Microelectronic packaging technology materials (4 risultati)

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Hardcover. Condizione: New. HardCover.Pub Date:2021-12-01 Pages:696 Language:English Publisher:Chemical Industry Press With the development of electronic packaging. electronic packaging has changed from the traditional four main functions (power system. signal distribution and transmission. heat dissipation and Mechanical protection) is expanded to six functions. namely. two new functions. DFX and system test. are added. Where DFX is designed for X. X includes: manufacturability. reliability. maintainability. cost. and .…

paperback. Condizione: New. Paperback. Pub Date: 2011 08 Pages: 137 Language: Chinese Publisher: Higher Education Press Vocational electronics manufacturing class professional planning materials: microelectronic packaging technology entire body of knowledge in microelectronic packaging technology is divided into two parts. Chapter 12. The first part of the process. and the second part is a typical package. Include the introduction. wafer dicing. die attach. chip interconnect. molding. other process. dual in-line package.…

paperback. Condizione: New. Language:Chinese.Microelectronic packaging technology higher education second five planning materials and electronic materials and application technology planning materials series.