Layout optimization vlsi design (30 risultati)
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Da: Basi6 International, Irving, TX, U.S.A.Basi6 International
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Layout Optimization in VLSI Design (Network Theory and Applications, 8)
Bing Lu [Editor]; Ding-Zhu Du [Editor]; Sapatnekar, S. [Editor];
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hardcover. Condizione: New. In shrink wrap. Looks like an interesting title.
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Da: Ria Christie Collections, Uxbridge, Regno UnitoRia Christie Collections
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Da: California Books, Miami, FL, U.S.A.California Books
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Da: California Books, Miami, FL, U.S.A.California Books
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Da: GreatBookPricesUK, Woodford Green, Regno UnitoGreatBookPricesUK
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Da: moluna, Greven, Germaniamoluna
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Da: moluna, Greven, Germaniamoluna
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Da: Books Puddle, New York, NY, U.S.A.Books Puddle
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Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH
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Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - Introduction The exponential scaling of feature sizes in semiconductor technologies has side-effects on layout optimization, related to effects such as inter connect delay, noise and crosstalk, signal integrity, parasitics effects, and power dissi…pation, that invalidate the assumptions that form the basis of previous design methodologies and tools. This book is intended to sample the most important, contemporary, and advanced layout opti mization problems emerging with the advent of very deep submicron technologies in semiconductor processing. We hope that it will stimulate more people to perform research that leads to advances in the design and development of more efficient, effective, and elegant algorithms and design tools. Organization of the Book The book is organized as follows. A multi-stage simulated annealing algorithm that integrates floorplanning and interconnect planning is pre sented in Chapter 1. To reduce the run time, different interconnect plan ning approaches are applied in different ranges of temperatures. Chapter 2 introduces a new design methodology - the interconnect-centric design methodology and its centerpiece, interconnect planning, which consists of physical hierarchy generation, floorplanning with interconnect planning, and interconnect architecture planning. Chapter 3 investigates a net-cut minimization based placement tool, Dragon, which integrates the state of the art partitioning and placement techniques.
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Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH
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Buch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - Introduction The exponential scaling of feature sizes in semiconductor technologies has side-effects on layout optimization, related to effects such as inter connect delay, noise and crosstalk, signal integrity, parasitics effects, and power dissipation,… that invalidate the assumptions that form the basis of previous design methodologies and tools. This book is intended to sample the most important, contemporary, and advanced layout opti mization problems emerging with the advent of very deep submicron technologies in semiconductor processing. We hope that it will stimulate more people to perform research that leads to advances in the design and development of more efficient, effective, and elegant algorithms and design tools. Organization of the Book The book is organized as follows. A multi-stage simulated annealing algorithm that integrates floorplanning and interconnect planning is pre sented in Chapter 1. To reduce the run time, different interconnect plan ning approaches are applied in different ranges of temperatures. Chapter 2 introduces a new design methodology - the interconnect-centric design methodology and its centerpiece, interconnect planning, which consists of physical hierarchy generation, floorplanning with interconnect planning, and interconnect architecture planning. Chapter 3 investigates a net-cut minimization based placement tool, Dragon, which integrates the state of the art partitioning and placement techniques.
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Da: Revaluation Books, Exeter, Regno UnitoRevaluation Books
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Paperback. Condizione: Brand New. 300 pages. 9.00x6.00x0.68 inches. In Stock.
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Da: Mispah books, Redhill, SURRE, Regno UnitoMispah books
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Paperback. Condizione: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
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Da: Brook Bookstore On Demand, Napoli, NA, ItaliaBrook Bookstore On Demand
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Condizione: new. Questo è un articolo print on demand.
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Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermaniaBuchWeltWeit Ludwig Meier e.K.
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Buch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Introduction The exponential scaling of feature sizes in semiconductor technologies has side-effects on layout optimization, related to effects such as inter connect delay, noise and crosstalk, signal integrity, parasitics effects, and po…wer dissipation, that invalidate the assumptions that form the basis of previous design methodologies and tools. This book is intended to sample the most important, contemporary, and advanced layout opti mization problems emerging with the advent of very deep submicron technologies in semiconductor processing. We hope that it will stimulate more people to perform research that leads to advances in the design and development of more efficient, effective, and elegant algorithms and design tools. Organization of the Book The book is organized as follows. A multi-stage simulated annealing algorithm that integrates floorplanning and interconnect planning is pre sented in Chapter 1. To reduce the run time, different interconnect plan ning approaches are applied in different ranges of temperatures. Chapter 2 introduces a new design methodology - the interconnect-centric design methodology and its centerpiece, interconnect planning, which consists of physical hierarchy generation, floorplanning with interconnect planning, and interconnect architecture planning. Chapter 3 investigates a net-cut minimization based placement tool, Dragon, which integrates the state of the art partitioning and placement techniques. 300 pp. Englisch.
