect and memory organization in SoCs for advanced set-top boxes and TV, and a case study in NoC platform design for more generic applications.
EUR 236,73
Quantità: 2 disponibili
Aggiungi al carrelloPaperback. Condizione: Brand New. 453 pages. 9.00x6.00x1.05 inches. In Stock.
EUR 243,76
Quantità: 1 disponibili
Aggiungi al carrelloPaperback. Condizione: Like New. Like New. book.
Da: GreatBookPricesUK, Woodford Green, Regno Unito
EUR 266,02
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: As New. Unread book in perfect condition.
Da: Mispah books, Redhill, SURRE, Regno Unito
EUR 256,66
Quantità: 1 disponibili
Aggiungi al carrelloHardcover. Condizione: Like New. Like New. book.
Condizione: As New. Unread book in perfect condition.
EUR 247,94
Quantità: 2 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. Neuware - In Interconnect-centric Design for Advanced SoC and NoC, we have tried to create a comprehensive understanding about on-chip interconnect characteristics, design methodologies, layered views on different abstraction levels and finally about applying the interconnect-centric design in system-on-chip design. Traditionally, on-chip communication design has been done using rather ad-hoc and informal approaches that fail to meet some of the challenges posed by next-generation SOC designs, such as performance and throughput, power and energy, reliability, predictability, synchronization, and management of concurrency. To address these challenges, it is critical to take a global view of the communication problem, and decompose it along lines that make it more tractable. We believe that a layered approach similar to that defined by the communication networks community should also be used for on-chip communication design. The design issues are handled on physical and circuit layer, logic and architecture layer, and from system design methodology and tools point of view. Formal communication modeling and refinement is used to bridge the communication layers, and network-centric modeling of multiprocessor on-chip networks and socket-based design will serve the development of platforms for SoC and NoC integration. Interconnect-centric Design for Advanced SoC and NoC is concluded by two application examples: interconnect and memory organization in SoCs for advanced set-top boxes and TV, and a case study in NoC platform design for more generic applications.
Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germania
EUR 160,49
Quantità: 2 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -In Interconnect-centric Design for Advanced SoC and NoC, we have tried to create a comprehensive understanding about on-chip interconnect characteristics, design methodologies, layered views on different abstraction levels and finally about applying the interconnect-centric design in system-on-chip design. Traditionally, on-chip communication design has been done using rather ad-hoc and informal approaches that fail to meet some of the challenges posed by next-generation SOC designs, such as performance and throughput, power and energy, reliability, predictability, synchronization, and management of concurrency. To address these challenges, it is critical to take a global view of the communication problem, and decompose it along lines that make it more tractable. We believe that a layered approach similar to that defined by the communication networks community should also be used for on-chip communication design. The design issues are handled on physical and circuit layer, logic and architecture layer, and from system design methodology and tools point of view. Formal communication modeling and refinement is used to bridge the communication layers, and network-centric modeling of multiprocessor on-chip networks and socket-based design will serve the development of platforms for SoC and NoC integration. Interconnect-centric Design for Advanced SoC and NoC is concluded by two application examples: interconnect and memory organization in SoCs for advanced set-top boxes and TV, and a case study in NoC platform design for more generic applications. 462 pp. Englisch.
Da: moluna, Greven, Germania
EUR 136,16
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. In Interconnect-centric Design for Advanced SoC and NoC, we have tried to create a comprehensive understanding about on-chip interconnect characteristics, design methodologies, layered views on different abstraction levels and finally about.
Editore: Springer US, Springer US Nov 2010, 2010
ISBN 10: 1441954422 ISBN 13: 9781441954428
Lingua: Inglese
Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germania
EUR 160,49
Quantità: 1 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -In Interconnect-centric Design for Advanced SoC and NoC, we have tried to create a comprehensive understanding about on-chip interconnect characteristics, design methodologies, layered views on different abstraction levels and finally about applying the interconnect-centric design in system-on-chip design. Traditionally, on-chip communication design has been done using rather ad-hoc and informal approaches that fail to meet some of the challenges posed by next-generation SOC designs, such as performance and throughput, power and energy, reliability, predictability, synchronization, and management of concurrency. To address these challenges, it is critical to take a global view of the communication problem, and decompose it along lines that make it more tractable. We believe that a layered approach similar to that defined by the communication networks community should also be used for on-chip communication design. The design issues are handled on physical and circuit layer, logic and architecture layer, and from system design methodology and tools point of view. Formal communication modeling and refinement is used to bridge the communication layers, and network-centric modeling of multiprocessor on-chip networks and socket-based design will serve the development of platforms for SoC and NoC integration. Interconnect-centric Design for Advanced SoC and NoC is concluded by two application examples: interconnect and memory organization in SoCs for advanced set-top boxes and TV, and a case study in NoC platform design for more generic applications.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 462 pp. Englisch.
Da: Majestic Books, Hounslow, Regno Unito
EUR 223,02
Quantità: 4 disponibili
Aggiungi al carrelloCondizione: New. Print on Demand pp. 468 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam.
Da: Majestic Books, Hounslow, Regno Unito
EUR 226,96
Quantità: 4 disponibili
Aggiungi al carrelloCondizione: New. Print on Demand pp. vii + 453.
Da: Biblios, Frankfurt am main, HESSE, Germania
EUR 222,03
Quantità: 4 disponibili
Aggiungi al carrelloCondizione: New. PRINT ON DEMAND pp. 468.
Da: Biblios, Frankfurt am main, HESSE, Germania
EUR 225,99
Quantità: 4 disponibili
Aggiungi al carrelloCondizione: New. PRINT ON DEMAND pp. vii + 453.