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Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermaniaBuchWeltWeit Ludwig Meier e.K.
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Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Introduction The exponential scaling of feature sizes in semiconductor technologies has side-effects on layout optimization, related to effects such as inter connect delay, noise and crosstalk, signal integrity, parasitics effects,… and power dissipation, that invalidate the assumptions that form the basis of previous design methodologies and tools. This book is intended to sample the most important, contemporary, and advanced layout opti mization problems emerging with the advent of very deep submicron technologies in semiconductor processing. We hope that it will stimulate more people to perform research that leads to advances in the design and development of more efficient, effective, and elegant algorithms and design tools. Organization of the Book The book is organized as follows. A multi-stage simulated annealing algorithm that integrates floorplanning and interconnect planning is pre sented in Chapter 1. To reduce the run time, different interconnect plan ning approaches are applied in different ranges of temperatures. Chapter 2 introduces a new design methodology - the interconnect-centric design methodology and its centerpiece, interconnect planning, which consists of physical hierarchy generation, floorplanning with interconnect planning, and interconnect architecture planning. Chapter 3 investigates a net-cut minimization based placement tool, Dragon, which integrates the state of the art partitioning and placement techniques. 300 pp. Englisch.
Altre immagini- Rilegato
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Da: preigu, Osnabrück, Germaniapreigu
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Buch. Condizione: Neu. Layout Optimization in VLSI Design | Bing Lu (u. a.) | Buch | viii | Englisch | 2001 | Springer US | EAN 9781402000898 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand.
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Da: preigu, Osnabrück, Germaniapreigu
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Taschenbuch. Condizione: Neu. Layout Optimization in VLSI Design | Bing Lu (u. a.) | Taschenbuch | viii | Englisch | 2010 | Springer US | EAN 9781441952066 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand.
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Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germaniabuchversandmimpf2000
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Buch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Introduction The exponential scaling of feature sizes in semiconductor technologies has side-effects on layout optimization, related to effects such as inter connect delay, noise and crosstalk, signal integrity, parasitics effects, and power…dissipation, that invalidate the assumptions that form the basis of previous design methodologies and tools. This book is intended to sample the most important, contemporary, and advanced layout opti mization problems emerging with the advent of very deep submicron technologies in semiconductor processing. We hope that it will stimulate more people to perform research that leads to advances in the design and development of more efficient, effective, and elegant algorithms and design tools. Organization of the Book The book is organized as follows. A multi-stage simulated annealing algorithm that integrates floorplanning and interconnect planning is pre sented in Chapter 1. To reduce the run time, different interconnect plan ning approaches are applied in different ranges of temperatures. Chapter 2 introduces a new design methodology - the interconnect-centric design methodology and its centerpiece, interconnect planning, which consists of physical hierarchy generation, floorplanning with interconnect planning, and interconnect architecture planning. Chapter 3 investigates a net-cut minimization based placement tool, Dragon, which integrates the state of the art partitioning and placement techniques.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 300 pp. Englisch.
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Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germaniabuchversandmimpf2000
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Taschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Introduction The exponential scaling of feature sizes in semiconductor technologies has side-effects on layout optimization, related to effects such as inter connect delay, noise and crosstalk, signal integrity, parasitics effects, and… power dissipation, that invalidate the assumptions that form the basis of previous design methodologies and tools. This book is intended to sample the most important, contemporary, and advanced layout opti mization problems emerging with the advent of very deep submicron technologies in semiconductor processing. We hope that it will stimulate more people to perform research that leads to advances in the design and development of more efficient, effective, and elegant algorithms and design tools. Organization of the Book The book is organized as follows. A multi-stage simulated annealing algorithm that integrates floorplanning and interconnect planning is pre sented in Chapter 1. To reduce the run time, different interconnect plan ning approaches are applied in different ranges of temperatures. Chapter 2 introduces a new design methodology - the interconnect-centric design methodology and its centerpiece, interconnect planning, which consists of physical hierarchy generation, floorplanning with interconnect planning, and interconnect architecture planning. Chapter 3 investigates a net-cut minimization based placement tool, Dragon, which integrates the state of the art partitioning and placement techniques.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 300 pp. Englisch.
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Da: Majestic Books, Hounslow, Regno UnitoMajestic Books
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Condizione: New. Print on Demand pp. 300 49:B&W 6.14 x 9.21 in or 234 x 156 mm (Royal 8vo) Perfect Bound on White w/Gloss Lam.
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